JP7123688B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP7123688B2
JP7123688B2 JP2018147942A JP2018147942A JP7123688B2 JP 7123688 B2 JP7123688 B2 JP 7123688B2 JP 2018147942 A JP2018147942 A JP 2018147942A JP 2018147942 A JP2018147942 A JP 2018147942A JP 7123688 B2 JP7123688 B2 JP 7123688B2
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semiconductor device
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chip mounting
chip
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JP2020024998A (ja
JP2020024998A5 (enExample
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聡史 白木
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2018147942A priority Critical patent/JP7123688B2/ja
Priority to US16/510,087 priority patent/US11239196B2/en
Publication of JP2020024998A publication Critical patent/JP2020024998A/ja
Publication of JP2020024998A5 publication Critical patent/JP2020024998A5/ja
Priority to US17/645,815 priority patent/US12009333B2/en
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JP2015177182A (ja) 2014-03-18 2015-10-05 三菱電機株式会社 パワーモジュール
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JP2015177182A (ja) 2014-03-18 2015-10-05 三菱電機株式会社 パワーモジュール
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