CN117501077B - 温度传感器及温度传感器的制造方法 - Google Patents
温度传感器及温度传感器的制造方法 Download PDFInfo
- Publication number
- CN117501077B CN117501077B CN202280003219.XA CN202280003219A CN117501077B CN 117501077 B CN117501077 B CN 117501077B CN 202280003219 A CN202280003219 A CN 202280003219A CN 117501077 B CN117501077 B CN 117501077B
- Authority
- CN
- China
- Prior art keywords
- layer
- temperature sensor
- accommodation space
- space
- heat sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/001627 WO2023139652A1 (ja) | 2022-01-18 | 2022-01-18 | 温度センサおよび温度センサの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117501077A CN117501077A (zh) | 2024-02-02 |
| CN117501077B true CN117501077B (zh) | 2025-02-07 |
Family
ID=82361478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280003219.XA Active CN117501077B (zh) | 2022-01-18 | 2022-01-18 | 温度传感器及温度传感器的制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240210251A1 (https=) |
| EP (1) | EP4239299B1 (https=) |
| JP (1) | JP7098848B1 (https=) |
| CN (1) | CN117501077B (https=) |
| WO (1) | WO2023139652A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023124584A1 (de) * | 2023-09-12 | 2025-03-13 | Tdk Electronics Ag | Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109073480A (zh) * | 2018-02-13 | 2018-12-21 | 株式会社芝浦电子 | 温度传感器、传感器元件以及温度传感器的制造方法 |
| CN110608807A (zh) * | 2018-06-15 | 2019-12-24 | 矢崎总业株式会社 | 排烟温度传感器的安装结构 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08128901A (ja) | 1994-10-31 | 1996-05-21 | Sanyo Electric Co Ltd | 温度センサーとパック電池 |
| JP2002048655A (ja) * | 2000-05-24 | 2002-02-15 | Ngk Spark Plug Co Ltd | 温度センサ及びその製造管理方法 |
| JP2002188966A (ja) * | 2000-12-22 | 2002-07-05 | Ngk Spark Plug Co Ltd | 温度センサ及びその製造方法並びに製造管理方法 |
| JP2003262551A (ja) * | 2002-03-07 | 2003-09-19 | Kawamura Electric Inc | 温度センサ |
| JP2012145527A (ja) * | 2011-01-14 | 2012-08-02 | Semitec Corp | 温度センサの取付用具、温度センサ装置およびその取付用具を用いた温度センサの取り付け方法 |
| JP5574117B2 (ja) * | 2011-03-30 | 2014-08-20 | 三菱マテリアル株式会社 | 温度センサ |
| JP6799518B2 (ja) * | 2017-10-12 | 2020-12-16 | 株式会社オートネットワーク技術研究所 | センサユニット |
| JP6944341B2 (ja) * | 2017-10-28 | 2021-10-06 | 株式会社立山科学センサーテクノロジー | 温度センサ及びその製造方法 |
| WO2019087755A1 (ja) | 2017-10-30 | 2019-05-09 | Semitec株式会社 | 温度センサ及び温度センサを備えた装置 |
| CN210036986U (zh) * | 2019-07-29 | 2020-02-07 | 微赛技术(北京)有限公司 | 一种汽车加热坐垫温度传感器固定装置 |
| WO2021095244A1 (ja) * | 2019-11-15 | 2021-05-20 | 株式会社芝浦電子 | 温度センサ、温度センサ素子および温度センサの製造方法 |
-
2022
- 2022-01-18 JP JP2022518276A patent/JP7098848B1/ja active Active
- 2022-01-18 WO PCT/JP2022/001627 patent/WO2023139652A1/ja not_active Ceased
- 2022-01-18 EP EP22768603.7A patent/EP4239299B1/en active Active
- 2022-01-18 CN CN202280003219.XA patent/CN117501077B/zh active Active
- 2022-01-18 US US17/906,318 patent/US20240210251A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109073480A (zh) * | 2018-02-13 | 2018-12-21 | 株式会社芝浦电子 | 温度传感器、传感器元件以及温度传感器的制造方法 |
| CN110608807A (zh) * | 2018-06-15 | 2019-12-24 | 矢崎总业株式会社 | 排烟温度传感器的安装结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117501077A (zh) | 2024-02-02 |
| JP7098848B1 (ja) | 2022-07-11 |
| US20240210251A1 (en) | 2024-06-27 |
| EP4239299A1 (en) | 2023-09-06 |
| WO2023139652A1 (ja) | 2023-07-27 |
| JPWO2023139652A1 (https=) | 2023-07-27 |
| EP4239299A4 (en) | 2023-11-08 |
| EP4239299B1 (en) | 2025-06-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |