JP7093210B2 - 板状物の加工方法 - Google Patents
板状物の加工方法 Download PDFInfo
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- JP7093210B2 JP7093210B2 JP2018061786A JP2018061786A JP7093210B2 JP 7093210 B2 JP7093210 B2 JP 7093210B2 JP 2018061786 A JP2018061786 A JP 2018061786A JP 2018061786 A JP2018061786 A JP 2018061786A JP 7093210 B2 JP7093210 B2 JP 7093210B2
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- protective member
- package
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Description
(1)
step coverage=(t2/t1)×100
11 :配線基板(配線基材)
13 :樹脂層(封止剤)
14 :バンプ(端子)
15 :パッケージ基板(板状物)
16 :シールド層
22 :パッケージ上面
23 :パッケージ側面
31 :保護部材
32 :粘着層
42 :保持テープ
46 :Vブレード(溝形成手段)
47 :V溝
48 :ストレートブレード
49 :矩形溝
61 :保持ジグ
Claims (2)
- 交差する分割予定ラインによって区画された配線基材の一方の面の領域に複数の端子が形成され、配線基材の他方の面の領域に半導体チップがボンディングされ封止剤で封止された板状物を、該分割予定ラインに沿って分割して個々のパッケージに分割する板状物の加工方法であって、
該複数の端子を保護する粘着層を有する保護部材を該一方の面に貼着する保護部材貼着ステップと、
該保護部材貼着ステップを実施した後に、板状物の厚み方向途中まで溝形成手段で切り込み、該分割予定ラインに対応する領域に沿って該封止剤上面から溝底に向かって傾斜した傾斜面を備えるようにV溝を形成するV溝形成ステップと、
該保護部材貼着ステップを実施した後に、該傾斜面に続く鉛直面を備えるように該V溝よりも深い矩形溝を形成して、該分割予定ラインに沿って板状物及び該保護部材を分割して該分割予定ラインに沿って個々のパッケージに個片化する個片化ステップと、
該個片化ステップを実施した後に、複数のパッケージの該封止剤上面と、該傾斜面及び該鉛直面を含む側壁とに、導電性シールド層を形成するシールド層形成ステップと、
該シールド層形成ステップを実施した後に、該保護部材をパッケージから剥離する保護部材剥離ステップと、を備える板状物の加工方法。 - 該保護部材貼着ステップを実施した後に、該保護部材側を保持ジグにより吸引保持又は保持テープに貼着する保護部材保持ステップを備える請求項1に記載の板状物の加工方法。
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JP2018061786A JP7093210B2 (ja) | 2018-03-28 | 2018-03-28 | 板状物の加工方法 |
KR1020190031894A KR102643185B1 (ko) | 2018-03-28 | 2019-03-20 | 판상물의 가공 방법 |
CN201910220456.1A CN110323182B (zh) | 2018-03-28 | 2019-03-22 | 板状物的加工方法 |
TW108110294A TWI811317B (zh) | 2018-03-28 | 2019-03-25 | 板狀物的加工方法 |
US16/365,045 US11114385B2 (en) | 2018-03-28 | 2019-03-26 | Plate-shaped workpiece processing method |
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US11089673B2 (en) * | 2019-07-19 | 2021-08-10 | Raytheon Company | Wall for isolation enhancement |
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CN113582125B (zh) * | 2021-07-21 | 2023-06-06 | 深圳清华大学研究院 | 一种超滑封装器件及其封装方法 |
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