CN110277331A - Efem系统以及efem系统中的气体供给方法 - Google Patents

Efem系统以及efem系统中的气体供给方法 Download PDF

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Publication number
CN110277331A
CN110277331A CN201910137423.0A CN201910137423A CN110277331A CN 110277331 A CN110277331 A CN 110277331A CN 201910137423 A CN201910137423 A CN 201910137423A CN 110277331 A CN110277331 A CN 110277331A
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CN
China
Prior art keywords
inner space
dry air
efem
supply
active gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910137423.0A
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English (en)
Chinese (zh)
Inventor
河合俊宏
小仓源五郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sinfonia Technology Co Ltd
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Sinfonia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinfonia Technology Co Ltd filed Critical Sinfonia Technology Co Ltd
Publication of CN110277331A publication Critical patent/CN110277331A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Separation By Low-Temperature Treatments (AREA)
CN201910137423.0A 2018-03-15 2019-02-25 Efem系统以及efem系统中的气体供给方法 Pending CN110277331A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-048072 2018-03-15
JP2018048072A JP7125589B2 (ja) 2018-03-15 2018-03-15 Ｅｆｅｍシステム及びｅｆｅｍシステムにおけるガス供給方法

Publications (1)

Publication Number Publication Date
CN110277331A true CN110277331A (zh) 2019-09-24

Family

ID=67958161

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910137423.0A Pending CN110277331A (zh) 2018-03-15 2019-02-25 Efem系统以及efem系统中的气体供给方法

Country Status (4)

Country Link
JP (2) JP7125589B2 (ko)
KR (1) KR20190109244A (ko)
CN (1) CN110277331A (ko)
TW (2) TW202343648A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111090295A (zh) * 2019-12-31 2020-05-01 北京海岚科技有限公司 Efem中环境参数的控制方法及控制系统
CN112999830A (zh) * 2019-12-20 2021-06-22 美康有限公司 干燥空气供给装置及方法
WO2024081253A1 (en) * 2022-10-13 2024-04-18 Applied Materials, Inc. Filter isolation for equipment front end module

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7379042B2 (ja) 2019-09-20 2023-11-14 東京エレクトロン株式会社 真空搬送装置および真空搬送装置の制御方法
KR102276150B1 (ko) * 2019-09-27 2021-07-12 시너스텍 주식회사 오븐 챔버
JP2023048293A (ja) * 2021-09-28 2023-04-07 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、基板処理方法およびプログラム

Citations (12)

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US20010013161A1 (en) * 2000-02-01 2001-08-16 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP2004160444A (ja) * 2002-09-20 2004-06-10 Tokyo Electron Ltd 乾燥空気供給装置及び処理装置
JP2004200669A (ja) * 2002-12-02 2004-07-15 Rorze Corp ミニエンバイロメント装置、薄板状物製造システム及び清浄容器の雰囲気置換方法
DE102006013997A1 (de) * 2006-03-27 2007-10-11 Rm Michaelides Software & Elektronik Gmbh Lagersystem zur Lagerung feuchtigkeitsempfindlicher Bauteile, Verfahren zum Beeinflussen der Atmosphärenfeuchte
JP2011149661A (ja) * 2010-01-25 2011-08-04 Takasago Thermal Eng Co Ltd クリーンルームシステム及びその運転方法
JP2013120760A (ja) * 2011-12-06 2013-06-17 Hitachi High-Tech Control Systems Corp ウエハ処理装置
JP2013171757A (ja) * 2012-02-22 2013-09-02 Ngk Insulators Ltd 不活性ガスパージ方法
JP2014038888A (ja) * 2012-08-10 2014-02-27 Hitachi High-Tech Control Systems Corp ミニエンバイロメント装置及びその内部雰囲気置換方法
CN204011459U (zh) * 2014-07-09 2014-12-10 无锡易比达半导体科技有限公司 一种硅片的轻便洁净周转箱
US20150024671A1 (en) * 2013-07-16 2015-01-22 Sinfonia Technology Co., Ltd. Efem and load port
JP2015098419A (ja) * 2013-11-20 2015-05-28 オリンパス株式会社 不活性ガス置換装置および不活性ガス置換方法
CN105453246A (zh) * 2013-08-12 2016-03-30 应用材料公司 具有工厂接口环境控制的基板处理系统、装置和方法

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JPH113867A (ja) * 1997-06-11 1999-01-06 Kokusai Electric Co Ltd 半導体製造装置
JP2000353738A (ja) * 1999-06-11 2000-12-19 Sony Corp 密閉コンテナ、保管装置および電子部品搬送システム、ならびに電子部品の保管および搬送方法
JP2002056643A (ja) * 2000-08-04 2002-02-22 Matsushita Electric Ind Co Ltd 磁気ディスク装置とその製造方法
JP2002359180A (ja) * 2001-06-01 2002-12-13 Toshiba Corp ガス循環システム
JP2005101185A (ja) * 2003-09-24 2005-04-14 Dainippon Screen Mfg Co Ltd 基板洗浄乾燥装置
JP2005142185A (ja) * 2003-11-04 2005-06-02 Canon Inc 露光装置及びその環境制御方法
JP2010072624A (ja) * 2008-08-18 2010-04-02 Nec Electronics Corp レチクル収納装置およびレチクル保管方法
JP6349750B2 (ja) * 2014-01-31 2018-07-04 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
JP2016015435A (ja) * 2014-07-03 2016-01-28 株式会社アマダホールディングス ファイバレーザ発振器，ファイバレーザ加工装置，及びファイバレーザ発振器の除湿方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010013161A1 (en) * 2000-02-01 2001-08-16 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP2004160444A (ja) * 2002-09-20 2004-06-10 Tokyo Electron Ltd 乾燥空気供給装置及び処理装置
JP2004200669A (ja) * 2002-12-02 2004-07-15 Rorze Corp ミニエンバイロメント装置、薄板状物製造システム及び清浄容器の雰囲気置換方法
DE102006013997A1 (de) * 2006-03-27 2007-10-11 Rm Michaelides Software & Elektronik Gmbh Lagersystem zur Lagerung feuchtigkeitsempfindlicher Bauteile, Verfahren zum Beeinflussen der Atmosphärenfeuchte
JP2011149661A (ja) * 2010-01-25 2011-08-04 Takasago Thermal Eng Co Ltd クリーンルームシステム及びその運転方法
JP2013120760A (ja) * 2011-12-06 2013-06-17 Hitachi High-Tech Control Systems Corp ウエハ処理装置
JP2013171757A (ja) * 2012-02-22 2013-09-02 Ngk Insulators Ltd 不活性ガスパージ方法
JP2014038888A (ja) * 2012-08-10 2014-02-27 Hitachi High-Tech Control Systems Corp ミニエンバイロメント装置及びその内部雰囲気置換方法
US20150024671A1 (en) * 2013-07-16 2015-01-22 Sinfonia Technology Co., Ltd. Efem and load port
CN105453246A (zh) * 2013-08-12 2016-03-30 应用材料公司 具有工厂接口环境控制的基板处理系统、装置和方法
JP2015098419A (ja) * 2013-11-20 2015-05-28 オリンパス株式会社 不活性ガス置換装置および不活性ガス置換方法
CN204011459U (zh) * 2014-07-09 2014-12-10 无锡易比达半导体科技有限公司 一种硅片的轻便洁净周转箱

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112999830A (zh) * 2019-12-20 2021-06-22 美康有限公司 干燥空气供给装置及方法
CN111090295A (zh) * 2019-12-31 2020-05-01 北京海岚科技有限公司 Efem中环境参数的控制方法及控制系统
WO2024081253A1 (en) * 2022-10-13 2024-04-18 Applied Materials, Inc. Filter isolation for equipment front end module

Also Published As

Publication number Publication date
TW201939655A (zh) 2019-10-01
JP7477785B2 (ja) 2024-05-02
JP2019161097A (ja) 2019-09-19
JP2022160598A (ja) 2022-10-19
KR20190109244A (ko) 2019-09-25
TW202343648A (zh) 2023-11-01
JP7125589B2 (ja) 2022-08-25
TWI800533B (zh) 2023-05-01

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