WO2023139652A1 - 温度センサおよび温度センサの製造方法 - Google Patents

温度センサおよび温度センサの製造方法 Download PDF

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Publication number
WO2023139652A1
WO2023139652A1 PCT/JP2022/001627 JP2022001627W WO2023139652A1 WO 2023139652 A1 WO2023139652 A1 WO 2023139652A1 JP 2022001627 W JP2022001627 W JP 2022001627W WO 2023139652 A1 WO2023139652 A1 WO 2023139652A1
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WO
WIPO (PCT)
Prior art keywords
layer
accommodation space
temperature sensor
heat
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/001627
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English (en)
French (fr)
Japanese (ja)
Inventor
竜行 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Electronics Co Ltd
Original Assignee
Shibaura Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Electronics Co Ltd filed Critical Shibaura Electronics Co Ltd
Priority to PCT/JP2022/001627 priority Critical patent/WO2023139652A1/ja
Priority to US17/906,318 priority patent/US20240210251A1/en
Priority to CN202280003219.XA priority patent/CN117501077B/zh
Priority to JP2022518276A priority patent/JP7098848B1/ja
Priority to EP22768603.7A priority patent/EP4239299B1/en
Publication of WO2023139652A1 publication Critical patent/WO2023139652A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor

Definitions

  • the present invention relates to a thin temperature sensor with a small dimension in the thickness direction.
  • a temperature sensor includes a sensor element that mainly detects temperature, and a protective body that covers the main part of the sensor element.
  • a sensor element basically includes a thermosensitive element, such as a thermistor, and an electric wire connected to the thermosensitive element. Since the thermosensitive element is minute, the size of the temperature sensor in the thickness direction is originally small. However, when the temperature is measured in a small area, a thin temperature sensor with a smaller dimension in the thickness direction is required.
  • Patent Document 2 which will be described later, discloses one having a thickness of 1.5 mm.
  • Patent Literature 1 discloses a thin temperature sensor in which a thermosensitive element and a sensor element having an electric wire connected to the thermosensitive element are covered with a package made of two layers of insulating films.
  • a strong and flexible synthetic resin film such as polyester resin, polyethylene, polypropylene, nylon, fluororesin, styrene resin, vinyl chloride, or the like is used.
  • the two layers of insulating film are bonded with the sensor element in between with an adhesive such as epoxy resin, polyurethane or unsaturated polyester resin.
  • an adhesive such as epoxy resin, polyurethane or unsaturated polyester resin.
  • Patent Document 2 discloses a temperature sensor that can solve this flatness problem.
  • the temperature sensor of Patent Document 2 includes a pair of sheet-like inner layers made of a resin material that are heat-cured or melted and solidified, and an outer layer that is formed of a pair of sheet-like outer layer materials in which both sides of the resin material are flat.
  • the heat sensitive body, the lead wire connected to the heat sensitive body, and the connection portion between the lead wire and the lead wire are covered with an inner layer and sandwiched and covered between a pair of outer layers. According to the temperature sensor of Patent Document 2, the problem of flattening the entire package in Patent Document 1 can be solved.
  • Patent Document 2 shows an example in which the inner layer material is made of fluororesin FEP (perfluoroethylene propene copolymer) and the outer layer material is made of fluororesin PTFE (polytetrafluoroethylene).
  • FEP perfluoroethylene propene copolymer
  • PTFE fluororesin PTFE
  • an object of the present invention is to provide a thin temperature sensor that has no special restrictions on the resin material used and that can be flattened.
  • a temperature sensor includes a sensor element including a heat-sensitive portion and a pair of electric wires electrically connected to the heat-sensitive portion, and a holder that holds the sensor element.
  • the holder in the present invention comprises a pair of second layers arranged to face each other in the thickness direction T, and a first layer joined to the pair of second layers between the pair of second layers.
  • the first layer in the present invention has a housing space made up of through-holes that are open on the front and back and that house the heat-sensitive portion and the electric wire.
  • the accommodation space in the present invention preferably comprises a first layer in which the accommodation space is formed, and a second layer, and the second layer is provided at a position facing one or both of the openings on the front and back sides of the accommodation space.
  • the accommodation space in the present invention preferably has a volume capable of accommodating at least the entire heat-sensitive portion of the sensor element.
  • the accommodation space in the present invention preferably has an opening shape that follows the shape of the sensor element in plan view.
  • the accommodation space in the present invention preferably includes a first accommodation space that accommodates the heat-sensitive portion and a pair of second accommodation spaces that accommodate the pair of electric wires, and one end of each of the pair of second accommodation spaces is connected to the first accommodation space.
  • the pair of second accommodation spaces in the present invention is preferably provided independently on the first layer except for one end connected to the first accommodation space, and the distance between them increases continuously as they move away from the one end.
  • the adhesive be interposed around the heat-sensitive portion, and that the adhesive be interposed also around the electric wire in each of the second housing spaces.
  • the adhesive body in the present invention is preferably composed of gel-like polyvinyl chloride.
  • a pair of the second layer and the first layer in the present invention is preferably made of plate-like polyvinyl chloride, and the first layer has a thickness dimension larger than that of each of the pair of second layers.
  • the present invention provides a method of manufacturing the temperature sensor described above.
  • a first step of housing the heat-sensitive part and the electric wire in the housing space and a second step of holding the heat-sensitive part and the electric wire in the housing space are provided for a holding body having a housing space formed of a through-hole opening on the front and back sides for housing the heat-sensitive part and the electric wire.
  • the second step in the manufacturing method of the present invention is preferably to supply an adhesive to the accommodation space to hold the heat-sensitive part and the electric wire accommodated in the accommodation space in the accommodation space.
  • the holder in the temperature sensor according to the present invention preferably comprises a first layer in which the accommodation space is formed, and a second layer.
  • the second layer is laminated at a position facing one or both of the openings on the front and back sides of the first layer.
  • a thin temperature sensor that has no particular restrictions on the resin materials used for the first layer (inner layer) and the second layer (outer layer), and that can be flattened including the part where the heat sensitive part is provided.
  • FIG. 3 shows elements of the temperature sensor according to the present embodiment, where (a) is a side view and a plan view showing a second layer, and (b) is a plan view showing electric wires.
  • 1 shows the first layer of the temperature sensor according to the present embodiment, (a) is a side view, (b) is a cross-sectional view of ABA in (d), (c) is a cross-sectional view of ABC in (d), and (d) is a plan view.
  • 3 is a plan view showing sensor elements of the temperature sensor according to the embodiment; FIG. It is a figure which shows the manufacturing procedure of the temperature sensor which concerns on this embodiment.
  • FIG. 5 is a diagram illustrating the manufacturing procedure of the temperature sensor according to the embodiment, subsequent to FIG. 5 ; It is a figure for demonstrating the limiting element of the temperature sensor which concerns on this embodiment. It is a figure which shows the modification of a 1st layer.
  • a temperature sensor 1 includes a sensor element 10 mainly responsible for temperature detection and a holder 30 covering a main part of the sensor element 10, as shown in FIG.
  • the temperature sensor 1 includes a holder 30 including a first layer 33 that houses the sensor element 10 and a pair of second layers 31 and 31 that cover the front and back of the first layer 33 .
  • a holder 30 including a first layer 33 that houses the sensor element 10 and a pair of second layers 31 and 31 that cover the front and back of the first layer 33 .
  • the sensor element 10 includes a heat sensitive element 11, a glass protector 13 surrounding the heat sensitive element 11, a pair of first electric wires 15, 15 electrically directly connected to the heat sensitive element 11, and second electric wires 17, 17 electrically connected to the first electric wires 15, 15, respectively.
  • the first electric wires 15, 15 and the second electric wires 17, 17 that are electrically connected constitute a pair of electric wires in the present invention.
  • the side on which the heat sensitive element 11 is provided is defined as the front side F
  • the side from which the second electric wire 17 is led out is defined as the rear side B. As shown in FIG. This definition is relative.
  • a thermistor for example, is preferably used as the heat sensitive element 11 .
  • a thermistor is an abbreviation for thermally sensitive resistor, and is a metal oxide that detects temperature by utilizing the property that electrical resistance changes with temperature.
  • Thermistors are classified into NTC (negative temperature coefficient) thermistors and PTC (positive temperature coefficient) thermistors, but the present embodiment can use any thermistor.
  • An oxide sintered body having a basic composition of manganese oxide (Mn 3 O 4 ) having a typical spinel structure as an NTC thermistor can be used as the heat sensitive element 11 .
  • An oxide sintered body having a composition of M x Mn 3-x O 4 in which M element (one or more of Ni, Co, Fe, Cu, Al and Cr) is added to this basic composition can also be used as the heat sensitive body 11 .
  • M element one or more of Ni, Co, Fe, Cu, Al and Cr
  • one or more of V, B, Ba, Bi, Ca, La, Sb, Sr, Ti and Zr can be added.
  • an oxide sintered body having a basic composition of a complex oxide having a perovskite structure, such as YCrO 3 which is typical for a PTC thermistor, can be used as the heat sensitive element 11 .
  • the glass protector 13 seals the heat sensitive element 11 to keep it airtight, thereby preventing chemical and physical changes in the heat sensitive element 11 caused by environmental conditions in which the temperature sensor 1 is used, and mechanically protecting the heat sensitive element 11.
  • the glass protector 13 covers the front ends of the first electric wires 15 and 15 in addition to the entire heat sensitive element 11 and seals the first electric wires 15 and 15 .
  • the dimension in the thickness direction T (hereinafter referred to as thickness dimension) is not limited as long as a thin temperature sensor 1 can be obtained, but is preferably in the range of 0.3 to 0.8 mm, more preferably in the range of 0.4 to 0.7 mm, and even more preferably in the range of 0.5 to 0.6 mm.
  • the thickness dimension of the protector 13 is typically 0.55 mm. It should be noted that the provision of the protective body 13 made of glass is merely a preferred form in the present invention, and the heat sensitive body 11 alone is sufficient without providing the protective body 13 . Therefore, when the protective body 13 is provided in addition to the heat sensitive element 11, both constitute the heat sensitive section of the present invention, and when only the heat sensitive element 11 is provided, the heat sensitive element 11 alone constitutes the heat sensitive section of the present invention.
  • first electric wire 15 As shown in FIGS. 1 and 4, the first wires 15, 15 are electrically connected to electrodes of the heat sensitive element 11 (not shown). Since the first wires 15, 15 are sealed by the protector 13, Dumet wires having a coefficient of linear expansion close to that of glass are preferably used.
  • a Dumet wire is an electric wire in which an alloy containing iron and nickel as main components is used as a core wire as a conductor and is covered with copper.
  • the first electric wires 15, 15 are continuously spaced apart from the front side F, but extend parallel to the rear B in the range where they are connected to the second electric wires 17, 17. As shown in FIG.
  • the second electric wires 17, 17 include core wires 17A, 17A made of conductors, and insulating coatings 17B, 17B covering the core wires 17A, 17A.
  • the second electric wires 17, 17 are called two-core parallel wires or simply parallel wires.
  • the second electric wires 17, 17 are electrically connected to the first electric wires 15, 15 at core wires 17A, 17A, respectively, by welding, conductive adhesive, or the like.
  • the core wires 17A, 17A of the pair of second electric wires 17, 17 are exposed at the portions connected to the first electric wires 15, 15.
  • Any material can be selected for the second electric wire 17 as long as it has a predetermined heat resistance and durability without being restricted by the coefficient of linear expansion unlike the first electric wire 15 .
  • the holder 30 accommodates and holds the sensor element 10 while ensuring electrical insulation from the outside. Moreover, the holder 30 has no particular restrictions on the material used, and has a configuration that contributes to flattening on the assumption that it is thin.
  • the holder 30 includes a pair of second layers 31, 31 arranged on the front and back in the thickness direction T, and a first layer 33 sandwiched between the second layers 31, 31, as shown in FIG.
  • a receiving space 37 is formed in the first layer 33 , and the main element of the sensor element 10 is held in the first layer 33 while being arranged inside this receiving space 37 .
  • the first layer 33 can be called an inner layer
  • the second layer can be called an outer layer.
  • the pair of second layers 31 , 31 are provided at least at positions facing both the front and back openings of the housing space 37 .
  • the second layer 31 is made of a resin material having a rectangular shape in plan view.
  • the second layer 31 is preferably of polyvinyl chloride (PVC) in sheet form.
  • PVC polyvinyl chloride
  • Polyvinyl chloride has characteristics such as stability to maintain strength over a long period of time, durability to prevent deterioration, and excellent adhesiveness. It also has a feature of having flame retardancy compared to other resin materials.
  • Polyvinyl chloride includes a hard material and a soft material, and it is preferable to use a soft material for the second layer 31 .
  • the soft material has a Shore A hardness of 50 to 100 and is highly flexible.
  • resin materials that can be applied to the second layer 31 include polypropylene, polyethylene, polystyrene, and the like.
  • the dimension in the thickness direction T of the second layer 31 (hereinafter referred to as thickness dimension) is not limited, but in order to obtain a thin temperature sensor 1, the thickness of the second layer 31 is preferably in the range of 0.03 to 0.3 mm, more preferably in the range of 0.05 to 0.2 mm, and further preferably in the range of 0.08 to 0.15 mm.
  • the thickness dimension of the second layer 31 is typically 0.1 mm.
  • the first layer 33 has a rectangular shape in plan view and is made of the same plate-shaped resin material as the second layer 31 .
  • the thickness dimension is different from that of the second layer 31 .
  • the first layer 33 includes a frame 35 made of a resin material and having a rectangular outer shape, and an accommodation space 37 formed inside the frame 35 and formed as a gap.
  • the accommodation space 37 is formed continuously in the thickness direction T through the front and back of the frame 35 as an example.
  • the accommodation space 37 has an opening shape that follows the external shape of the sensor element 10 in plan view, and includes a first accommodation space 37A and a pair of second accommodation spaces 37B, 37B.
  • the first accommodation space 37 ⁇ /b>A is formed in a generally elliptical shape in plan view, and accommodates the glass protector 13 that covers the heat sensitive element 11 .
  • the pair of second accommodation spaces 37B, 37B are formed generally rectangular in plan view, and accommodate the first electric wires 15, 15, respectively.
  • the first housing space 37A is formed on the front side F in the length direction L of the frame 35 and in the center in the width direction W.
  • the first accommodation space 37A is formed to be slightly larger than the protector 13 in all of the length direction L, width direction W, and thickness direction T. As shown in FIG. Therefore, when the protective body 13 is housed in the first housing space 37A, a gap is generated around the protective body 13, but the protective body 13 is held inside the first housing space 37A by interposing the bonding body BL in the gap as will be described later.
  • the first accommodation space 37A has a volume capable of accommodating the entire protective body 13 including the heat sensitive element 11 .
  • the first accommodation space 37A has an elliptical shape corresponding to the protector 13, this is a preferred form, and other forms such as a perfect circle, rectangle, polygon, etc. may be adopted.
  • the thickness of the bonded body BL interposed in the above-described gap can be made uniform. As a result, the protector 13 can be held with a smaller amount of adhesive BL.
  • the second accommodation spaces 37B, 37B extend from the rear B end of the first accommodation space 37A toward the rear B of the frame 35 .
  • the second accommodation spaces 37B, 37B stop before reaching the end of the rear B of the frame 35 .
  • the second accommodation spaces 37B, 37B are formed such that the interval continuously widens toward the rear B from the front F portion connected to the first accommodation space 37A. This corresponds to the fact that the distance between the first electric wires 15, 15 of the sensor element 10 and the heat sensitive element 11 is continuously widened from the front F portion to the rear B.
  • a frame 35 is provided between one second accommodation space 37B and the other second accommodation space 37B. Therefore, the second accommodation spaces 37B, 37B are independent except for the one end portion connected to the first accommodation space 37A. Since the frame 35 exists between the first electric wires 15, 15 accommodated in the second accommodation spaces 37B, 37B, mutual electrical insulation of the first electric wires 15, 15 is ensured. As a preferred form, when the bonded body BL is provided in the second accommodation spaces 37B, 37B around the first electric wires 15, 15, the first electric wires 15, 15 are positioned in the second accommodation spaces 37B, 37B.
  • any method can be used to form the housing space 37 as long as a desired shape can be obtained, but punching using a mold is preferable in consideration of formation cost and formation efficiency.
  • the accommodation space 37 penetrating through the front and back can be easily obtained by punching.
  • Other forming methods include cutting using a knife, cutting using a laser beam, and the like.
  • the first layer 33 has a thickness dimension that allows the protector 13 of the sensor element 10 to be accommodated without protruding from the first accommodation space 37A.
  • the thickness dimension of the protector 13 is as described above, and it must have a thickness dimension that matches or exceeds this thickness dimension. For example, if the thickness dimension of the protector 13 is in the range of 0.55 mm, which is a typical example, the thickness dimension of the first layer 33 may also be 0.55 mm, preferably 0.6 mm with a margin of 0.05 mm.
  • the thickness of the temperature sensor 1 can be suppressed to 1 mm in consideration of the thickness of the adhesive body BL interposed between the second layers 31, 31 and the first layer 33. By doing so, the temperature sensor 1 can be very easily deformed in the thickness direction T in combination with the flexibility of the polyvinyl chloride forming the second layer 31 and the first layer 33 .
  • the state after the adhesive G has hardened is called an adhesive body BL for distinction.
  • FIGS. 5 and 6 Next, the manufacturing procedure of the temperature sensor 1 will be described with reference to FIGS. 5 and 6.
  • FIG. First as shown in FIG. 5, the first layer 33 and the sensor element 10 are placed between the spaced apart second layers 31 , 31 . At this time, the sensor element 10 is positioned with respect to the accommodation space 37 of the first layer 33, the protector 13 is arranged at the position corresponding to the first accommodation space 37A, and the first electric wires 15, 15 are arranged at the positions corresponding to the second accommodation spaces 37B, 37B. It is assumed that the core wires 17A of the first electric wire 15 and the second electric wire 17 are already electrically and mechanically connected.
  • Bonding surfaces 32, 32 which are surfaces of the second layers 31, 31 facing the first layer 33, are coated with an adhesive G indicated by a chain double-dashed line in the figure.
  • the adhesive G may be applied to the front and back bonding surfaces 34 , 34 of the first layer 33 instead of or in addition to the second layers 31 , 31 .
  • the adhesive G can be of any material as long as it can bond the second layers 31 , 31 and the first layer 33 and hold the main part of the sensor element 10 inside the housing space 37 .
  • an adhesive G made of thermosetting polyvinyl chloride is used.
  • Polyvinyl chloride is known as a thermoplastic resin, and as is well known among those skilled in the art, it becomes a sol with excellent fluidity at room temperature by being mixed with a plasticizer, so it can be easily applied as an adhesive G.
  • the sol-like polyvinyl chloride is cured into a gel when heated.
  • a heating temperature for gelation is 200° C. as an example.
  • the first layer 33 is placed on the second layer 31 on the lower side.
  • the protector 13 is accommodated in the first accommodation space 37A of the first layer 33, and the first wire 15 is accommodated in the second accommodation space 37B.
  • the first electric wire 15 protrudes from the second housing space 37B on the rearward B side of the predetermined position.
  • the adhesive G is supplied to the first accommodation space 37A and the second accommodation space 37B.
  • the adhesive G fills the gap between the protective body 13 and the frame 35 in the first accommodation space 37A, and fills the gap between the first wire 15 and the frame 35 in the second accommodation space 37B.
  • the adhesive G is composed of sol-like vinyl chloride, the adhesive G at this point has fluidity.
  • a pressing force accompanied by heating is applied to the second layers 31,31.
  • the adhesive G made of sol-like vinyl chloride is cured into a gel state, and the first layer 33 receives pressing force from the front and back, thereby improving the bonding strength of the adhesive G between the second layers 31, 31 and the first layer 33.
  • FIG. 7A shows the case where the thickness 37T of the first layer 33 is larger than the thickness 13R of the protector 13 (37T>13R)
  • FIG. 37T ⁇ 13R shows the case where the thickness 13R of the protector 13 and the thickness 37T of the accommodation space 37 are equal
  • the temperature sensor 1 is thin, it is used in a narrow space. In this state, an external load may be applied in the thickness direction T to the temperature sensor 1 . This load is applied to the protector 13 and the heat sensitive element 11 through the second layers 31,31. If this load is large, there is a risk that the protector 13 made of glass or the heat sensitive element 11 will be damaged. Therefore, if there is a possibility that a load will be applied during temperature measurement, it is desirable to reduce the load on the protector 13 and the heat sensitive element 11 .
  • the thickness dimension 13R of the protector 13 in the third mode of FIG. 7(c) is larger than the thickness dimension 37T of the accommodation space 37 of the first layer 33, part of the protector 13 protrudes outside the first accommodation space 37A.
  • the second layers 31, 31 are arranged in the portion of the protective body 13 protruding from the first accommodation space 37A, but since the first layer 33 is not interposed between the second layers 31, 31 and the protective body 13, the external load is greater than in the first and second modes.
  • the thickness dimension 13R of the protective body 13 in the first mode of FIG. 7(a) is larger than the thickness dimension 37T of the housing space 37, the entirety of the protective body 13 is housed inside the first housing space 37A.
  • the adhesive bodies BL exist on the upper and lower sides of the protector 13 in the drawing inside the first accommodation space 37A. Therefore, even if a load is applied in the thickness direction T in the first mode, the load is applied to the protector 13 and the heat sensitive element 11 through the adhesive BL in addition to the second layers 31 , 31 .
  • the adhesive BL is gel-like, the adhesive BL functions as a buffer for the load applied to the protector 13, so the load applied to the protector 13 and the heat sensitive element 11 can be reduced compared to the third embodiment.
  • the protective body 13 of the sensor element 10 and the first wires 15 , 15 are housed and held in the housing space 37 of the first layer 33 .
  • the adhesive G it is sufficient to use the adhesive G as necessary, and it is not necessary to melt only the first layer 33 . Therefore, there is no need to consider the relationship between the melting points of the second layers 31 and 31 and the first layer 33, and there are no particular restrictions on the resin materials forming the second layers 31 and 31 and the first layer 33.
  • the diameter R of the protector 13 is set to be equal to or smaller than the thickness T of the first layer 33, so the protector 13 fits inside the first accommodation space 37A and does not protrude. Therefore, the second layers 31, 31 can be formed flat even in the portion of the protective body 13 where the thickness dimension of the sensor element 10 is the largest.
  • the resin materials used for the second layers 31 and 31 and the first layer 33 there is no particular restriction on the resin materials used for the second layers 31 and 31 and the first layer 33, and a thin temperature sensor 1 that can be flattened including the portion where the protector 13 is provided is provided.
  • the accommodation space 37 in this embodiment is composed of a first accommodation space 37A having a shape corresponding to the protector 13 and second accommodation spaces 37B, 37B having a shape corresponding to the first electric wires 15,15. Therefore, by arranging the protector 13 in the first accommodation space 37A and arranging the first electric wires 15, 15 in the second accommodation spaces 37B, 37B, the sensor element 10 can be positioned with respect to the first layer 33, and the heat sensitive element 11, which is particularly important for temperature measurement, can be positioned at a desired position.
  • the temperature sensor 1 has the second layers 31, 31 and the first layer 33 made of highly flexible polyvinyl chloride, and the thickness can be suppressed to, for example, about 1 to 2 mm. Therefore, the temperature sensor 1 is extremely flexible, and elastic deformation in the thickness direction T is easy. Then, when the temperature sensor 1 is provided in a narrow gap, even if the interval of this gap changes somewhat, the thickness of the temperature sensor 1 fluctuates according to this change, so that the state of surface contact with the object to be measured can be maintained.
  • the configurations listed in the above embodiments can be selected or replaced with other configurations without departing from the gist of the present invention.
  • the second accommodation space 37B provided in the first layer 33 may be extended to form an extension chamber 37C that reaches the rear B end of the frame 35 .
  • the first electric wire 15 can be housed in the extension chamber 37C and pulled out from the rear B end.
  • the first accommodation space 37A and the second accommodation space 37B pass through the front and back of the first layer 33, but they may have a groove shape up to a predetermined range in the thickness direction T similarly to the extension chamber 37C.
  • the first accommodation space 37A and the second accommodation space 37B which are similar in shape to the sensor element 10 in plan view, are formed, but the present invention is not limited to this.
  • the top priority is to accommodate the protector 13 and the first wires 15, 15 in the accommodation space 37
  • the shape of the accommodation space 37 in a plan view is arbitrary. Therefore, for example, the accommodation space 37 may be rectangular in plan view.
  • the temperature sensor 1 has a substantially constant thickness dimension from the front F to the rear B
  • the present invention is not limited to this.
  • the diameter of the core wire 17A of the second electric wire 17 is considerably larger than the thickness dimension of the holder 30, the thickness dimension of the portions of the second layers 31, 31 covering the core wire 17A and the insulating coating 17B will be large.
  • the temperature sensor 1 is provided with a pair of second layers 31, 31 on the front and back sides of the first layer 33 as a preferred embodiment, the present invention is not limited to this. In other words, one or both of the second layers 31 and 31 need not be provided if the sensor element 10 can be held to the first layer 33 only with an adhesive, for example.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
PCT/JP2022/001627 2022-01-18 2022-01-18 温度センサおよび温度センサの製造方法 Ceased WO2023139652A1 (ja)

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Application Number Priority Date Filing Date Title
PCT/JP2022/001627 WO2023139652A1 (ja) 2022-01-18 2022-01-18 温度センサおよび温度センサの製造方法
US17/906,318 US20240210251A1 (en) 2022-01-18 2022-01-18 Temperature sensor and method of manufacturing temperature sensor
CN202280003219.XA CN117501077B (zh) 2022-01-18 2022-01-18 温度传感器及温度传感器的制造方法
JP2022518276A JP7098848B1 (ja) 2022-01-18 2022-01-18 温度センサおよび温度センサの製造方法
EP22768603.7A EP4239299B1 (en) 2022-01-18 2022-01-18 Temperature sensor and method for producing temperature sensor

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PCT/JP2022/001627 WO2023139652A1 (ja) 2022-01-18 2022-01-18 温度センサおよび温度センサの製造方法

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08128901A (ja) 1994-10-31 1996-05-21 Sanyo Electric Co Ltd 温度センサーとパック電池
JP2002048655A (ja) * 2000-05-24 2002-02-15 Ngk Spark Plug Co Ltd 温度センサ及びその製造管理方法
JP2012145527A (ja) * 2011-01-14 2012-08-02 Semitec Corp 温度センサの取付用具、温度センサ装置およびその取付用具を用いた温度センサの取り付け方法
JP2012211792A (ja) * 2011-03-30 2012-11-01 Mitsubishi Materials Corp 温度センサ
WO2019087755A1 (ja) 2017-10-30 2019-05-09 Ｓｅｍｉｔｅｃ株式会社 温度センサ及び温度センサを備えた装置
JP2019219173A (ja) * 2018-06-15 2019-12-26 矢崎総業株式会社 排煙温度センサの取付構造
CN210036986U (zh) * 2019-07-29 2020-02-07 微赛技术(北京)有限公司 一种汽车加热坐垫温度传感器固定装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002188966A (ja) * 2000-12-22 2002-07-05 Ngk Spark Plug Co Ltd 温度センサ及びその製造方法並びに製造管理方法
JP2003262551A (ja) * 2002-03-07 2003-09-19 Kawamura Electric Inc 温度センサ
JP6799518B2 (ja) * 2017-10-12 2020-12-16 株式会社オートネットワーク技術研究所 センサユニット
JP6944341B2 (ja) * 2017-10-28 2021-10-06 株式会社立山科学センサーテクノロジー 温度センサ及びその製造方法
CN109073480B (zh) * 2018-02-13 2022-07-05 株式会社芝浦电子 温度传感器、传感器元件以及温度传感器的制造方法
WO2021095244A1 (ja) * 2019-11-15 2021-05-20 株式会社芝浦電子 温度センサ、温度センサ素子および温度センサの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08128901A (ja) 1994-10-31 1996-05-21 Sanyo Electric Co Ltd 温度センサーとパック電池
JP2002048655A (ja) * 2000-05-24 2002-02-15 Ngk Spark Plug Co Ltd 温度センサ及びその製造管理方法
JP2012145527A (ja) * 2011-01-14 2012-08-02 Semitec Corp 温度センサの取付用具、温度センサ装置およびその取付用具を用いた温度センサの取り付け方法
JP2012211792A (ja) * 2011-03-30 2012-11-01 Mitsubishi Materials Corp 温度センサ
WO2019087755A1 (ja) 2017-10-30 2019-05-09 Ｓｅｍｉｔｅｃ株式会社 温度センサ及び温度センサを備えた装置
JP2019219173A (ja) * 2018-06-15 2019-12-26 矢崎総業株式会社 排煙温度センサの取付構造
CN210036986U (zh) * 2019-07-29 2020-02-07 微赛技术(北京)有限公司 一种汽车加热坐垫温度传感器固定装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4239299A4

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