JP7143966B2 - モジュール - Google Patents

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Publication number
JP7143966B2
JP7143966B2 JP2022522066A JP2022522066A JP7143966B2 JP 7143966 B2 JP7143966 B2 JP 7143966B2 JP 2022522066 A JP2022522066 A JP 2022522066A JP 2022522066 A JP2022522066 A JP 2022522066A JP 7143966 B2 JP7143966 B2 JP 7143966B2
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JP
Japan
Prior art keywords
hole
capacitor
hole conductor
anode plate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022522066A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021241325A1 (https=
JPWO2021241325A5 (https=
Inventor
慎士 大谷
章友 ▲高▼橋
貴昭 坂井
剛史 古川
達矢 北村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2021241325A1 publication Critical patent/JPWO2021241325A1/ja
Publication of JPWO2021241325A5 publication Critical patent/JPWO2021241325A5/ja
Priority to JP2022138201A priority Critical patent/JP7384251B2/ja
Application granted granted Critical
Publication of JP7143966B2 publication Critical patent/JP7143966B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/145—Applications of charge pumps; Boosted voltage circuits; Clamp circuits therefor
    • G11C5/146—Substrate bias generators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dc-Dc Converters (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Continuous-Control Power Sources That Use Transistors (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
JP2022522066A 2020-05-28 2021-05-18 モジュール Active JP7143966B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022138201A JP7384251B2 (ja) 2020-05-28 2022-08-31 モジュール

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020093536 2020-05-28
JP2020093536 2020-05-28
PCT/JP2021/018772 WO2021241325A1 (ja) 2020-05-28 2021-05-18 モジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022138201A Division JP7384251B2 (ja) 2020-05-28 2022-08-31 モジュール

Publications (3)

Publication Number Publication Date
JPWO2021241325A1 JPWO2021241325A1 (https=) 2021-12-02
JPWO2021241325A5 JPWO2021241325A5 (https=) 2022-07-28
JP7143966B2 true JP7143966B2 (ja) 2022-09-29

Family

ID=78744755

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022522066A Active JP7143966B2 (ja) 2020-05-28 2021-05-18 モジュール
JP2022138201A Active JP7384251B2 (ja) 2020-05-28 2022-08-31 モジュール

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022138201A Active JP7384251B2 (ja) 2020-05-28 2022-08-31 モジュール

Country Status (6)

Country Link
US (2) US12482732B2 (https=)
EP (1) EP4123673B1 (https=)
JP (2) JP7143966B2 (https=)
CN (2) CN114902363B (https=)
TW (1) TWI780668B (https=)
WO (1) WO2021241325A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024185587A1 (https=) * 2023-03-09 2024-09-12
JPWO2024185585A1 (https=) * 2023-03-09 2024-09-12

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220146500A (ko) * 2020-02-06 2022-11-01 사라스 마이크로 디바이스 인크. 적층 및 임베딩을 위한 평면 고밀도 알루미늄 커패시터
US12136615B2 (en) * 2021-11-30 2024-11-05 Qorvo Us, Inc. Electronic package with interposer between integrated circuit dies
CN114937603A (zh) * 2022-03-25 2022-08-23 珠海越亚半导体股份有限公司 具有滤波功能的导通基板、载板布线结构及其制作方法
CN119173972A (zh) * 2022-05-13 2024-12-20 株式会社村田制作所 电容器
WO2023238528A1 (ja) * 2022-06-09 2023-12-14 株式会社村田製作所 コンデンサアレイ
CN120752718A (zh) * 2023-03-10 2025-10-03 株式会社村田制作所 电容器元件
WO2024214424A1 (ja) * 2023-04-14 2024-10-17 株式会社村田製作所 コンデンサ素子
TWI885959B (zh) * 2023-07-28 2025-06-01 日商村田製作所股份有限公司 內建電容器之基板
WO2025069676A1 (ja) * 2023-09-29 2025-04-03 株式会社村田製作所 コンデンサ素子
US12191346B1 (en) * 2024-05-17 2025-01-07 Saras Micro Devices, Inc. Selective area metal process for improved metallurgical bonding of aluminum to copper for integrated passive devices in a semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183548A (ja) 2003-12-17 2005-07-07 Fujikura Ltd 基板及びその製造方法
JP2007173439A (ja) 2005-12-21 2007-07-05 Matsushita Electric Ind Co Ltd コンデンサ内蔵基板
JP2008078301A (ja) 2006-09-20 2008-04-03 Fujitsu Ltd キャパシタ内蔵型配線基板およびその製造方法
WO2019130746A1 (ja) 2017-12-27 2019-07-04 株式会社村田製作所 半導体複合装置およびそれに用いられるパッケージ基板

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JP2004281750A (ja) 2003-03-17 2004-10-07 Nippon Chemicon Corp 固体電解コンデンサアレイ
US8264846B2 (en) * 2006-12-14 2012-09-11 Intel Corporation Ceramic package substrate with recessed device
US8058960B2 (en) * 2007-03-27 2011-11-15 Alpha And Omega Semiconductor Incorporated Chip scale power converter package having an inductor substrate
KR100861619B1 (ko) 2007-05-07 2008-10-07 삼성전기주식회사 방열 인쇄회로기판 및 그 제조방법
US8161609B2 (en) * 2008-05-21 2012-04-24 Intel Corporation Methods of fabricating an array capacitor
CN102379037B (zh) * 2009-03-30 2015-08-19 高通股份有限公司 使用顶部后钝化技术和底部结构技术的集成电路芯片
WO2011021411A1 (ja) * 2009-08-21 2011-02-24 株式会社村田製作所 Ｅｓｄ保護デバイス
US20110050334A1 (en) 2009-09-02 2011-03-03 Qualcomm Incorporated Integrated Voltage Regulator with Embedded Passive Device(s)
JP5585426B2 (ja) 2010-12-07 2014-09-10 Ｔｄｋ株式会社 配線板、電子部品内蔵基板、配線板の製造方法及び電子部品内蔵基板の製造方法
WO2014050112A1 (ja) * 2012-09-28 2014-04-03 三洋電機株式会社 固体電解コンデンサ及びその製造方法
US9954267B2 (en) * 2015-12-28 2018-04-24 Qualcomm Incorporated Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
CN109804446B (zh) * 2016-10-06 2021-05-07 株式会社村田制作所 固体电解电容器
JP7151764B2 (ja) * 2018-06-11 2022-10-12 株式会社村田製作所 コンデンサアレイ、複合電子部品、コンデンサアレイの製造方法、及び、複合電子部品の製造方法
US11302619B2 (en) * 2019-10-01 2022-04-12 Advanced Semiconductor Engineering, Inc. Device structure and method for manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183548A (ja) 2003-12-17 2005-07-07 Fujikura Ltd 基板及びその製造方法
JP2007173439A (ja) 2005-12-21 2007-07-05 Matsushita Electric Ind Co Ltd コンデンサ内蔵基板
JP2008078301A (ja) 2006-09-20 2008-04-03 Fujitsu Ltd キャパシタ内蔵型配線基板およびその製造方法
WO2019130746A1 (ja) 2017-12-27 2019-07-04 株式会社村田製作所 半導体複合装置およびそれに用いられるパッケージ基板

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024185587A1 (https=) * 2023-03-09 2024-09-12
JPWO2024185585A1 (https=) * 2023-03-09 2024-09-12
WO2024185585A1 (ja) * 2023-03-09 2024-09-12 株式会社村田製作所 コンデンサ内蔵基板
WO2024185587A1 (ja) * 2023-03-09 2024-09-12 株式会社村田製作所 コンデンサ内蔵基板
JP7816633B2 (ja) 2023-03-09 2026-02-18 株式会社村田製作所 コンデンサ内蔵基板
JP7816563B2 (ja) 2023-03-09 2026-02-18 株式会社村田製作所 コンデンサ内蔵基板

Also Published As

Publication number Publication date
TWI780668B (zh) 2022-10-11
US20220278035A1 (en) 2022-09-01
JP2022172255A (ja) 2022-11-15
JPWO2021241325A1 (https=) 2021-12-02
JP7384251B2 (ja) 2023-11-21
WO2021241325A1 (ja) 2021-12-02
CN119012906A (zh) 2024-11-22
CN114902363A (zh) 2022-08-12
EP4123673B1 (en) 2025-07-30
TW202205608A (zh) 2022-02-01
EP4123673A1 (en) 2023-01-25
US20260053021A1 (en) 2026-02-19
CN114902363B (zh) 2024-08-20
US12482732B2 (en) 2025-11-25
EP4123673A4 (en) 2024-07-03

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