CN114902363B - 模块 - Google Patents

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Publication number
CN114902363B
CN114902363B CN202180007730.2A CN202180007730A CN114902363B CN 114902363 B CN114902363 B CN 114902363B CN 202180007730 A CN202180007730 A CN 202180007730A CN 114902363 B CN114902363 B CN 114902363B
Authority
CN
China
Prior art keywords
capacitor
anode plate
via conductor
layer
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180007730.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN114902363A (zh
Inventor
大谷慎士
高桥章友
坂井贵昭
古川刚史
北村达矢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202411004780.7A priority Critical patent/CN119012906A/zh
Publication of CN114902363A publication Critical patent/CN114902363A/zh
Application granted granted Critical
Publication of CN114902363B publication Critical patent/CN114902363B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/145—Applications of charge pumps; Boosted voltage circuits; Clamp circuits therefor
    • G11C5/146—Substrate bias generators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dc-Dc Converters (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Continuous-Control Power Sources That Use Transistors (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
CN202180007730.2A 2020-05-28 2021-05-18 模块 Active CN114902363B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202411004780.7A CN119012906A (zh) 2020-05-28 2021-05-18 模块

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020093536 2020-05-28
JP2020-093536 2020-05-28
PCT/JP2021/018772 WO2021241325A1 (ja) 2020-05-28 2021-05-18 モジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202411004780.7A Division CN119012906A (zh) 2020-05-28 2021-05-18 模块

Publications (2)

Publication Number Publication Date
CN114902363A CN114902363A (zh) 2022-08-12
CN114902363B true CN114902363B (zh) 2024-08-20

Family

ID=78744755

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202180007730.2A Active CN114902363B (zh) 2020-05-28 2021-05-18 模块
CN202411004780.7A Pending CN119012906A (zh) 2020-05-28 2021-05-18 模块

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202411004780.7A Pending CN119012906A (zh) 2020-05-28 2021-05-18 模块

Country Status (6)

Country Link
US (2) US12482732B2 (https=)
EP (1) EP4123673B1 (https=)
JP (2) JP7143966B2 (https=)
CN (2) CN114902363B (https=)
TW (1) TWI780668B (https=)
WO (1) WO2021241325A1 (https=)

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KR20220146500A (ko) * 2020-02-06 2022-11-01 사라스 마이크로 디바이스 인크. 적층 및 임베딩을 위한 평면 고밀도 알루미늄 커패시터
US12136615B2 (en) * 2021-11-30 2024-11-05 Qorvo Us, Inc. Electronic package with interposer between integrated circuit dies
CN114937603A (zh) * 2022-03-25 2022-08-23 珠海越亚半导体股份有限公司 具有滤波功能的导通基板、载板布线结构及其制作方法
CN119173972A (zh) * 2022-05-13 2024-12-20 株式会社村田制作所 电容器
WO2023238528A1 (ja) * 2022-06-09 2023-12-14 株式会社村田製作所 コンデンサアレイ
WO2024185587A1 (ja) * 2023-03-09 2024-09-12 株式会社村田製作所 コンデンサ内蔵基板
JP7816563B2 (ja) * 2023-03-09 2026-02-18 株式会社村田製作所 コンデンサ内蔵基板
CN120752718A (zh) * 2023-03-10 2025-10-03 株式会社村田制作所 电容器元件
WO2024214424A1 (ja) * 2023-04-14 2024-10-17 株式会社村田製作所 コンデンサ素子
TWI885959B (zh) * 2023-07-28 2025-06-01 日商村田製作所股份有限公司 內建電容器之基板
WO2025069676A1 (ja) * 2023-09-29 2025-04-03 株式会社村田製作所 コンデンサ素子
US12191346B1 (en) * 2024-05-17 2025-01-07 Saras Micro Devices, Inc. Selective area metal process for improved metallurgical bonding of aluminum to copper for integrated passive devices in a semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183548A (ja) * 2003-12-17 2005-07-07 Fujikura Ltd 基板及びその製造方法
JP2007173439A (ja) * 2005-12-21 2007-07-05 Matsushita Electric Ind Co Ltd コンデンサ内蔵基板
WO2019130746A1 (ja) * 2017-12-27 2019-07-04 株式会社村田製作所 半導体複合装置およびそれに用いられるパッケージ基板

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JP2004281750A (ja) 2003-03-17 2004-10-07 Nippon Chemicon Corp 固体電解コンデンサアレイ
JP5374814B2 (ja) * 2006-09-20 2013-12-25 富士通株式会社 キャパシタ内蔵型配線基板およびその製造方法
US8264846B2 (en) * 2006-12-14 2012-09-11 Intel Corporation Ceramic package substrate with recessed device
US8058960B2 (en) * 2007-03-27 2011-11-15 Alpha And Omega Semiconductor Incorporated Chip scale power converter package having an inductor substrate
KR100861619B1 (ko) 2007-05-07 2008-10-07 삼성전기주식회사 방열 인쇄회로기판 및 그 제조방법
US8161609B2 (en) * 2008-05-21 2012-04-24 Intel Corporation Methods of fabricating an array capacitor
CN102379037B (zh) * 2009-03-30 2015-08-19 高通股份有限公司 使用顶部后钝化技术和底部结构技术的集成电路芯片
WO2011021411A1 (ja) * 2009-08-21 2011-02-24 株式会社村田製作所 Ｅｓｄ保護デバイス
US20110050334A1 (en) 2009-09-02 2011-03-03 Qualcomm Incorporated Integrated Voltage Regulator with Embedded Passive Device(s)
JP5585426B2 (ja) 2010-12-07 2014-09-10 Ｔｄｋ株式会社 配線板、電子部品内蔵基板、配線板の製造方法及び電子部品内蔵基板の製造方法
WO2014050112A1 (ja) * 2012-09-28 2014-04-03 三洋電機株式会社 固体電解コンデンサ及びその製造方法
US9954267B2 (en) * 2015-12-28 2018-04-24 Qualcomm Incorporated Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
CN109804446B (zh) * 2016-10-06 2021-05-07 株式会社村田制作所 固体电解电容器
JP7151764B2 (ja) * 2018-06-11 2022-10-12 株式会社村田製作所 コンデンサアレイ、複合電子部品、コンデンサアレイの製造方法、及び、複合電子部品の製造方法
US11302619B2 (en) * 2019-10-01 2022-04-12 Advanced Semiconductor Engineering, Inc. Device structure and method for manufacturing the same

Patent Citations (3)

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JP2005183548A (ja) * 2003-12-17 2005-07-07 Fujikura Ltd 基板及びその製造方法
JP2007173439A (ja) * 2005-12-21 2007-07-05 Matsushita Electric Ind Co Ltd コンデンサ内蔵基板
WO2019130746A1 (ja) * 2017-12-27 2019-07-04 株式会社村田製作所 半導体複合装置およびそれに用いられるパッケージ基板

Also Published As

Publication number Publication date
TWI780668B (zh) 2022-10-11
JP7143966B2 (ja) 2022-09-29
US20220278035A1 (en) 2022-09-01
JP2022172255A (ja) 2022-11-15
JPWO2021241325A1 (https=) 2021-12-02
JP7384251B2 (ja) 2023-11-21
WO2021241325A1 (ja) 2021-12-02
CN119012906A (zh) 2024-11-22
CN114902363A (zh) 2022-08-12
EP4123673B1 (en) 2025-07-30
TW202205608A (zh) 2022-02-01
EP4123673A1 (en) 2023-01-25
US20260053021A1 (en) 2026-02-19
US12482732B2 (en) 2025-11-25
EP4123673A4 (en) 2024-07-03

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