JP7096255B2 - 半導体構成 - Google Patents

半導体構成 Download PDF

Info

Publication number
JP7096255B2
JP7096255B2 JP2019541259A JP2019541259A JP7096255B2 JP 7096255 B2 JP7096255 B2 JP 7096255B2 JP 2019541259 A JP2019541259 A JP 2019541259A JP 2019541259 A JP2019541259 A JP 2019541259A JP 7096255 B2 JP7096255 B2 JP 7096255B2
Authority
JP
Japan
Prior art keywords
inverter
modules
semiconductor
heat sink
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019541259A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020505900A (ja
JP2020505900A5 (https=
Inventor
デイビッド ハート サイモン
ウールマー ティム
スチュアート マラム クリストファー
ヒルマン トム
フィリップス リチャード
Original Assignee
ヤサ リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤサ リミテッド filed Critical ヤサ リミテッド
Publication of JP2020505900A publication Critical patent/JP2020505900A/ja
Publication of JP2020505900A5 publication Critical patent/JP2020505900A5/ja
Application granted granted Critical
Publication of JP7096255B2 publication Critical patent/JP7096255B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
JP2019541259A 2017-01-30 2018-01-30 半導体構成 Active JP7096255B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1701487.9A GB2563186A (en) 2017-01-30 2017-01-30 Semiconductor arrangement
GB1701487.9 2017-01-30
PCT/GB2018/050258 WO2018138530A1 (en) 2017-01-30 2018-01-30 Semiconductor arrangement

Publications (3)

Publication Number Publication Date
JP2020505900A JP2020505900A (ja) 2020-02-20
JP2020505900A5 JP2020505900A5 (https=) 2020-04-02
JP7096255B2 true JP7096255B2 (ja) 2022-07-05

Family

ID=58462769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019541259A Active JP7096255B2 (ja) 2017-01-30 2018-01-30 半導体構成

Country Status (9)

Country Link
US (1) US11276622B2 (https=)
EP (1) EP3574522B1 (https=)
JP (1) JP7096255B2 (https=)
KR (1) KR20190131013A (https=)
CN (1) CN110520982A (https=)
BR (1) BR112019011897A2 (https=)
GB (1) GB2563186A (https=)
RU (1) RU2019126805A (https=)
WO (1) WO2018138530A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2559180B (en) 2017-01-30 2020-09-09 Yasa Ltd Semiconductor cooling arrangement
DE102019200020A1 (de) 2019-01-03 2020-07-09 Zf Friedrichshafen Ag Busbaranordnung und Leistungselektronikanordnungen
DE102020106492A1 (de) 2019-04-12 2020-10-15 Infineon Technologies Ag Chip -package, verfahren zum bilden eines chip -packages, halbleitervorrichtung, halbleiteranordnung, dreiphasensystem, verfahren zum bilden einer halbleitervorrichtung und verfahren zum bilden einer halbleiteranordnung
KR102710615B1 (ko) * 2019-04-25 2024-09-27 아메리칸 액슬 앤드 매뉴팩쳐링, 인코포레이티드 전기 구동 모듈
CN114342209A (zh) 2019-09-13 2022-04-12 米沃奇电动工具公司 具有宽带隙半导体的功率转换器
EP4727278A2 (en) 2019-11-18 2026-04-15 Huawei Digital Power Technologies Co., Ltd. Electronic component with enclosure frame, circuit board with electronic component, and electronic device
DE102019133377B4 (de) * 2019-12-06 2023-08-31 Sma Solar Technology Ag Wechselrichter mit kompakter bauform
US11967899B2 (en) 2020-05-22 2024-04-23 Marel Power Solutions Fluid cooled inverter
US12041759B2 (en) * 2020-07-31 2024-07-16 Smart Wires Inc. Scalable modular cooling unit having voltage isolation
CN111984098B (zh) * 2020-08-28 2022-06-07 苏州浪潮智能科技有限公司 一种计算机系统的散热方法、装置、设备及介质
CN114285297A (zh) * 2020-09-27 2022-04-05 华为数字能源技术有限公司 逆变器、动力总成及电动车
GB2602341B (en) * 2020-12-23 2023-11-08 Yasa Ltd Semiconductor cooling arrangement with improved baffle
GB2602340B (en) * 2020-12-23 2024-04-03 Yasa Ltd Semiconductor cooling arrangement with improved heatsink
KR20250143856A (ko) 2021-03-15 2025-10-02 아메리칸 액슬 앤드 매뉴팩쳐링, 인코포레이티드 전기 구동 유닛
DE102021203801A1 (de) * 2021-04-16 2022-10-20 Molabo Gmbh Gekühltes Hochstromsystem
DE102021122769A1 (de) 2021-09-02 2023-03-02 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Umrichter eines zumindest teilweise elektrisch angetriebenen Kraftfahrzeugs und Kraftfahrzeug
CA3232380A1 (en) 2021-09-15 2023-03-23 Marel Power Solutions, Inc. Compact power converter
US12193202B2 (en) 2021-09-15 2025-01-07 Marel Power Solutions, Inc. Air cooled compact power systems
DE102021128947A1 (de) 2021-11-08 2023-05-11 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Pulswechselrichter sowie Antriebsstrang
CN118633229A (zh) 2021-12-01 2024-09-10 美国轮轴制造公司 具有与通过壳体总成传递的梁载荷隔离的电机总成的电驱动单元
CN115185342B (zh) * 2022-05-31 2025-09-16 超聚变数字技术有限公司 一种服务器及其相关设备
DE102022115995A1 (de) 2022-06-28 2023-12-28 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Vorrichtung mit einem Pulswechselrichter
KR102734589B1 (ko) * 2022-11-15 2024-11-25 전북대학교산학협력단 급속충전 전원장치용 전력반도체 방열판

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165534A (ja) 2004-11-11 2006-06-22 Denso Corp 半導体装置
JP2008109131A (ja) 2006-10-25 2008-05-08 Gm Global Technology Operations Inc 内蔵式冷却システムを有する電力モジュール
US20100302733A1 (en) 2009-05-29 2010-12-02 Gm Global Technology Operations, Inc. Stacked busbar assembly with integrated cooling
JP2012239337A (ja) 2011-05-13 2012-12-06 Denso Corp 電力変換装置
JP2013138609A (ja) 2010-03-05 2013-07-11 Hitachi Automotive Systems Ltd 半導体モジュール及びこれを備えた電力変換装置
US20170012030A1 (en) 2015-07-09 2017-01-12 Delta Electronics,Inc. Power module with the integration of control circuit

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4010489A (en) 1975-05-19 1977-03-01 General Motors Corporation High power semiconductor device cooling apparatus and method
US4399484A (en) 1981-03-10 1983-08-16 The United States Of America As Represented By The Secretary Of The Air Force Integral electric module and assembly jet cooling system
US5003376A (en) * 1989-03-28 1991-03-26 Coriolis Corporation Cooling of large high power semi-conductors
US5099884A (en) 1991-05-24 1992-03-31 Ntn Technical Center (U.S.A.), Inc. Electrorheological fluid plate valve
US5380956A (en) 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5841634A (en) 1997-03-12 1998-11-24 Delco Electronics Corporation Liquid-cooled baffle series/parallel heat sink
FR2786655B1 (fr) 1998-11-27 2001-11-23 Alstom Technology Dispositif electronique de puissance
JP4009056B2 (ja) 2000-05-25 2007-11-14 三菱電機株式会社 パワーモジュール
JP3501134B2 (ja) * 2001-03-13 2004-03-02 松下電器産業株式会社 高周波加熱装置用スイッチング電源
GB2403354B (en) * 2002-06-10 2005-03-23 Visteon Global Tech Inc Machine integrated power
JP3858834B2 (ja) * 2003-02-24 2006-12-20 オンキヨー株式会社 半導体素子の放熱器
EP1683403B1 (en) 2003-11-14 2011-02-09 DET International Holding Limited Power supply with improved cooling
US8125781B2 (en) * 2004-11-11 2012-02-28 Denso Corporation Semiconductor device
JP4729336B2 (ja) * 2005-04-27 2011-07-20 株式会社豊田自動織機 パワーモジュール用基板
JP5227532B2 (ja) 2007-04-02 2013-07-03 日立オートモティブシステムズ株式会社 インバータ回路用の半導体モジュール
ES2345118T3 (es) * 2007-09-28 2010-09-15 EBERSPACHER CONTROLS GMBH & CO. KG Barra conductora con eliminacion de calor.
US7641490B2 (en) * 2007-12-18 2010-01-05 Gm Global Technology Operations, Inc. Liquid-cooled inverter assembly
US7916480B2 (en) * 2007-12-19 2011-03-29 GM Global Technology Operations LLC Busbar assembly with integrated cooling
US20100038774A1 (en) 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
DE102008061489A1 (de) 2008-12-10 2010-06-17 Siemens Aktiengesellschaft Stromrichtermodul mit gekühlter Verschienung
US20100147492A1 (en) * 2008-12-10 2010-06-17 Ronald David Conry IGBT cooling method
GB0902394D0 (en) 2009-02-13 2009-04-01 Isis Innovation Electric machine- cooling
JP2011050197A (ja) 2009-08-28 2011-03-10 Hitachi Ltd 電力変換装置
US8169779B2 (en) 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
JP2012016095A (ja) * 2010-06-29 2012-01-19 Denso Corp 電力変換装置
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US9247672B2 (en) 2013-01-21 2016-01-26 Parker-Hannifin Corporation Passively controlled smart microjet cooling array
WO2014147963A1 (ja) * 2013-03-19 2014-09-25 富士電機株式会社 冷却装置及びこれを備えた電力変換装置
US9414520B2 (en) 2013-05-28 2016-08-09 Hamilton Sundstrand Corporation Immersion cooled motor controller
WO2016008509A1 (en) 2014-07-15 2016-01-21 Abb Technology Ltd Electric module for improved thermal management in electrical equipments
JP2016158358A (ja) * 2015-02-24 2016-09-01 株式会社デンソー 半導体モジュール
JP2017163065A (ja) 2016-03-11 2017-09-14 富士通株式会社 電子機器
GB2559180B (en) 2017-01-30 2020-09-09 Yasa Ltd Semiconductor cooling arrangement

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165534A (ja) 2004-11-11 2006-06-22 Denso Corp 半導体装置
JP2008109131A (ja) 2006-10-25 2008-05-08 Gm Global Technology Operations Inc 内蔵式冷却システムを有する電力モジュール
US20100302733A1 (en) 2009-05-29 2010-12-02 Gm Global Technology Operations, Inc. Stacked busbar assembly with integrated cooling
JP2013138609A (ja) 2010-03-05 2013-07-11 Hitachi Automotive Systems Ltd 半導体モジュール及びこれを備えた電力変換装置
JP2012239337A (ja) 2011-05-13 2012-12-06 Denso Corp 電力変換装置
US20170012030A1 (en) 2015-07-09 2017-01-12 Delta Electronics,Inc. Power module with the integration of control circuit

Also Published As

Publication number Publication date
EP3574522A1 (en) 2019-12-04
KR20190131013A (ko) 2019-11-25
WO2018138530A1 (en) 2018-08-02
JP2020505900A (ja) 2020-02-20
US11276622B2 (en) 2022-03-15
BR112019011897A2 (pt) 2019-10-22
GB2563186A (en) 2018-12-12
CN110520982A (zh) 2019-11-29
EP3574522B1 (en) 2021-03-03
GB201701487D0 (en) 2017-03-15
RU2019126805A (ru) 2021-03-01
US20200227334A1 (en) 2020-07-16
RU2019126805A3 (https=) 2021-03-19

Similar Documents

Publication Publication Date Title
JP7096255B2 (ja) 半導体構成
CN110537257B (zh) 半导体冷却布置
CN101533833B (zh) 具有集成冷却的汇流条组件
US6822850B2 (en) Laminated bus bar for use with a power conversion configuration
US6885553B2 (en) Bus bar assembly for use with a compact power conversion assembly
US7068507B2 (en) Compact liquid converter assembly
CN102246611B (zh) 母线系统得到冷却的变流器模块
US6721181B1 (en) Elongated heat sink for use in converter assemblies
CN101901638A (zh) 具有集成冷却装置的堆叠汇流排组件
KR101936281B1 (ko) 전력 전자 디바이스들의 냉각을 위한 시스템들 및 방법들
AU2004216692B2 (en) Electrical bus with associated porous metal heat sink and method of manufacturing same
US6956742B2 (en) Compact liquid converter assembly
WO2006103721A1 (ja) 電力変換装置の冷却構造
US20240324152A1 (en) Cooling Apparatus
GB2565071A (en) Semiconductor module
Mohamed et al. Design of a circumscribing polygon wide bandgap based integrated modular motor drive topology with thermally decoupled windings and power converters
WO2025150090A1 (ja) 電子機器、およびこの電子機器を備えた電動駆動装置
CN119561347A (zh) 一种基于多个igbt并联的功率模块及电气设备
CN118830078A (zh) 功率设备及用于组装功率设备的方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190731

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20201216

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20211124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20211207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220307

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220531

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220623

R150 Certificate of patent or registration of utility model

Ref document number: 7096255

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250