JP7125589B2 - Ｅｆｅｍシステム及びｅｆｅｍシステムにおけるガス供給方法 - Google Patents

Ｅｆｅｍシステム及びｅｆｅｍシステムにおけるガス供給方法 Download PDF

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JP7125589B2
JP7125589B2 JP2018048072A JP2018048072A JP7125589B2 JP 7125589 B2 JP7125589 B2 JP 7125589B2 JP 2018048072 A JP2018048072 A JP 2018048072A JP 2018048072 A JP2018048072 A JP 2018048072A JP 7125589 B2 JP7125589 B2 JP 7125589B2
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internal space
dry air
efem
inert gas
humidity
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JP2019161097A (ja
Inventor
俊宏 河合
源五郎 小倉
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Sinfonia Technology Co Ltd
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Sinfonia Technology Co Ltd
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Priority to JP2018048072A priority Critical patent/JP7125589B2/ja
Priority to TW107133749A priority patent/TWI800533B/zh
Priority to TW112112454A priority patent/TW202343648A/zh
Priority to CN201910137423.0A priority patent/CN110277331A/zh
Priority to KR1020190022293A priority patent/KR20190109244A/ko
Publication of JP2019161097A publication Critical patent/JP2019161097A/ja
Priority to JP2022126001A priority patent/JP7477785B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Separation By Low-Temperature Treatments (AREA)
JP2018048072A 2018-03-15 2018-03-15 Ｅｆｅｍシステム及びｅｆｅｍシステムにおけるガス供給方法 Active JP7125589B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2018048072A JP7125589B2 (ja) 2018-03-15 2018-03-15 Ｅｆｅｍシステム及びｅｆｅｍシステムにおけるガス供給方法
TW107133749A TWI800533B (zh) 2018-03-15 2018-09-26 Ｅｆｅｍ系統及ｅｆｅｍ系統之氣體供給方法
TW112112454A TW202343648A (zh) 2018-03-15 2018-09-26 Ｅｆｅｍ系統及ｅｆｅｍ系統之氣體供給方法
CN201910137423.0A CN110277331A (zh) 2018-03-15 2019-02-25 Efem系统以及efem系统中的气体供给方法
KR1020190022293A KR20190109244A (ko) 2018-03-15 2019-02-26 Efem 시스템, 및 efem 시스템에 있어서의 가스 공급 방법
JP2022126001A JP7477785B2 (ja) 2018-03-15 2022-08-08 Ｅｆｅｍシステム及びｅｆｅｍシステムにおけるガス供給方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018048072A JP7125589B2 (ja) 2018-03-15 2018-03-15 Ｅｆｅｍシステム及びｅｆｅｍシステムにおけるガス供給方法

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JP2022126001A Division JP7477785B2 (ja) 2018-03-15 2022-08-08 Ｅｆｅｍシステム及びｅｆｅｍシステムにおけるガス供給方法

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JP2019161097A JP2019161097A (ja) 2019-09-19
JP7125589B2 true JP7125589B2 (ja) 2022-08-25

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JP2022126001A Active JP7477785B2 (ja) 2018-03-15 2022-08-08 Ｅｆｅｍシステム及びｅｆｅｍシステムにおけるガス供給方法

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JP (2) JP7125589B2 (ko)
KR (1) KR20190109244A (ko)
CN (1) CN110277331A (ko)
TW (2) TW202343648A (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7379042B2 (ja) 2019-09-20 2023-11-14 東京エレクトロン株式会社 真空搬送装置および真空搬送装置の制御方法
KR102276150B1 (ko) * 2019-09-27 2021-07-12 시너스텍 주식회사 오븐 챔버
KR102310953B1 (ko) * 2019-12-20 2021-10-12 멜콘 주식회사 건조 공기 공급 장치 및 방법
CN111090295A (zh) * 2019-12-31 2020-05-01 北京海岚科技有限公司 Efem中环境参数的控制方法及控制系统
JP2023048293A (ja) * 2021-09-28 2023-04-07 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、基板処理方法およびプログラム
US20240125491A1 (en) * 2022-10-13 2024-04-18 Applied Materials, Inc. Filter isolation for equipment front end module

Citations (9)

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JP2000353738A (ja) 1999-06-11 2000-12-19 Sony Corp 密閉コンテナ、保管装置および電子部品搬送システム、ならびに電子部品の保管および搬送方法
JP2002056643A (ja) 2000-08-04 2002-02-22 Matsushita Electric Ind Co Ltd 磁気ディスク装置とその製造方法
JP2002359180A (ja) 2001-06-01 2002-12-13 Toshiba Corp ガス循環システム
JP2005101185A (ja) 2003-09-24 2005-04-14 Dainippon Screen Mfg Co Ltd 基板洗浄乾燥装置
JP2005142185A (ja) 2003-11-04 2005-06-02 Canon Inc 露光装置及びその環境制御方法
JP2010072624A (ja) 2008-08-18 2010-04-02 Nec Electronics Corp レチクル収納装置およびレチクル保管方法
JP2015146349A (ja) 2014-01-31 2015-08-13 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
JP2016015435A (ja) 2014-07-03 2016-01-28 株式会社アマダホールディングス ファイバレーザ発振器，ファイバレーザ加工装置，及びファイバレーザ発振器の除湿方法
JP2016527732A (ja) 2013-08-12 2016-09-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ファクトリインターフェースの環境制御を伴う基板処理のシステム、装置、及び方法

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JPH113867A (ja) * 1997-06-11 1999-01-06 Kokusai Electric Co Ltd 半導体製造装置
SG145526A1 (en) * 2000-02-01 2008-09-29 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
JP2004160444A (ja) * 2002-09-20 2004-06-10 Tokyo Electron Ltd 乾燥空気供給装置及び処理装置
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JP2000353738A (ja) 1999-06-11 2000-12-19 Sony Corp 密閉コンテナ、保管装置および電子部品搬送システム、ならびに電子部品の保管および搬送方法
JP2002056643A (ja) 2000-08-04 2002-02-22 Matsushita Electric Ind Co Ltd 磁気ディスク装置とその製造方法
JP2002359180A (ja) 2001-06-01 2002-12-13 Toshiba Corp ガス循環システム
JP2005101185A (ja) 2003-09-24 2005-04-14 Dainippon Screen Mfg Co Ltd 基板洗浄乾燥装置
JP2005142185A (ja) 2003-11-04 2005-06-02 Canon Inc 露光装置及びその環境制御方法
JP2010072624A (ja) 2008-08-18 2010-04-02 Nec Electronics Corp レチクル収納装置およびレチクル保管方法
JP2016527732A (ja) 2013-08-12 2016-09-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ファクトリインターフェースの環境制御を伴う基板処理のシステム、装置、及び方法
JP2015146349A (ja) 2014-01-31 2015-08-13 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
JP2016015435A (ja) 2014-07-03 2016-01-28 株式会社アマダホールディングス ファイバレーザ発振器，ファイバレーザ加工装置，及びファイバレーザ発振器の除湿方法

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Also Published As

Publication number Publication date
TW201939655A (zh) 2019-10-01
JP7477785B2 (ja) 2024-05-02
JP2019161097A (ja) 2019-09-19
CN110277331A (zh) 2019-09-24
JP2022160598A (ja) 2022-10-19
KR20190109244A (ko) 2019-09-25
TW202343648A (zh) 2023-11-01
TWI800533B (zh) 2023-05-01

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