GB2563186A - Semiconductor arrangement - Google Patents

Semiconductor arrangement Download PDF

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Publication number
GB2563186A
GB2563186A GB1701487.9A GB201701487A GB2563186A GB 2563186 A GB2563186 A GB 2563186A GB 201701487 A GB201701487 A GB 201701487A GB 2563186 A GB2563186 A GB 2563186A
Authority
GB
United Kingdom
Prior art keywords
modules
inverter
heatsink
semiconductor
inverter according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB1701487.9A
Other languages
English (en)
Other versions
GB201701487D0 (en
Inventor
David Hart Simon
Woolmer Tim
Stuart Malam Christopher
Hillman Tom
Phillips Richard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yasa Ltd
Original Assignee
Yasa Motors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yasa Motors Ltd filed Critical Yasa Motors Ltd
Priority to GB1701487.9A priority Critical patent/GB2563186A/en
Publication of GB201701487D0 publication Critical patent/GB201701487D0/en
Priority to PCT/GB2018/050258 priority patent/WO2018138530A1/en
Priority to JP2019541259A priority patent/JP7096255B2/ja
Priority to EP18702555.6A priority patent/EP3574522B1/en
Priority to RU2019126805A priority patent/RU2019126805A/ru
Priority to BR112019011897-7A priority patent/BR112019011897A2/pt
Priority to US16/482,140 priority patent/US11276622B2/en
Priority to KR1020197017720A priority patent/KR20190131013A/ko
Priority to CN201880009069.7A priority patent/CN110520982A/zh
Publication of GB2563186A publication Critical patent/GB2563186A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
GB1701487.9A 2017-01-30 2017-01-30 Semiconductor arrangement Withdrawn GB2563186A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
GB1701487.9A GB2563186A (en) 2017-01-30 2017-01-30 Semiconductor arrangement
CN201880009069.7A CN110520982A (zh) 2017-01-30 2018-01-30 半导体布置
RU2019126805A RU2019126805A (ru) 2017-01-30 2018-01-30 Полупроводниковый узел
JP2019541259A JP7096255B2 (ja) 2017-01-30 2018-01-30 半導体構成
EP18702555.6A EP3574522B1 (en) 2017-01-30 2018-01-30 Semiconductor arrangement
PCT/GB2018/050258 WO2018138530A1 (en) 2017-01-30 2018-01-30 Semiconductor arrangement
BR112019011897-7A BR112019011897A2 (pt) 2017-01-30 2018-01-30 arranjo semicondutor
US16/482,140 US11276622B2 (en) 2017-01-30 2018-01-30 Inverter arrangement
KR1020197017720A KR20190131013A (ko) 2017-01-30 2018-01-30 반도체 배열체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1701487.9A GB2563186A (en) 2017-01-30 2017-01-30 Semiconductor arrangement

Publications (2)

Publication Number Publication Date
GB201701487D0 GB201701487D0 (en) 2017-03-15
GB2563186A true GB2563186A (en) 2018-12-12

Family

ID=58462769

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1701487.9A Withdrawn GB2563186A (en) 2017-01-30 2017-01-30 Semiconductor arrangement

Country Status (9)

Country Link
US (1) US11276622B2 (https=)
EP (1) EP3574522B1 (https=)
JP (1) JP7096255B2 (https=)
KR (1) KR20190131013A (https=)
CN (1) CN110520982A (https=)
BR (1) BR112019011897A2 (https=)
GB (1) GB2563186A (https=)
RU (1) RU2019126805A (https=)
WO (1) WO2018138530A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2602340A (en) * 2020-12-23 2022-06-29 Yasa Ltd Semiconductor cooling arrangement with improved heatsink

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GB2559180B (en) 2017-01-30 2020-09-09 Yasa Ltd Semiconductor cooling arrangement
DE102019200020A1 (de) 2019-01-03 2020-07-09 Zf Friedrichshafen Ag Busbaranordnung und Leistungselektronikanordnungen
DE102020106492A1 (de) 2019-04-12 2020-10-15 Infineon Technologies Ag Chip -package, verfahren zum bilden eines chip -packages, halbleitervorrichtung, halbleiteranordnung, dreiphasensystem, verfahren zum bilden einer halbleitervorrichtung und verfahren zum bilden einer halbleiteranordnung
KR102710615B1 (ko) * 2019-04-25 2024-09-27 아메리칸 액슬 앤드 매뉴팩쳐링, 인코포레이티드 전기 구동 모듈
CN114342209A (zh) 2019-09-13 2022-04-12 米沃奇电动工具公司 具有宽带隙半导体的功率转换器
EP4727278A2 (en) 2019-11-18 2026-04-15 Huawei Digital Power Technologies Co., Ltd. Electronic component with enclosure frame, circuit board with electronic component, and electronic device
DE102019133377B4 (de) * 2019-12-06 2023-08-31 Sma Solar Technology Ag Wechselrichter mit kompakter bauform
US11967899B2 (en) 2020-05-22 2024-04-23 Marel Power Solutions Fluid cooled inverter
US12041759B2 (en) * 2020-07-31 2024-07-16 Smart Wires Inc. Scalable modular cooling unit having voltage isolation
CN111984098B (zh) * 2020-08-28 2022-06-07 苏州浪潮智能科技有限公司 一种计算机系统的散热方法、装置、设备及介质
CN114285297A (zh) * 2020-09-27 2022-04-05 华为数字能源技术有限公司 逆变器、动力总成及电动车
GB2602341B (en) * 2020-12-23 2023-11-08 Yasa Ltd Semiconductor cooling arrangement with improved baffle
KR20250143856A (ko) 2021-03-15 2025-10-02 아메리칸 액슬 앤드 매뉴팩쳐링, 인코포레이티드 전기 구동 유닛
DE102021203801A1 (de) * 2021-04-16 2022-10-20 Molabo Gmbh Gekühltes Hochstromsystem
DE102021122769A1 (de) 2021-09-02 2023-03-02 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Umrichter eines zumindest teilweise elektrisch angetriebenen Kraftfahrzeugs und Kraftfahrzeug
CA3232380A1 (en) 2021-09-15 2023-03-23 Marel Power Solutions, Inc. Compact power converter
US12193202B2 (en) 2021-09-15 2025-01-07 Marel Power Solutions, Inc. Air cooled compact power systems
DE102021128947A1 (de) 2021-11-08 2023-05-11 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Pulswechselrichter sowie Antriebsstrang
CN118633229A (zh) 2021-12-01 2024-09-10 美国轮轴制造公司 具有与通过壳体总成传递的梁载荷隔离的电机总成的电驱动单元
CN115185342B (zh) * 2022-05-31 2025-09-16 超聚变数字技术有限公司 一种服务器及其相关设备
DE102022115995A1 (de) 2022-06-28 2023-12-28 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Vorrichtung mit einem Pulswechselrichter
KR102734589B1 (ko) * 2022-11-15 2024-11-25 전북대학교산학협력단 급속충전 전원장치용 전력반도체 방열판

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EP2043412A1 (de) * 2007-09-28 2009-04-01 catem DEVELEC GmbH & Co. KG Stromschiene mit Wärmeableitung
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2602340A (en) * 2020-12-23 2022-06-29 Yasa Ltd Semiconductor cooling arrangement with improved heatsink
GB2602340B (en) * 2020-12-23 2024-04-03 Yasa Ltd Semiconductor cooling arrangement with improved heatsink

Also Published As

Publication number Publication date
EP3574522A1 (en) 2019-12-04
KR20190131013A (ko) 2019-11-25
WO2018138530A1 (en) 2018-08-02
JP2020505900A (ja) 2020-02-20
US11276622B2 (en) 2022-03-15
BR112019011897A2 (pt) 2019-10-22
CN110520982A (zh) 2019-11-29
EP3574522B1 (en) 2021-03-03
GB201701487D0 (en) 2017-03-15
JP7096255B2 (ja) 2022-07-05
RU2019126805A (ru) 2021-03-01
US20200227334A1 (en) 2020-07-16
RU2019126805A3 (https=) 2021-03-19

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Legal Events

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)