RU2019126805A - Полупроводниковый узел - Google Patents

Полупроводниковый узел Download PDF

Info

Publication number
RU2019126805A
RU2019126805A RU2019126805A RU2019126805A RU2019126805A RU 2019126805 A RU2019126805 A RU 2019126805A RU 2019126805 A RU2019126805 A RU 2019126805A RU 2019126805 A RU2019126805 A RU 2019126805A RU 2019126805 A RU2019126805 A RU 2019126805A
Authority
RU
Russia
Prior art keywords
modules
converter
converter according
semiconductor
circuit board
Prior art date
Application number
RU2019126805A
Other languages
English (en)
Russian (ru)
Other versions
RU2019126805A3 (https=
Inventor
Саймон Дэвид ХАРТ
Тим ВУЛМЕР
Кристофер Стюарт МАЛАМ
Том ХИЛЛМАН
Ричард ФИЛЛИПС
Original Assignee
Яса Лимитед
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Яса Лимитед filed Critical Яса Лимитед
Publication of RU2019126805A publication Critical patent/RU2019126805A/ru
Publication of RU2019126805A3 publication Critical patent/RU2019126805A3/ru

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
RU2019126805A 2017-01-30 2018-01-30 Полупроводниковый узел RU2019126805A (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1701487.9A GB2563186A (en) 2017-01-30 2017-01-30 Semiconductor arrangement
GB1701487.9 2017-01-30
PCT/GB2018/050258 WO2018138530A1 (en) 2017-01-30 2018-01-30 Semiconductor arrangement

Publications (2)

Publication Number Publication Date
RU2019126805A true RU2019126805A (ru) 2021-03-01
RU2019126805A3 RU2019126805A3 (https=) 2021-03-19

Family

ID=58462769

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2019126805A RU2019126805A (ru) 2017-01-30 2018-01-30 Полупроводниковый узел

Country Status (9)

Country Link
US (1) US11276622B2 (https=)
EP (1) EP3574522B1 (https=)
JP (1) JP7096255B2 (https=)
KR (1) KR20190131013A (https=)
CN (1) CN110520982A (https=)
BR (1) BR112019011897A2 (https=)
GB (1) GB2563186A (https=)
RU (1) RU2019126805A (https=)
WO (1) WO2018138530A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2559180B (en) 2017-01-30 2020-09-09 Yasa Ltd Semiconductor cooling arrangement
DE102019200020A1 (de) 2019-01-03 2020-07-09 Zf Friedrichshafen Ag Busbaranordnung und Leistungselektronikanordnungen
DE102020106492A1 (de) 2019-04-12 2020-10-15 Infineon Technologies Ag Chip -package, verfahren zum bilden eines chip -packages, halbleitervorrichtung, halbleiteranordnung, dreiphasensystem, verfahren zum bilden einer halbleitervorrichtung und verfahren zum bilden einer halbleiteranordnung
KR102710615B1 (ko) * 2019-04-25 2024-09-27 아메리칸 액슬 앤드 매뉴팩쳐링, 인코포레이티드 전기 구동 모듈
CN114342209A (zh) 2019-09-13 2022-04-12 米沃奇电动工具公司 具有宽带隙半导体的功率转换器
EP4727278A2 (en) 2019-11-18 2026-04-15 Huawei Digital Power Technologies Co., Ltd. Electronic component with enclosure frame, circuit board with electronic component, and electronic device
DE102019133377B4 (de) * 2019-12-06 2023-08-31 Sma Solar Technology Ag Wechselrichter mit kompakter bauform
US11967899B2 (en) 2020-05-22 2024-04-23 Marel Power Solutions Fluid cooled inverter
US12041759B2 (en) * 2020-07-31 2024-07-16 Smart Wires Inc. Scalable modular cooling unit having voltage isolation
CN111984098B (zh) * 2020-08-28 2022-06-07 苏州浪潮智能科技有限公司 一种计算机系统的散热方法、装置、设备及介质
CN114285297A (zh) * 2020-09-27 2022-04-05 华为数字能源技术有限公司 逆变器、动力总成及电动车
GB2602341B (en) * 2020-12-23 2023-11-08 Yasa Ltd Semiconductor cooling arrangement with improved baffle
GB2602340B (en) * 2020-12-23 2024-04-03 Yasa Ltd Semiconductor cooling arrangement with improved heatsink
KR20250143856A (ko) 2021-03-15 2025-10-02 아메리칸 액슬 앤드 매뉴팩쳐링, 인코포레이티드 전기 구동 유닛
DE102021203801A1 (de) * 2021-04-16 2022-10-20 Molabo Gmbh Gekühltes Hochstromsystem
DE102021122769A1 (de) 2021-09-02 2023-03-02 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Umrichter eines zumindest teilweise elektrisch angetriebenen Kraftfahrzeugs und Kraftfahrzeug
CA3232380A1 (en) 2021-09-15 2023-03-23 Marel Power Solutions, Inc. Compact power converter
US12193202B2 (en) 2021-09-15 2025-01-07 Marel Power Solutions, Inc. Air cooled compact power systems
DE102021128947A1 (de) 2021-11-08 2023-05-11 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Pulswechselrichter sowie Antriebsstrang
CN118633229A (zh) 2021-12-01 2024-09-10 美国轮轴制造公司 具有与通过壳体总成传递的梁载荷隔离的电机总成的电驱动单元
CN115185342B (zh) * 2022-05-31 2025-09-16 超聚变数字技术有限公司 一种服务器及其相关设备
DE102022115995A1 (de) 2022-06-28 2023-12-28 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Vorrichtung mit einem Pulswechselrichter
KR102734589B1 (ko) * 2022-11-15 2024-11-25 전북대학교산학협력단 급속충전 전원장치용 전력반도체 방열판

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4010489A (en) 1975-05-19 1977-03-01 General Motors Corporation High power semiconductor device cooling apparatus and method
US4399484A (en) 1981-03-10 1983-08-16 The United States Of America As Represented By The Secretary Of The Air Force Integral electric module and assembly jet cooling system
US5003376A (en) * 1989-03-28 1991-03-26 Coriolis Corporation Cooling of large high power semi-conductors
US5099884A (en) 1991-05-24 1992-03-31 Ntn Technical Center (U.S.A.), Inc. Electrorheological fluid plate valve
US5380956A (en) 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5841634A (en) 1997-03-12 1998-11-24 Delco Electronics Corporation Liquid-cooled baffle series/parallel heat sink
FR2786655B1 (fr) 1998-11-27 2001-11-23 Alstom Technology Dispositif electronique de puissance
JP4009056B2 (ja) 2000-05-25 2007-11-14 三菱電機株式会社 パワーモジュール
JP3501134B2 (ja) * 2001-03-13 2004-03-02 松下電器産業株式会社 高周波加熱装置用スイッチング電源
GB2403354B (en) * 2002-06-10 2005-03-23 Visteon Global Tech Inc Machine integrated power
JP3858834B2 (ja) * 2003-02-24 2006-12-20 オンキヨー株式会社 半導体素子の放熱器
EP1683403B1 (en) 2003-11-14 2011-02-09 DET International Holding Limited Power supply with improved cooling
US8125781B2 (en) * 2004-11-11 2012-02-28 Denso Corporation Semiconductor device
JP4225310B2 (ja) * 2004-11-11 2009-02-18 株式会社デンソー 半導体装置
JP4729336B2 (ja) * 2005-04-27 2011-07-20 株式会社豊田自動織機 パワーモジュール用基板
US7450378B2 (en) * 2006-10-25 2008-11-11 Gm Global Technology Operations, Inc. Power module having self-contained cooling system
JP5227532B2 (ja) 2007-04-02 2013-07-03 日立オートモティブシステムズ株式会社 インバータ回路用の半導体モジュール
ES2345118T3 (es) * 2007-09-28 2010-09-15 EBERSPACHER CONTROLS GMBH & CO. KG Barra conductora con eliminacion de calor.
US7641490B2 (en) * 2007-12-18 2010-01-05 Gm Global Technology Operations, Inc. Liquid-cooled inverter assembly
US7916480B2 (en) * 2007-12-19 2011-03-29 GM Global Technology Operations LLC Busbar assembly with integrated cooling
US20100038774A1 (en) 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
DE102008061489A1 (de) 2008-12-10 2010-06-17 Siemens Aktiengesellschaft Stromrichtermodul mit gekühlter Verschienung
US20100147492A1 (en) * 2008-12-10 2010-06-17 Ronald David Conry IGBT cooling method
GB0902394D0 (en) 2009-02-13 2009-04-01 Isis Innovation Electric machine- cooling
US7952875B2 (en) * 2009-05-29 2011-05-31 GM Global Technology Operations LLC Stacked busbar assembly with integrated cooling
JP2011050197A (ja) 2009-08-28 2011-03-10 Hitachi Ltd 電力変換装置
US8169779B2 (en) 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
JP5551808B2 (ja) * 2010-03-05 2014-07-16 日立オートモティブシステムズ株式会社 半導体モジュール及びこれを備えた電力変換装置
JP2012016095A (ja) * 2010-06-29 2012-01-19 Denso Corp 電力変換装置
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
JP2012239337A (ja) * 2011-05-13 2012-12-06 Denso Corp 電力変換装置
US9247672B2 (en) 2013-01-21 2016-01-26 Parker-Hannifin Corporation Passively controlled smart microjet cooling array
WO2014147963A1 (ja) * 2013-03-19 2014-09-25 富士電機株式会社 冷却装置及びこれを備えた電力変換装置
US9414520B2 (en) 2013-05-28 2016-08-09 Hamilton Sundstrand Corporation Immersion cooled motor controller
WO2016008509A1 (en) 2014-07-15 2016-01-21 Abb Technology Ltd Electric module for improved thermal management in electrical equipments
JP2016158358A (ja) * 2015-02-24 2016-09-01 株式会社デンソー 半導体モジュール
CN106340513B (zh) * 2015-07-09 2019-03-15 台达电子工业股份有限公司 一种集成控制电路的功率模块
JP2017163065A (ja) 2016-03-11 2017-09-14 富士通株式会社 電子機器
GB2559180B (en) 2017-01-30 2020-09-09 Yasa Ltd Semiconductor cooling arrangement

Also Published As

Publication number Publication date
EP3574522A1 (en) 2019-12-04
KR20190131013A (ko) 2019-11-25
WO2018138530A1 (en) 2018-08-02
JP2020505900A (ja) 2020-02-20
US11276622B2 (en) 2022-03-15
BR112019011897A2 (pt) 2019-10-22
GB2563186A (en) 2018-12-12
CN110520982A (zh) 2019-11-29
EP3574522B1 (en) 2021-03-03
GB201701487D0 (en) 2017-03-15
JP7096255B2 (ja) 2022-07-05
US20200227334A1 (en) 2020-07-16
RU2019126805A3 (https=) 2021-03-19

Similar Documents

Publication Publication Date Title
RU2019126805A (ru) Полупроводниковый узел
CN110537257B (zh) 半导体冷却布置
CN102246611B (zh) 母线系统得到冷却的变流器模块
RU2510604C2 (ru) Энергетический преобразовательный модуль с охлаждаемой ошиновкой
US7978488B2 (en) Three-level power converting apparatus
CN111615869A (zh) 功率电子设备
CN109586588B (zh) 紧凑型逆变器和包括这种逆变器的机动车辆
CN102246612A (zh) 母线系统得到冷却的功率转换器模块
US12439570B2 (en) Pulse inverter having a cooling device as well as motor vehicle having a pulse inverter
WO2006103721A1 (ja) 電力変換装置の冷却構造
CN112953260B (zh) 一种逆变模组结构和逆变器
US20240324152A1 (en) Cooling Apparatus
GB2565071A (en) Semiconductor module
CN117277831B (zh) 一种功率组件和液冷变流器
JPWO2016170586A1 (ja) 電力変換装置
CN204886737U (zh) 集成门极可关断晶闸管三电平功率模块
Obara et al. Improved thermal management of multi-level converter building module to realize higher power density
TWI624138B (zh) Stacked inverter
TWM547785U (zh) 堆疊式逆變器

Legal Events

Date Code Title Description
FA92 Acknowledgement of application withdrawn (lack of supplementary materials submitted)

Effective date: 20210712