JP7138714B2 - 窒化ホウ素合金接触層を有するiii族窒化物半導体デバイス及び製造方法 - Google Patents
窒化ホウ素合金接触層を有するiii族窒化物半導体デバイス及び製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 105
- 238000000034 method Methods 0.000 title claims description 33
- 229910052582 BN Inorganic materials 0.000 title claims description 26
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 title claims description 25
- 239000000956 alloy Substances 0.000 title claims description 24
- 229910045601 alloy Inorganic materials 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title description 3
- 229910052751 metal Inorganic materials 0.000 claims description 75
- 239000002184 metal Substances 0.000 claims description 75
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 34
- 229910052796 boron Inorganic materials 0.000 claims description 34
- 150000004767 nitrides Chemical class 0.000 claims description 14
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 5
- FGUJWQZQKHUJMW-UHFFFAOYSA-N [AlH3].[B] Chemical compound [AlH3].[B] FGUJWQZQKHUJMW-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910002601 GaN Inorganic materials 0.000 claims description 2
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000005693 optoelectronics Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- SRCJDTOFMBRRBY-UHFFFAOYSA-N boron indium Chemical compound [B].[In] SRCJDTOFMBRRBY-UHFFFAOYSA-N 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- DJPURDPSZFLWGC-UHFFFAOYSA-N alumanylidyneborane Chemical compound [Al]#B DJPURDPSZFLWGC-UHFFFAOYSA-N 0.000 description 1
- -1 boron aluminum indium Chemical compound 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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Description
300B III族窒化物半導体デバイス
300C III族窒化物半導体デバイス
305 基板
310 III族窒化物接触層
315 半導体層
315A 半導体層
315B 半導体層
320 III族窒化物接触層
325A 金属コンタクト
325B 金属コンタクト
Claims (19)
- 第2のIII族窒化物接触層(310、320)に隣接する第1のIII族窒化物接触層(310、320)、前記第1のIII族窒化物接触層(310、320)に配置される第1の金属コンタクト(325A、325B)、及び、前記第2のIII族窒化物接触層(310、320)に配置される第2の金属コンタクト(325A、325B)を備えるIII族窒化物半導体デバイス(300A、300B、300C)を形成する方法であって、
前記方法が、
前記第1のIII族窒化物接触層(310、320)及び前記第1の金属コンタクト(325A、325B)の仕事関数を決定する段階(205)であって、前記第1のIII族窒化物接触層(310、320)の決定された仕事関数が、前記第1のIII族窒化物接触層(310、320)のIII族元素に基づく、仕事関数を決定する段階(205)と、
前記第1のIII族窒化物接触層(310、320)及び前記第1の金属コンタクト(325A、325B)の決定された仕事関数に基づいて、前記第1のIII族窒化物接触層(310、320)の仕事関数が調整されるべきであることを決定する段階(210)と、
前記第2のIII族窒化物接触層(310、320)に隣接する前記第1のIII族窒化物接触層(310、320)を含む前記III族窒化物半導体デバイス(300A、300B、300C)を形成する段階(215)であって、前記第1の金属コンタクト(325A、325B)が、前記第1のIII族窒化物接触層(310、320)に配置され、前記第2の金属コンタクト(325A、325B)が、前記第2のIII族窒化物接触層(310、320)に配置される、前記III族窒化物半導体デバイス(300A、300B、300C)を形成する段階(215)と、
を含み、
前記形成されたIII族窒化物半導体デバイス(300A、300B、300C)の第1のIII族窒化物接触層(310、320)が、前記第1のIII族窒化物接触層(310、320)のIII族元素に基づく前記第1の金属コンタクト(325A、325B)の決定された仕事関数に対して、前記第1のIII族窒化物接触層(310、320)の仕事関数を調整する量のホウ素を有する窒化ホウ素合金である、
III族窒化物半導体デバイス(300A、300B、300C)を形成する方法。 - 前記第2のIII族窒化物接触層の仕事関数及び前記第2の金属コンタクトの仕事関数を決定する段階と、
前記第2のIII族窒化物接触層及び前記第2の金属コンタクトの決定された仕事関数に基づいて、前記第2のIII族窒化物接触層の仕事関数が調整されるべきであることを決定する段階と、
をさらに含み、
前記形成されたIII族窒化物半導体デバイスの第2のIII族窒化物接触層が、前記第2のIII族窒化物接触層のIII族元素に基づく前記第2の金属コンタクトの決定された仕事関数に対して、前記第2のIII族窒化物接触層の仕事関数を調整する量のホウ素を有する窒化ホウ素合金である、請求項1に記載の方法。 - 前記第2のIII族窒化物接触層のIII族元素が、ガリウム、インジウム又はアルミニウムのうちの1つ以上である、請求項2に記載の方法。
- 前記第1のIII族窒化物接触層のIII族元素が、ガリウム、インジウム又はアルミニウムのうちの1つ以上である、請求項1に記載の方法。
- 前記III族窒化物半導体デバイスの形成が、前記第1及び第2のIII族窒化物接触層の間に半導体層を形成する段階をさらに含む、請求項1に記載の方法。
- 前記III族窒化物半導体デバイスの形成が、前記第1及び第2のIII族窒化物接触層の間に2つの半導体層のヘテロ接合を形成する段階をさらに含む、請求項1に記載の方法。
- 前記第1の金属コンタクトの決定された仕事関数、及び、前記第1のIII族窒化物接触層のIII族元素に基づく前記第1のIII族窒化物接触層の決定された仕事関数に基づいて、前記第1のIII族窒化物接触層と、前記第1の金属コンタクトとの間にショットキー接触が形成され、
前記第1の金属コンタクトの決定された仕事関数、及び、前記窒化ホウ素合金に基づく前記第1のIII族窒化物接触層の決定された仕事関数に基づいて、前記形成された第1のIII族窒化物接触層と、前記形成された第1の金属コンタクトとの間にオーミック接触が形成される、請求項1に記載の方法。 - 前記第2の金属コンタクトの決定された仕事関数、及び、前記第2のIII族窒化物接触層のIII族元素に基づく前記第2のIII族窒化物接触層の決定された仕事関数に基づいて、前記第2のIII族窒化物接触層と、前記第2の金属コンタクトとの間にショットキー接触が形成され、
前記第2の金属コンタクトの決定された仕事関数、及び、前記窒化ホウ素合金に基づく前記第2のIII族窒化物接触層の決定された仕事関数に基づいて、前記形成された第2のIII族窒化物接触層と、前記形成された第2の金属コンタクトとの間にオーミック接触が形成される、請求項2に記載の方法。 - 前記半導体デバイスが、p-nダイオードであり、前記第1のIII族窒化物接触層が、窒化ホウ素アルミニウムを含み、前記第2のIII族窒化物接触層が、窒化アルミニウムガリウムを含む、請求項1に記載の方法。
- 前記第1のIII族窒化物接触層が、B0.14Al0.86Nを含む、請求項9に記載の方法。
- 第1のIII族窒化物接触層(310、320)と、
前記第1のIII族窒化物接触層(310、320)に配置された第1の金属コンタクト(325A、325B)と、
前記第1のIII族窒化物接触層(310、320)に隣接して配置された第2のIII族窒化物接触層(310、320)と、
前記第2のIII族窒化物接触層(310、320)に配置された第2の金属コンタクト(325A、325B)と、
を備え、
前記第1のIII族窒化物接触層(310、320)が、ホウ素、窒化物及び追加のIII族元素を有する窒化ホウ素合金を含み、
前記第1のIII族窒化物接触層(310、320)が、前記追加のIII族元素及び窒化物を含む接触層と比較して、前記第1のIII族窒化物接触層(310、320)の仕事関数を調整する量のホウ素を備える、
半導体デバイス(300A、300B、300C)。 - 前記第2のIII族窒化物接触層が、ホウ素、窒化物及びさらなるIII族元素を有する窒化ホウ素合金を含み、前記第2のIII族窒化物接触層が、前記さらなるIII族元素及び窒化物を含む接触層と比較して、前記第2のIII族窒化物接触層の仕事関数を調整する量のホウ素を含む、請求項11に記載の半導体デバイス。
- 前記第1及び第2のIII族窒化物接触層の間に介在層がなく、前記半導体デバイスが、p-nダイオードである、請求項11に記載の半導体デバイス。
- 前記第1及び第2のIII族窒化物接触層の間に半導体層をさらに備える、請求項11に記載の半導体デバイス。
- 前記第1及び第2のIII族窒化物接触層の間に2つの半導体層のヘテロ接合をさらに含む、請求項11に記載の半導体デバイス。
- 第1のIII族窒化物接触層(310、320)を形成する段階(505)と、
前記第1のIII族窒化物接触層(310、320)に隣接する第2のIII族窒化物接触層(310、320)を形成する段階(510)と、
前記第1のIII族窒化物接触層(310、320)に第1の金属コンタクト(325A、325B)を形成する段階(515)と、
前記第2のIII族窒化物接触層(310、320)に第2の金属コンタクト(325A、325B)を形成する段階(520)と、
を含み、
前記第1及び第2のIII族窒化物接触層(310、320)が両方とも、ホウ素、窒化物、及び、少なくとも1つの追加のIII族元素を含み、前記少なくとも1つの追加のIII族元素が、前記第1及び第2のIII族窒化物接触層(310、320)用のものとは異なり、
前記第1のIII族窒化物接触層(310)が、ある量のホウ素で形成され、それにより、前記第1のIII族窒化物接触層(310)が、前記少なくとも1つの追加のIII族元素及び窒化物を含む層と比較して調整された仕事関数を有する、
III族窒化物半導体デバイス(300A、300B、300C)を形成する方法。 - 前記第2のIII族窒化物接触層が、ある量のホウ素で形成され、それにより、前記第2のIII族窒化物接触層が、前記少なくとも1つの追加のIII族元素及び窒化物を含む層と比較して調整された仕事関数を有する、請求項16に記載の方法。
- 前記第1のIII族窒化物接触層が、窒化ホウ素アルミニウムを含み、前記第2のIII族窒化物接触層が、窒化ホウ素ガリウムを含む、請求項16に記載の方法。
- 前記第1及び第2のIII族窒化物接触層の間に半導体層を形成する段階をさらに含む、請求項16に記載の方法。
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