JPWO2021261496A1 - - Google Patents

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Publication number
JPWO2021261496A1
JPWO2021261496A1 JP2022516276A JP2022516276A JPWO2021261496A1 JP WO2021261496 A1 JPWO2021261496 A1 JP WO2021261496A1 JP 2022516276 A JP2022516276 A JP 2022516276A JP 2022516276 A JP2022516276 A JP 2022516276A JP WO2021261496 A1 JPWO2021261496 A1 JP WO2021261496A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022516276A
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Japanese (ja)
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JP7155455B2 (ja
JPWO2021261496A5 (https=
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Publication of JPWO2021261496A1 publication Critical patent/JPWO2021261496A1/ja
Publication of JPWO2021261496A5 publication Critical patent/JPWO2021261496A5/ja
Priority to JP2022161135A priority Critical patent/JP7628993B2/ja
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Publication of JP7155455B2 publication Critical patent/JP7155455B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G01S17/10—Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/484—Transmitters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0428—Electrical excitation ; Circuits therefor for applying pulses to the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06226—Modulation at ultra-high frequencies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Semiconductor Lasers (AREA)
JP2022516276A 2020-06-22 2021-06-22 Ｖｃｓｅｌモジュール Active JP7155455B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022161135A JP7628993B2 (ja) 2020-06-22 2022-10-05 Ｖｃｓｅｌモジュール

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020107020 2020-06-22
JP2020107020 2020-06-22
JP2021052423 2021-03-25
JP2021052423 2021-03-25
PCT/JP2021/023664 WO2021261496A1 (ja) 2020-06-22 2021-06-22 Ｖｃｓｅｌモジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022161135A Division JP7628993B2 (ja) 2020-06-22 2022-10-05 Ｖｃｓｅｌモジュール

Publications (3)

Publication Number Publication Date
JPWO2021261496A1 true JPWO2021261496A1 (https=) 2021-12-30
JPWO2021261496A5 JPWO2021261496A5 (https=) 2022-06-10
JP7155455B2 JP7155455B2 (ja) 2022-10-18

Family

ID=79281242

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JP2022161135A Active JP7628993B2 (ja) 2020-06-22 2022-10-05 Ｖｃｓｅｌモジュール

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Country Status (4)

Country Link
US (1) US20240243546A1 (https=)
JP (2) JP7155455B2 (https=)
CN (1) CN115943533A (https=)
WO (1) WO2021261496A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116316052A (zh) * 2023-03-22 2023-06-23 宁波飞芯电子科技有限公司 垂直腔面发射激光器、探测设备及探测系统

Citations (11)

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JPH06237016A (ja) * 1993-02-09 1994-08-23 Matsushita Electric Ind Co Ltd 光ファイバモジュールおよびその製造方法
JP2010531546A (ja) * 2007-06-27 2010-09-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光センサ・モジュール及びその製造方法
JP2012037276A (ja) * 2010-08-04 2012-02-23 Sharp Corp 光学式測距装置
WO2014017256A1 (ja) * 2012-07-24 2014-01-30 シャープ株式会社 光学式測距装置および電子機器
WO2018100082A1 (en) * 2016-11-30 2018-06-07 Sony Semiconductor Solutions Corporation Apparatus and method
US20180278011A1 (en) * 2017-03-23 2018-09-27 Infineon Technologies Ag Laser diode module
JP2019158693A (ja) * 2018-03-15 2019-09-19 株式会社リコー 受光装置、物体検出装置、距離測定装置、移動体装置、ノイズ計測方法、物体検出方法及び距離測定方法
US20200006271A1 (en) * 2018-07-02 2020-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. Structures for bonding a group iii-v device to a substrate
WO2020044817A1 (ja) * 2018-08-31 2020-03-05 ソニーセミコンダクタソリューションズ株式会社 光源装置、検出方法、センシングモジュール
WO2020054257A1 (ja) * 2018-09-11 2020-03-19 ソニーセミコンダクタソリューションズ株式会社 光源装置、センシングモジュール
US20200185875A1 (en) * 2018-12-06 2020-06-11 Finisar Corporation Optoelectronic assembly

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JPH06203403A (ja) * 1992-10-22 1994-07-22 Matsushita Electron Corp 半導体レーザ装置および光ピックアップ装置
JP3831631B2 (ja) * 2000-09-29 2006-10-11 三洋電機株式会社 受光素子及びそれを備える光半導体装置
JP2004031456A (ja) * 2002-06-21 2004-01-29 Fujitsu Ltd 光インタコネクション装置及びインタコネクションモジュール
WO2005104249A1 (ja) * 2004-04-21 2005-11-03 Matsushita Electric Industrial Co., Ltd. 発光素子駆動用半導体チップ、発光装置、及び照明装置
JP5034368B2 (ja) * 2006-08-17 2012-09-26 富士ゼロックス株式会社 高周波特性が改善された表面発光型半導体レーザ素子
JP2009008721A (ja) * 2007-06-26 2009-01-15 Fuji Xerox Co Ltd 光モジュール、光電気複合基板、光信号伝送装置及び画像形成装置
JP2009105240A (ja) * 2007-10-24 2009-05-14 Fuji Xerox Co Ltd 半導体発光装置
US8488921B2 (en) * 2010-07-16 2013-07-16 International Business Machines Corporation Packaged multicore fiber optical transceiver module
JP5952101B2 (ja) * 2012-06-20 2016-07-13 日本特殊陶業株式会社 光電気混載ユニット、素子搭載モジュール
JP6280002B2 (ja) * 2014-08-22 2018-02-14 浜松ホトニクス株式会社 測距方法及び測距装置
EP3764487A4 (en) * 2018-03-08 2021-12-01 Kyocera Corporation SUBSTRATE FOR THE ASSEMBLY OF A LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
JP2021114556A (ja) * 2020-01-20 2021-08-05 ソニーセミコンダクタソリューションズ株式会社 発光装置およびその製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06237016A (ja) * 1993-02-09 1994-08-23 Matsushita Electric Ind Co Ltd 光ファイバモジュールおよびその製造方法
JP2010531546A (ja) * 2007-06-27 2010-09-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光センサ・モジュール及びその製造方法
JP2012037276A (ja) * 2010-08-04 2012-02-23 Sharp Corp 光学式測距装置
WO2014017256A1 (ja) * 2012-07-24 2014-01-30 シャープ株式会社 光学式測距装置および電子機器
WO2018100082A1 (en) * 2016-11-30 2018-06-07 Sony Semiconductor Solutions Corporation Apparatus and method
US20180278011A1 (en) * 2017-03-23 2018-09-27 Infineon Technologies Ag Laser diode module
JP2019158693A (ja) * 2018-03-15 2019-09-19 株式会社リコー 受光装置、物体検出装置、距離測定装置、移動体装置、ノイズ計測方法、物体検出方法及び距離測定方法
US20200006271A1 (en) * 2018-07-02 2020-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. Structures for bonding a group iii-v device to a substrate
WO2020044817A1 (ja) * 2018-08-31 2020-03-05 ソニーセミコンダクタソリューションズ株式会社 光源装置、検出方法、センシングモジュール
WO2020054257A1 (ja) * 2018-09-11 2020-03-19 ソニーセミコンダクタソリューションズ株式会社 光源装置、センシングモジュール
US20200185875A1 (en) * 2018-12-06 2020-06-11 Finisar Corporation Optoelectronic assembly

Also Published As

Publication number Publication date
JP7628993B2 (ja) 2025-02-12
US20240243546A1 (en) 2024-07-18
JP7155455B2 (ja) 2022-10-18
CN115943533A (zh) 2023-04-07
JP2022179619A (ja) 2022-12-02
WO2021261496A1 (ja) 2021-12-30

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