JP7816633B2 - コンデンサ内蔵基板 - Google Patents

コンデンサ内蔵基板

Info

Publication number
JP7816633B2
JP7816633B2 JP2025505245A JP2025505245A JP7816633B2 JP 7816633 B2 JP7816633 B2 JP 7816633B2 JP 2025505245 A JP2025505245 A JP 2025505245A JP 2025505245 A JP2025505245 A JP 2025505245A JP 7816633 B2 JP7816633 B2 JP 7816633B2
Authority
JP
Japan
Prior art keywords
capacitor
layer
sealing
conductor
sealing portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025505245A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024185587A1 (https=
JPWO2024185587A5 (https=
Inventor
修平 山田
貴昭 坂井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2024185587A1 publication Critical patent/JPWO2024185587A1/ja
Publication of JPWO2024185587A5 publication Critical patent/JPWO2024185587A5/ja
Application granted granted Critical
Publication of JP7816633B2 publication Critical patent/JP7816633B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2025505245A 2023-03-09 2024-02-27 コンデンサ内蔵基板 Active JP7816633B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023036656 2023-03-09
JP2023036656 2023-03-09
PCT/JP2024/007041 WO2024185587A1 (ja) 2023-03-09 2024-02-27 コンデンサ内蔵基板

Publications (3)

Publication Number Publication Date
JPWO2024185587A1 JPWO2024185587A1 (https=) 2024-09-12
JPWO2024185587A5 JPWO2024185587A5 (https=) 2025-04-22
JP7816633B2 true JP7816633B2 (ja) 2026-02-18

Family

ID=92674860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025505245A Active JP7816633B2 (ja) 2023-03-09 2024-02-27 コンデンサ内蔵基板

Country Status (4)

Country Link
US (1) US20250174405A1 (https=)
JP (1) JP7816633B2 (https=)
CN (1) CN119631582A (https=)
WO (1) WO2024185587A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026074931A1 (ja) * 2024-10-03 2026-04-09 株式会社村田製作所 金属層埋込基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021369A (ja) 2008-07-10 2010-01-28 Ngk Spark Plug Co Ltd 部品内蔵配線基板及びその製造方法
JP7143966B2 (ja) 2020-05-28 2022-09-29 株式会社村田製作所 モジュール
WO2023021881A1 (ja) 2021-08-18 2023-02-23 株式会社村田製作所 コンデンサ素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010021369A (ja) 2008-07-10 2010-01-28 Ngk Spark Plug Co Ltd 部品内蔵配線基板及びその製造方法
JP7143966B2 (ja) 2020-05-28 2022-09-29 株式会社村田製作所 モジュール
WO2023021881A1 (ja) 2021-08-18 2023-02-23 株式会社村田製作所 コンデンサ素子

Also Published As

Publication number Publication date
JPWO2024185587A1 (https=) 2024-09-12
US20250174405A1 (en) 2025-05-29
CN119631582A (zh) 2025-03-14
WO2024185587A1 (ja) 2024-09-12

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