JP7103570B2 - はんだ接合部を有する電気部品 - Google Patents
はんだ接合部を有する電気部品 Download PDFInfo
- Publication number
- JP7103570B2 JP7103570B2 JP2019565889A JP2019565889A JP7103570B2 JP 7103570 B2 JP7103570 B2 JP 7103570B2 JP 2019565889 A JP2019565889 A JP 2019565889A JP 2019565889 A JP2019565889 A JP 2019565889A JP 7103570 B2 JP7103570 B2 JP 7103570B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- electric wire
- contact surface
- electric
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
- H01R4/625—Soldered or welded connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Description
B 装置
C NTCセラミック
D はんだ付けされた電線端部
E 装置の接触面
F 支承面
K1 第1の角度を有する第1の湾曲部
K2 第2の角度を有する第2の湾曲部
J 高分子絶縁体
R 円形断面の区域
L 支承区域の部分
M 第1の湾曲部の後に続く平坦化部
N 別の湾曲部の後に続く平坦化部
O 円形断面を有する部分
P 円形断面を有し、かつ絶縁体を有する部分
Claims (9)
- 少なくとも1つのはんだ接合部を有する電気装置(B)であって、
当該電気装置に、1つの端部がはんだ付けされた電線を備え、
前記電線が、当該電気装置における支承面(F)で支承し、
前記電線が、当該電気装置における、前記電線の前記支承面(F)の区域に少なくとも1つの湾曲部(K1)を有し、
前記電線が、前記支承面(F)の前記区域に平坦化部を有し、
前記湾曲部(K1)が、前記平坦化部の前記端部で前記電線に配置され、その部分の前記電線が、円形の断面形状の区域(R)になり、
前記電線が、平坦化部(F)の前記区域に、接触面(E)に向けられた別の湾曲部(K2)を有し、
前記支承面(F)から見たときに、前記電線が、前記接触面(E)に対するギャップ(A)を伴って湾曲部(K2)の後に続いて延び、
前記はんだ接合部がはんだを備え、前記はんだの大部分が、前記電線が前記接触面(E)に対するギャップ(A)を伴って延びる前記区域に配置され、
円形の断面形状の前記区域(R)と、前記接触面(E)との間の前記ギャップ(A)は、前記はんだで充填されている、電気装置(B)。 - 前記はんだ付けされた端部から見たときに、前記別の湾曲部(K2)が、前記少なくとも1つの湾曲部(K1)の後に配置される、請求項1に記載の電気装置(B)。
- 前記電線の前記支承面(F)が、平面図において丸められた端部(D)を有する、請求項1に記載の電気装置(B)。
- 導電性金属で被覆された、前記はんだ接合部に対する少なくとも1つの接触面(E)を有する、請求項1~3のいずれか一項に記載の電気装置(B)。
- 前記電線の前記支承面(F)が、接触面(E)よりも短い、請求項4に記載の電気装置(B)。
- 円形の断面形状の前記区域(R)内でのみ始まる、合成高分子材料の電線絶縁体(J)を備える、請求項1に記載の電気装置(B)。
- NTCセラミックを含む、請求項1~6のいずれか一項に記載の電気装置(B)。
- 当該電気装置、前記はんだ接合部、及び前記電線を最後の湾曲部の後ろまで覆うポリマーのカバーを有する、請求項1~7のいずれか一項に記載の電気装置(B)。
- 前記電線と形状が同一の別の電線がはんだ付けされる別の接触面を有する、請求項1~8のいずれか一項に記載の電気装置(B)。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022067139A JP2022087294A (ja) | 2017-07-20 | 2022-04-14 | はんだ接合部を有する電気部品 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017116381.6 | 2017-07-20 | ||
DE102017116381.6A DE102017116381A1 (de) | 2017-07-20 | 2017-07-20 | Elektrisches Bauelement mit Lötverbindung |
PCT/EP2018/068999 WO2019016076A1 (de) | 2017-07-20 | 2018-07-12 | Elektrisches bauelement mit lötverbindung |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022067139A Division JP2022087294A (ja) | 2017-07-20 | 2022-04-14 | はんだ接合部を有する電気部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020527849A JP2020527849A (ja) | 2020-09-10 |
JP7103570B2 true JP7103570B2 (ja) | 2022-07-20 |
Family
ID=62904485
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019565889A Active JP7103570B2 (ja) | 2017-07-20 | 2018-07-12 | はんだ接合部を有する電気部品 |
JP2022067139A Ceased JP2022087294A (ja) | 2017-07-20 | 2022-04-14 | はんだ接合部を有する電気部品 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022067139A Ceased JP2022087294A (ja) | 2017-07-20 | 2022-04-14 | はんだ接合部を有する電気部品 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10770204B2 (ja) |
EP (1) | EP3655977A1 (ja) |
JP (2) | JP7103570B2 (ja) |
CN (1) | CN110914929B (ja) |
DE (1) | DE102017116381A1 (ja) |
WO (1) | WO2019016076A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110587054B (zh) * | 2019-09-23 | 2021-12-14 | 天津市特变电工变压器有限公司 | 一种油浸式配变产品用铝扁线与铜绞线焊接工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3074022U (ja) | 2000-06-13 | 2000-12-19 | ティーディーケイ株式会社 | 温度検知用サーミスタ装置 |
JP2004273494A (ja) | 2003-03-05 | 2004-09-30 | Rinnai Corp | サーミスタとその製造方法 |
JP2004335793A (ja) | 2003-05-08 | 2004-11-25 | Mitsubishi Materials Corp | 温度計 |
WO2014173595A1 (de) | 2013-04-25 | 2014-10-30 | Epcos Ag | Vorrichtung und verfahren zur herstellung einer elektrisch leitfähigen und mechanischen verbindung |
JP2016119277A (ja) | 2014-12-24 | 2016-06-30 | 日本特殊陶業株式会社 | セラミック接合体、セラミックヒータ及びセンサ |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49138348U (ja) * | 1973-03-29 | 1974-11-28 | ||
US3793604A (en) * | 1973-04-09 | 1974-02-19 | Gte Sylvania Inc | High strength electrical lead for disk type thermistors |
JPS5584902U (ja) * | 1978-12-05 | 1980-06-11 | ||
JPS59173325U (ja) * | 1983-05-04 | 1984-11-19 | 株式会社村田製作所 | 電子部品へのリ−ド線取付構造 |
JPS6146722U (ja) * | 1984-08-29 | 1986-03-28 | 株式会社村田製作所 | 3端子コンデンサ |
JPH01268108A (ja) * | 1988-04-20 | 1989-10-25 | Matsushita Electric Ind Co Ltd | 電気部品 |
US5117089A (en) * | 1990-04-02 | 1992-05-26 | Emerson Electric Co. | Structural support for hermetic terminal assembly heater apparatus |
JP2575400Y2 (ja) * | 1993-03-29 | 1998-06-25 | 株式会社村田製作所 | サーミスタ |
JPH08203703A (ja) * | 1995-01-26 | 1996-08-09 | Murata Mfg Co Ltd | サーミスタ素子 |
ATE230515T1 (de) * | 1995-05-03 | 2003-01-15 | Bc Components Holdings B V | Entmagnetisierungsanordnung bestehend aus einem oder zwei thermistoren |
TW463184B (en) * | 1999-04-09 | 2001-11-11 | Murata Manufacturing Co | Temperature sensor, method of producing same and method of mounting same to a circuit board |
DE10022487A1 (de) * | 2000-05-09 | 2001-11-29 | Epcos Ag | Bauelement, Verfahren zu dessen Herstellung und dessen Verwendung |
JP3589174B2 (ja) * | 2000-10-24 | 2004-11-17 | 株式会社村田製作所 | 表面実装型正特性サーミスタおよびその実装方法 |
US7148785B2 (en) * | 2003-05-02 | 2006-12-12 | Tyco Electronics Corporation | Circuit protection device |
JP5243498B2 (ja) | 2009-09-15 | 2013-07-24 | 日本特殊陶業株式会社 | セラミックヒータ及びそれを備えたガスセンサ |
JP4877387B2 (ja) * | 2009-12-18 | 2012-02-15 | Tdk株式会社 | ラジアルリード電子部品 |
KR101008310B1 (ko) * | 2010-07-30 | 2011-01-13 | 김선기 | 세라믹 칩 어셈블리 |
US20150159904A1 (en) * | 2013-12-11 | 2015-06-11 | Honeywell International Inc. | Rotary dial mechanism for a building automation controller |
DE102014110553A1 (de) * | 2014-07-25 | 2016-01-28 | Epcos Ag | Sensorelement, Sensoranordnung und Verfahren zur Herstellung eines Sensorelements |
US10488062B2 (en) * | 2016-07-22 | 2019-11-26 | Ademco Inc. | Geofence plus schedule for a building controller |
-
2017
- 2017-07-20 DE DE102017116381.6A patent/DE102017116381A1/de active Pending
-
2018
- 2018-07-12 CN CN201880048609.2A patent/CN110914929B/zh active Active
- 2018-07-12 WO PCT/EP2018/068999 patent/WO2019016076A1/de unknown
- 2018-07-12 EP EP18740209.4A patent/EP3655977A1/de active Pending
- 2018-07-12 JP JP2019565889A patent/JP7103570B2/ja active Active
- 2018-07-12 US US16/611,294 patent/US10770204B2/en active Active
-
2022
- 2022-04-14 JP JP2022067139A patent/JP2022087294A/ja not_active Ceased
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3074022U (ja) | 2000-06-13 | 2000-12-19 | ティーディーケイ株式会社 | 温度検知用サーミスタ装置 |
JP2004273494A (ja) | 2003-03-05 | 2004-09-30 | Rinnai Corp | サーミスタとその製造方法 |
JP2004335793A (ja) | 2003-05-08 | 2004-11-25 | Mitsubishi Materials Corp | 温度計 |
WO2014173595A1 (de) | 2013-04-25 | 2014-10-30 | Epcos Ag | Vorrichtung und verfahren zur herstellung einer elektrisch leitfähigen und mechanischen verbindung |
JP2016525787A (ja) | 2013-04-25 | 2016-08-25 | エプコス アクチエンゲゼルシャフトEpcos Ag | 電気的に導通した機械的結合部の生成のための固定構造および方法 |
JP2016119277A (ja) | 2014-12-24 | 2016-06-30 | 日本特殊陶業株式会社 | セラミック接合体、セラミックヒータ及びセンサ |
Also Published As
Publication number | Publication date |
---|---|
EP3655977A1 (de) | 2020-05-27 |
DE102017116381A1 (de) | 2019-01-24 |
US20200066428A1 (en) | 2020-02-27 |
WO2019016076A1 (de) | 2019-01-24 |
CN110914929A (zh) | 2020-03-24 |
CN110914929B (zh) | 2022-07-29 |
JP2022087294A (ja) | 2022-06-09 |
JP2020527849A (ja) | 2020-09-10 |
US10770204B2 (en) | 2020-09-08 |
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