JP7098848B1 - 温度センサおよび温度センサの製造方法 - Google Patents

温度センサおよび温度センサの製造方法 Download PDF

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Publication number
JP7098848B1
JP7098848B1 JP2022518276A JP2022518276A JP7098848B1 JP 7098848 B1 JP7098848 B1 JP 7098848B1 JP 2022518276 A JP2022518276 A JP 2022518276A JP 2022518276 A JP2022518276 A JP 2022518276A JP 7098848 B1 JP7098848 B1 JP 7098848B1
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layer
temperature sensor
accommodation space
heat
pair
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Japanese (ja)
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JPWO2023139652A5 (https=
JPWO2023139652A1 (https=
Inventor
竜行 鈴木
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Shibaura Electronics Co Ltd
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Shibaura Electronics Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08Protective devices, e.g. casings
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2022518276A 2022-01-18 2022-01-18 温度センサおよび温度センサの製造方法 Active JP7098848B1 (ja)

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PCT/JP2022/001627 WO2023139652A1 (ja) 2022-01-18 2022-01-18 温度センサおよび温度センサの製造方法

Publications (3)

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JP7098848B1 true JP7098848B1 (ja) 2022-07-11
JPWO2023139652A1 JPWO2023139652A1 (https=) 2023-07-27
JPWO2023139652A5 JPWO2023139652A5 (https=) 2023-12-19

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US (1) US20240210251A1 (https=)
EP (1) EP4239299B1 (https=)
JP (1) JP7098848B1 (https=)
CN (1) CN117501077B (https=)
WO (1) WO2023139652A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023124584A1 (de) * 2023-09-12 2025-03-13 Tdk Electronics Ag Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002048655A (ja) * 2000-05-24 2002-02-15 Ngk Spark Plug Co Ltd 温度センサ及びその製造管理方法
JP2003262551A (ja) * 2002-03-07 2003-09-19 Kawamura Electric Inc 温度センサ
JP2012145527A (ja) * 2011-01-14 2012-08-02 Semitec Corp 温度センサの取付用具、温度センサ装置およびその取付用具を用いた温度センサの取り付け方法
JP2012211792A (ja) * 2011-03-30 2012-11-01 Mitsubishi Materials Corp 温度センサ
JP2019219173A (ja) * 2018-06-15 2019-12-26 矢崎総業株式会社 排煙温度センサの取付構造
CN210036986U (zh) * 2019-07-29 2020-02-07 微赛技术(北京)有限公司 一种汽车加热坐垫温度传感器固定装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08128901A (ja) 1994-10-31 1996-05-21 Sanyo Electric Co Ltd 温度センサーとパック電池
JP2002188966A (ja) * 2000-12-22 2002-07-05 Ngk Spark Plug Co Ltd 温度センサ及びその製造方法並びに製造管理方法
JP6799518B2 (ja) * 2017-10-12 2020-12-16 株式会社オートネットワーク技術研究所 センサユニット
JP6944341B2 (ja) * 2017-10-28 2021-10-06 株式会社立山科学センサーテクノロジー 温度センサ及びその製造方法
WO2019087755A1 (ja) 2017-10-30 2019-05-09 Semitec株式会社 温度センサ及び温度センサを備えた装置
CN109073480B (zh) * 2018-02-13 2022-07-05 株式会社芝浦电子 温度传感器、传感器元件以及温度传感器的制造方法
WO2021095244A1 (ja) * 2019-11-15 2021-05-20 株式会社芝浦電子 温度センサ、温度センサ素子および温度センサの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002048655A (ja) * 2000-05-24 2002-02-15 Ngk Spark Plug Co Ltd 温度センサ及びその製造管理方法
JP2003262551A (ja) * 2002-03-07 2003-09-19 Kawamura Electric Inc 温度センサ
JP2012145527A (ja) * 2011-01-14 2012-08-02 Semitec Corp 温度センサの取付用具、温度センサ装置およびその取付用具を用いた温度センサの取り付け方法
JP2012211792A (ja) * 2011-03-30 2012-11-01 Mitsubishi Materials Corp 温度センサ
JP2019219173A (ja) * 2018-06-15 2019-12-26 矢崎総業株式会社 排煙温度センサの取付構造
CN210036986U (zh) * 2019-07-29 2020-02-07 微赛技术(北京)有限公司 一种汽车加热坐垫温度传感器固定装置

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Publication number Publication date
CN117501077B (zh) 2025-02-07
CN117501077A (zh) 2024-02-02
US20240210251A1 (en) 2024-06-27
EP4239299A1 (en) 2023-09-06
WO2023139652A1 (ja) 2023-07-27
JPWO2023139652A1 (https=) 2023-07-27
EP4239299A4 (en) 2023-11-08
EP4239299B1 (en) 2025-06-11

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