JP7108415B2 - 集積回路装置及び電子機器 - Google Patents

集積回路装置及び電子機器 Download PDF

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Publication number
JP7108415B2
JP7108415B2 JP2018010029A JP2018010029A JP7108415B2 JP 7108415 B2 JP7108415 B2 JP 7108415B2 JP 2018010029 A JP2018010029 A JP 2018010029A JP 2018010029 A JP2018010029 A JP 2018010029A JP 7108415 B2 JP7108415 B2 JP 7108415B2
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Japan
Prior art keywords
pattern
film
chip
wirings
protruding
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JP2018010029A
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English (en)
Japanese (ja)
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JP2019071401A5 (enExample
JP2019071401A (ja
Inventor
和浩 岡村
剛 大久保
祐一 中込
剛史 瀬納
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シナプティクス インコーポレイテッド
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Priority to CN201880064882.4A priority Critical patent/CN111448650B/zh
Priority to US16/753,758 priority patent/US11171111B2/en
Priority to PCT/JP2018/036904 priority patent/WO2019069935A1/ja
Publication of JP2019071401A publication Critical patent/JP2019071401A/ja
Publication of JP2019071401A5 publication Critical patent/JP2019071401A5/ja
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Publication of JP7108415B2 publication Critical patent/JP7108415B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2018010029A 2017-10-06 2018-01-24 集積回路装置及び電子機器 Active JP7108415B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201880064882.4A CN111448650B (zh) 2017-10-06 2018-10-02 集成电路装置和电子设备
US16/753,758 US11171111B2 (en) 2017-10-06 2018-10-02 Integrated circuit device and electronic device
PCT/JP2018/036904 WO2019069935A1 (ja) 2017-10-06 2018-10-02 集積回路装置及び電子機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017195938 2017-10-06
JP2017195938 2017-10-06

Publications (3)

Publication Number Publication Date
JP2019071401A JP2019071401A (ja) 2019-05-09
JP2019071401A5 JP2019071401A5 (enExample) 2021-02-25
JP7108415B2 true JP7108415B2 (ja) 2022-07-28

Family

ID=66440735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018010029A Active JP7108415B2 (ja) 2017-10-06 2018-01-24 集積回路装置及び電子機器

Country Status (3)

Country Link
US (1) US11171111B2 (enExample)
JP (1) JP7108415B2 (enExample)
CN (1) CN111448650B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102901103B1 (ko) 2020-03-04 2025-12-17 삼성디스플레이 주식회사 표시 장치
JP7762161B2 (ja) 2020-11-06 2025-10-29 株式会社ワコム センサ
GB2644158A (en) * 2024-08-27 2026-03-25 Pragmatic Semiconductor Ltd Integrated circuit chip

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077482A (ja) 1998-08-27 2000-03-14 Sharp Corp テープキャリアパッケージ
JP2001358245A (ja) 2000-06-14 2001-12-26 Seiko Epson Corp 配線基板の製造方法、半導体装置及びその製造方法、回路基板並びに電子機器
JP2007157929A (ja) 2005-12-02 2007-06-21 Nitto Denko Corp 配線回路基板
JP2008091797A (ja) 2006-10-04 2008-04-17 Olympus Corp フレキシブル基板の接合装置
JP2008159873A (ja) 2006-12-25 2008-07-10 Epson Imaging Devices Corp フレキシブルプリント配線基板およびその製造方法、電気光学装置および電子機器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58105165U (ja) * 1982-01-09 1983-07-18 キヤノン株式会社 フレキシブルプリント板
JPS62269399A (ja) * 1986-05-19 1987-11-21 松下電器産業株式会社 シ−ルド装置
JPH04263495A (ja) * 1991-02-18 1992-09-18 Ibiden Co Ltd フレキシブル配線板
JP3234743B2 (ja) * 1995-05-30 2001-12-04 シャープ株式会社 半導体部品実装型フレキシブルプリント基板
JP3550253B2 (ja) * 1996-07-23 2004-08-04 株式会社東芝 電子機器
US7777329B2 (en) * 2006-07-27 2010-08-17 International Business Machines Corporation Heatsink apparatus for applying a specified compressive force to an integrated circuit device
KR101319592B1 (ko) * 2006-07-31 2013-10-16 삼성디스플레이 주식회사 다층 연성필름 패키지 및 이를 포함하는 액정 표시 장치
TWI337402B (en) * 2007-01-03 2011-02-11 Chipmos Technologies Inc Semiconductor packaging substrate improving capability of electrostatic dissipation
US9953952B2 (en) * 2008-08-20 2018-04-24 Infineon Technologies Ag Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077482A (ja) 1998-08-27 2000-03-14 Sharp Corp テープキャリアパッケージ
JP2001358245A (ja) 2000-06-14 2001-12-26 Seiko Epson Corp 配線基板の製造方法、半導体装置及びその製造方法、回路基板並びに電子機器
JP2007157929A (ja) 2005-12-02 2007-06-21 Nitto Denko Corp 配線回路基板
JP2008091797A (ja) 2006-10-04 2008-04-17 Olympus Corp フレキシブル基板の接合装置
JP2008159873A (ja) 2006-12-25 2008-07-10 Epson Imaging Devices Corp フレキシブルプリント配線基板およびその製造方法、電気光学装置および電子機器

Also Published As

Publication number Publication date
US20200279828A1 (en) 2020-09-03
CN111448650B (zh) 2024-11-12
CN111448650A (zh) 2020-07-24
JP2019071401A (ja) 2019-05-09
US11171111B2 (en) 2021-11-09

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