JPWO2024185587A1 - - Google Patents

Info

Publication number
JPWO2024185587A1
JPWO2024185587A1 JP2025505245A JP2025505245A JPWO2024185587A1 JP WO2024185587 A1 JPWO2024185587 A1 JP WO2024185587A1 JP 2025505245 A JP2025505245 A JP 2025505245A JP 2025505245 A JP2025505245 A JP 2025505245A JP WO2024185587 A1 JPWO2024185587 A1 JP WO2024185587A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025505245A
Other languages
Japanese (ja)
Other versions
JP7816633B2 (ja
JPWO2024185587A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024185587A1 publication Critical patent/JPWO2024185587A1/ja
Publication of JPWO2024185587A5 publication Critical patent/JPWO2024185587A5/ja
Application granted granted Critical
Publication of JP7816633B2 publication Critical patent/JP7816633B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2025505245A 2023-03-09 2024-02-27 コンデンサ内蔵基板 Active JP7816633B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023036656 2023-03-09
JP2023036656 2023-03-09
PCT/JP2024/007041 WO2024185587A1 (ja) 2023-03-09 2024-02-27 コンデンサ内蔵基板

Publications (3)

Publication Number Publication Date
JPWO2024185587A1 true JPWO2024185587A1 (https=) 2024-09-12
JPWO2024185587A5 JPWO2024185587A5 (https=) 2025-04-22
JP7816633B2 JP7816633B2 (ja) 2026-02-18

Family

ID=92674860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025505245A Active JP7816633B2 (ja) 2023-03-09 2024-02-27 コンデンサ内蔵基板

Country Status (4)

Country Link
US (1) US20250174405A1 (https=)
JP (1) JP7816633B2 (https=)
CN (1) CN119631582A (https=)
WO (1) WO2024185587A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026074931A1 (ja) * 2024-10-03 2026-04-09 株式会社村田製作所 金属層埋込基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021369A (ja) * 2008-07-10 2010-01-28 Ngk Spark Plug Co Ltd 部品内蔵配線基板及びその製造方法
JP7143966B2 (ja) * 2020-05-28 2022-09-29 株式会社村田製作所 モジュール
WO2023021881A1 (ja) * 2021-08-18 2023-02-23 株式会社村田製作所 コンデンサ素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021369A (ja) * 2008-07-10 2010-01-28 Ngk Spark Plug Co Ltd 部品内蔵配線基板及びその製造方法
JP7143966B2 (ja) * 2020-05-28 2022-09-29 株式会社村田製作所 モジュール
WO2023021881A1 (ja) * 2021-08-18 2023-02-23 株式会社村田製作所 コンデンサ素子

Also Published As

Publication number Publication date
JP7816633B2 (ja) 2026-02-18
US20250174405A1 (en) 2025-05-29
CN119631582A (zh) 2025-03-14
WO2024185587A1 (ja) 2024-09-12

Similar Documents

Publication Publication Date Title
JPWO2024185587A1 (https=)
CL2026000107A1 (es) Estimuladores de defensa de plantas
JPWO2024185585A1 (https=)
BR102023009641A2 (https=)
BR102023008688A2 (https=)
BY13164U (https=)
CN307047154S (https=)
BY13163U (https=)
CN307049845S (https=)
BY13162U (https=)
BY13165U (https=)
CN307049673S (https=)
CN307049482S (https=)
CN307049392S (https=)
CN307048236S (https=)
CN307048226S (https=)
CN307047596S (https=)
CN307047430S (https=)
BY13176U (https=)
BY13160U (https=)
BY23963C1 (https=)
CN307046955S (https=)
CN307046336S (https=)
CN307046183S (https=)
BY13161U (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241015

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241015

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260106

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260119

R150 Certificate of patent or registration of utility model

Ref document number: 7816633

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150