JP7152593B2 - 転写フィルム、及び、パターン付き基板の製造方法 - Google Patents

転写フィルム、及び、パターン付き基板の製造方法 Download PDF

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Publication number
JP7152593B2
JP7152593B2 JP2021508259A JP2021508259A JP7152593B2 JP 7152593 B2 JP7152593 B2 JP 7152593B2 JP 2021508259 A JP2021508259 A JP 2021508259A JP 2021508259 A JP2021508259 A JP 2021508259A JP 7152593 B2 JP7152593 B2 JP 7152593B2
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Japan
Prior art keywords
resin layer
alkali
substrate
resin
transfer film
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Japanese (ja)
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JPWO2020195345A1 (ja
Inventor
英範 後藤
守正 佐藤
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Fujifilm Corp
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Fujifilm Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Decoration By Transfer Pictures (AREA)
JP2021508259A 2019-03-27 2020-02-18 転写フィルム、及び、パターン付き基板の製造方法 Active JP7152593B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019061577 2019-03-27
JP2019061577 2019-03-27
PCT/JP2020/006208 WO2020195345A1 (ja) 2019-03-27 2020-02-18 転写フィルム、及び、パターン付き基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2020195345A1 JPWO2020195345A1 (ja) 2021-11-25
JP7152593B2 true JP7152593B2 (ja) 2022-10-12

Family

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JP2021508259A Active JP7152593B2 (ja) 2019-03-27 2020-02-18 転写フィルム、及び、パターン付き基板の製造方法

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Country Link
JP (1) JP7152593B2 (zh)
CN (1) CN113631380B (zh)
WO (1) WO2020195345A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004020643A (ja) 2002-06-12 2004-01-22 Fuji Photo Film Co Ltd ドライフィルムレジスト及びプリント基板の製造方法
JP2005227397A (ja) 2004-02-10 2005-08-25 Fuji Photo Film Co Ltd 感光性転写シート、感光性積層体、画像パターン形成方法、及び配線パターン形成方法
JP2014178465A (ja) 2013-03-14 2014-09-25 Hitachi Chemical Co Ltd 配線の形成方法、導電パターン基板、タッチパネルセンサ及び感光性導電フィルム
JP2016188922A (ja) 2015-03-30 2016-11-04 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターン付き基材の製造方法、プリント配線板の製造方法及びタッチパネルの製造方法
WO2018105313A1 (ja) 2016-12-08 2018-06-14 富士フイルム株式会社 転写フィルム、電極保護膜、積層体、静電容量型入力装置、及び、タッチパネルの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6307036B2 (ja) * 2015-03-24 2018-04-04 富士フイルム株式会社 転写フィルム、静電容量型入力装置の電極用保護膜、積層体、積層体の製造方法および静電容量型入力装置
CN109154775A (zh) * 2016-05-31 2019-01-04 富士胶片株式会社 感光性树脂组合物、转印膜、图案的制造方法、装饰图案及触摸面板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004020643A (ja) 2002-06-12 2004-01-22 Fuji Photo Film Co Ltd ドライフィルムレジスト及びプリント基板の製造方法
JP2005227397A (ja) 2004-02-10 2005-08-25 Fuji Photo Film Co Ltd 感光性転写シート、感光性積層体、画像パターン形成方法、及び配線パターン形成方法
JP2014178465A (ja) 2013-03-14 2014-09-25 Hitachi Chemical Co Ltd 配線の形成方法、導電パターン基板、タッチパネルセンサ及び感光性導電フィルム
JP2016188922A (ja) 2015-03-30 2016-11-04 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターン付き基材の製造方法、プリント配線板の製造方法及びタッチパネルの製造方法
WO2018105313A1 (ja) 2016-12-08 2018-06-14 富士フイルム株式会社 転写フィルム、電極保護膜、積層体、静電容量型入力装置、及び、タッチパネルの製造方法

Also Published As

Publication number Publication date
WO2020195345A1 (ja) 2020-10-01
CN113631380A (zh) 2021-11-09
CN113631380B (zh) 2023-05-12
JPWO2020195345A1 (ja) 2021-11-25

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