JP7139085B2 - 成膜装置 - Google Patents
成膜装置 Download PDFInfo
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- JP7139085B2 JP7139085B2 JP2020523957A JP2020523957A JP7139085B2 JP 7139085 B2 JP7139085 B2 JP 7139085B2 JP 2020523957 A JP2020523957 A JP 2020523957A JP 2020523957 A JP2020523957 A JP 2020523957A JP 7139085 B2 JP7139085 B2 JP 7139085B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
- B05B12/18—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area using fluids, e.g. gas streams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B16/00—Spray booths
- B05B16/20—Arrangements for spraying in combination with other operations, e.g. drying; Arrangements enabling a combination of spraying operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B16/00—Spray booths
- B05B16/90—Spray booths comprising conveying means for moving objects or other work to be sprayed in and out of the booth, e.g. through the booth
- B05B16/95—Spray booths comprising conveying means for moving objects or other work to be sprayed in and out of the booth, e.g. through the booth the objects or other work to be sprayed lying on, or being held above the conveying means, i.e. not hanging from the conveying means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/0012—Apparatus for achieving spraying before discharge from the apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/16—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed
- B05B7/1606—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed the spraying of the material involving the use of an atomising fluid, e.g. air
- B05B7/1613—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed the spraying of the material involving the use of an atomising fluid, e.g. air comprising means for heating the atomising fluid before mixing with the material to be sprayed
- B05B7/164—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating or cooling the material to be sprayed the spraying of the material involving the use of an atomising fluid, e.g. air comprising means for heating the atomising fluid before mixing with the material to be sprayed the material to be sprayed and the atomising fluid being heated by independent sources of heat, without transfer of heat between atomising fluid and material to be sprayed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/30—Processes for applying liquids or other fluent materials performed by gravity only, i.e. flow coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0218—Pretreatment, e.g. heating the substrate
- B05D3/0227—Pretreatment, e.g. heating the substrate with IR heaters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
- B05D3/0263—After-treatment with IR heaters
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1484—Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Health & Medical Sciences (AREA)
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- Chemical Vapour Deposition (AREA)
Description
図1はこの発明の実施の形態1である成膜装置の概略構成を示す説明図である。図1にXYZ直交座標系を記す。
図2はこの発明の実施の形態2である成膜装置の概略構成を示す説明図である。図2にXYZ直交座標系を記す。
2 赤外光照射器
11,12 成膜装置
21 ランプ載置台
22 赤外光ランプ
6A,6B 成膜室
51 ローラ
52 ベルト
53 コンベア
61 上部容器
62,62B 下部容器
63 開口部
Claims (4)
- 基板(10)を載置する基板載置部(53)と、
前記基板載置部と離れて設けられ、赤外光ランプ(22)を有し、前記赤外光ランプから赤外光を照射して前記基板を加熱する加熱処理を実行する加熱機構(2)と、
原料溶液をミスト化して得られる原料ミスト(MT)を前記基板の表面に噴射するミスト噴射処理を実行するミスト噴射部(1)とを備え、前記赤外光ランプから照射される赤外光の波長は、700~900nmの範囲に設定され、
前記加熱機構による前記加熱処理と前記ミスト噴射部による前記ミスト噴射処理とを同時に実行することにより、前記基板の表面に薄膜を成膜することを特徴とする、
成膜装置。 - 請求項1記載の成膜装置であって、
前記基板、前記加熱機構及び前記ミスト噴射部を内部に収容する成膜室(6A)をさらに備える、
成膜装置。 - 請求項1記載の成膜装置であって、
前記基板及び前記ミスト噴射部を内部に収容する成膜室(6B)をさらに備え、
前記加熱機構は前記成膜室外に配置され、前記成膜室を介して前記加熱処理を実行し、
前記成膜室は、前記加熱機構の前記赤外光ランプから照射される赤外光に対し、透過性に優れた赤外光透過材料を構成材料とする、
成膜装置。 - 請求項3記載の成膜装置であって、
前記赤外光透過材料は石英ガラス、ホウケイ酸ガラス、サファイア、フッ化カルシウム、フッ化バリウム、フッ化マグネシウム、及びフッ化リチウムのうち、少なくとも一つを含む、
成膜装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/022036 WO2019234918A1 (ja) | 2018-06-08 | 2018-06-08 | 成膜装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019234918A1 JPWO2019234918A1 (ja) | 2020-12-17 |
JP7139085B2 true JP7139085B2 (ja) | 2022-09-20 |
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Application Number | Title | Priority Date | Filing Date |
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JP2020523957A Active JP7139085B2 (ja) | 2018-06-08 | 2018-06-08 | 成膜装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210187543A1 (ja) |
JP (1) | JP7139085B2 (ja) |
KR (1) | KR102487935B1 (ja) |
CN (1) | CN112135924B (ja) |
DE (1) | DE112018007709T5 (ja) |
TW (1) | TWI680806B (ja) |
WO (1) | WO2019234918A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000286200A (ja) | 1999-03-31 | 2000-10-13 | Kokusai Electric Co Ltd | 熱処理方法および熱処理装置 |
JP2003213425A (ja) | 2002-01-24 | 2003-07-30 | Utec:Kk | 成膜装置及び成膜方法 |
JP2005109396A (ja) | 2003-10-02 | 2005-04-21 | National Institute Of Advanced Industrial & Technology | 半導体装置の製造方法および絶縁膜形成装置 |
JP2009260281A (ja) | 2008-03-28 | 2009-11-05 | Mitsubishi Electric Corp | 薄膜形成方法および薄膜形成装置、並びにそれを用いて製造された薄膜半導体装置 |
Family Cites Families (11)
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JP3571785B2 (ja) * | 1993-12-28 | 2004-09-29 | キヤノン株式会社 | 堆積膜形成方法及び堆積膜形成装置 |
JP3430277B2 (ja) * | 1995-08-04 | 2003-07-28 | 東京エレクトロン株式会社 | 枚葉式の熱処理装置 |
KR100691758B1 (ko) * | 2001-03-16 | 2007-03-12 | 동경 엘렉트론 주식회사 | 박막 형성 방법 및 박막 형성 장치 |
WO2005115637A1 (en) * | 2004-05-28 | 2005-12-08 | Japan Science And Technology Agency | Forming method, unit and material for pattern films, and product gained by said method |
JP4727355B2 (ja) * | 2005-09-13 | 2011-07-20 | 株式会社フジクラ | 成膜方法 |
JP4911345B2 (ja) * | 2005-07-25 | 2012-04-04 | セイコーエプソン株式会社 | パターニング方法、並びにこれを用いた電子装置の製造方法 |
WO2016133131A1 (ja) * | 2015-02-18 | 2016-08-25 | 株式会社ニコン | 薄膜製造装置、及び薄膜製造方法 |
KR102193365B1 (ko) | 2015-10-19 | 2020-12-22 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 성막 장치 |
DE102015016730A1 (de) * | 2015-12-22 | 2017-06-22 | Oerlikon Surface Solutions Ag, Pfäffikon | UV-Aushärtevorrichtung mit geteilten UV-Umlenkspiegeln |
JP2019090843A (ja) * | 2016-03-31 | 2019-06-13 | コニカミノルタ株式会社 | 光学フィルムの製造方法 |
WO2018061804A1 (ja) * | 2016-09-30 | 2018-04-05 | 富士フイルム株式会社 | 溶液製膜方法 |
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2018
- 2018-06-08 WO PCT/JP2018/022036 patent/WO2019234918A1/ja active Application Filing
- 2018-06-08 JP JP2020523957A patent/JP7139085B2/ja active Active
- 2018-06-08 KR KR1020207034536A patent/KR102487935B1/ko active IP Right Grant
- 2018-06-08 US US17/047,699 patent/US20210187543A1/en active Pending
- 2018-06-08 DE DE112018007709.8T patent/DE112018007709T5/de active Pending
- 2018-06-08 CN CN201880093587.1A patent/CN112135924B/zh active Active
- 2018-08-17 TW TW107128819A patent/TWI680806B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000286200A (ja) | 1999-03-31 | 2000-10-13 | Kokusai Electric Co Ltd | 熱処理方法および熱処理装置 |
JP2003213425A (ja) | 2002-01-24 | 2003-07-30 | Utec:Kk | 成膜装置及び成膜方法 |
JP2005109396A (ja) | 2003-10-02 | 2005-04-21 | National Institute Of Advanced Industrial & Technology | 半導体装置の製造方法および絶縁膜形成装置 |
JP2009260281A (ja) | 2008-03-28 | 2009-11-05 | Mitsubishi Electric Corp | 薄膜形成方法および薄膜形成装置、並びにそれを用いて製造された薄膜半導体装置 |
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Publication number | Publication date |
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US20210187543A1 (en) | 2021-06-24 |
KR20210005221A (ko) | 2021-01-13 |
TWI680806B (zh) | 2020-01-01 |
CN112135924A (zh) | 2020-12-25 |
KR102487935B1 (ko) | 2023-01-13 |
JPWO2019234918A1 (ja) | 2020-12-17 |
TW202000317A (zh) | 2020-01-01 |
DE112018007709T5 (de) | 2021-02-18 |
WO2019234918A1 (ja) | 2019-12-12 |
CN112135924B (zh) | 2023-01-03 |
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