JP7091581B2 - キャパシタ部品 - Google Patents
キャパシタ部品 Download PDFInfo
- Publication number
- JP7091581B2 JP7091581B2 JP2017082624A JP2017082624A JP7091581B2 JP 7091581 B2 JP7091581 B2 JP 7091581B2 JP 2017082624 A JP2017082624 A JP 2017082624A JP 2017082624 A JP2017082624 A JP 2017082624A JP 7091581 B2 JP7091581 B2 JP 7091581B2
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- JP
- Japan
- Prior art keywords
- capacitor component
- pad portion
- electrodes
- component according
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 title claims description 60
- 239000011241 protective layer Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 15
- 239000000126 substance Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 8
- 239000011575 calcium Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000012767 functional filler Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
101 本体
111、112、211、212、311、312 内部電極
121、122、221、222、320 連結電極
131、132、231、232、330 パッド部
141、142、143、144、241、242、340 外部電極
Claims (13)
- 互いに積層されて積層構造をなす複数の単位積層体であって、各々の単位積層体が、本体、前記本体の内部に配置された複数の内部電極、及び前記本体の厚さ方向に延設されて前記複数の内部電極と連結された連結電極を含む、単位積層体と、
前記複数の単位積層体のうち互いに隣接するものの間に配置され、その上部と下部に位置する前記連結電極と接続されたパッド部と、
を含み、
前記上部と下部に位置する前記連結電極のそれぞれは、積層方向からみて、前記パッド部内に配置され、かつ、少なくとも一部が互いに重なり合っており、
前記連結電極は前記本体の側面に形成され、前記連結電極の側面および前記パッド部の側面が前記本体の外部に露出している、キャパシタ部品。 - 前記パッド部は、前記連結電極よりも大きさが大きい、請求項1に記載のキャパシタ部品。
- 前記パッド部の上部と下部に位置する前記連結電極は、互いに大きさが異なる、請求項1または請求項2に記載のキャパシタ部品。
- 前記パッド部の上部と下部に位置する前記連結電極は、中心軸が互いに一致しない形態である、請求項1から請求項3の何れか一項に記載のキャパシタ部品。
- 前記連結電極と前記パッド部をカバーする保護層をさらに含む、請求項1から請求項4の何れか一項に記載のキャパシタ部品。
- 前記複数の内部電極は、互いに交互に配置された複数の第1及び第2の内部電極を含む、請求項1から請求項5の何れか一項に記載のキャパシタ部品。
- 前記連結電極は、前記第1及び第2の内部電極とそれぞれ連結された第1及び第2の連結電極を含む、請求項6に記載のキャパシタ部品。
- 前記パッド部は、前記パッド部の上部と下部に位置する前記第1の連結電極と接続された第1のパッド部を含む、請求項7に記載のキャパシタ部品。
- 前記パッド部は、その上部と下部に位置する前記第2の連結電極と接続された第2のパッド部を含む、請求項7または請求項8に記載のキャパシタ部品。
- 前記第1及び第2の連結電極とそれぞれ接続され、前記複数の単位積層体のうち最下部に配置されたものの下面に形成された第1及び第2の外部電極をさらに含む、請求項7から請求項9の何れか一項に記載のキャパシタ部品。
- 前記第1及び第2の外部電極は、前記複数の単位積層体のうち最上部に配置されたものの上面にも形成された、請求項10に記載のキャパシタ部品。
- 前記第1及び第2の外部電極は、前記複数の単位積層体の側面には形成されていない形態である、請求項10に記載のキャパシタ部品。
- 3つ以上の前記単位積層体が積層された積層構造を有する、請求項1から請求項12の何れか一項に記載のキャパシタ部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021119093A JP7371318B2 (ja) | 2016-09-05 | 2021-07-19 | キャパシタ部品 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160113880A KR102632349B1 (ko) | 2016-09-05 | 2016-09-05 | 커패시터 부품 |
KR10-2016-0113880 | 2016-09-05 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021119093A Division JP7371318B2 (ja) | 2016-09-05 | 2021-07-19 | キャパシタ部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018041948A JP2018041948A (ja) | 2018-03-15 |
JP7091581B2 true JP7091581B2 (ja) | 2022-06-28 |
Family
ID=61281710
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017082624A Active JP7091581B2 (ja) | 2016-09-05 | 2017-04-19 | キャパシタ部品 |
JP2021119093A Active JP7371318B2 (ja) | 2016-09-05 | 2021-07-19 | キャパシタ部品 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021119093A Active JP7371318B2 (ja) | 2016-09-05 | 2021-07-19 | キャパシタ部品 |
Country Status (4)
Country | Link |
---|---|
US (2) | US10373760B2 (ja) |
JP (2) | JP7091581B2 (ja) |
KR (1) | KR102632349B1 (ja) |
CN (1) | CN107799305B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021184472A (ja) * | 2016-09-05 | 2021-12-02 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | キャパシタ部品 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7388088B2 (ja) * | 2018-10-30 | 2023-11-29 | Tdk株式会社 | 積層セラミック電子部品とその製造方法 |
US11508746B2 (en) * | 2019-10-25 | 2022-11-22 | Micron Technology, Inc. | Semiconductor device having a stack of data lines with conductive structures on both sides thereof |
US11605588B2 (en) | 2019-12-20 | 2023-03-14 | Micron Technology, Inc. | Memory device including data lines on multiple device levels |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004207747A (ja) | 2004-01-30 | 2004-07-22 | Tdk Corp | キャパシタ |
JP2006222442A (ja) | 2002-10-30 | 2006-08-24 | Kyocera Corp | コンデンサ、及び配線基板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0590067A (ja) * | 1991-09-27 | 1993-04-09 | Kyocera Corp | 積層磁器コンデンサの製造方法 |
DE69936008T2 (de) * | 1998-01-07 | 2008-01-10 | Tdk Corp. | Keramischer Kondensator |
WO2001080256A1 (fr) * | 2000-04-14 | 2001-10-25 | Matsushita Electric Industrial Co., Ltd. | Corps stratifie, condensateur, composant electronique, procede et dispositif de fabrication dudit corps stratifie, dudit condensateur et dudit composant electronique |
JP4018898B2 (ja) | 2001-11-16 | 2007-12-05 | 日本特殊陶業株式会社 | 積層セラミック電子部品 |
EP1538640B1 (en) * | 2003-12-05 | 2016-11-16 | NGK Spark Plug Co., Ltd. | Capacitor and method for manufacturing the same |
JP2006100422A (ja) | 2004-09-28 | 2006-04-13 | Ngk Spark Plug Co Ltd | 積層コンデンサ及びその製造方法 |
KR100714608B1 (ko) * | 2004-12-03 | 2007-05-07 | 삼성전기주식회사 | 적층형 칩 커패시터 |
JP4760789B2 (ja) * | 2006-08-21 | 2011-08-31 | 株式会社村田製作所 | 積層コンデンサ、回路基板及び回路モジュール |
US20090141426A1 (en) * | 2007-11-29 | 2009-06-04 | Cheol-Seong Hwang | Thin film multi-layered ceramic capacitor and method of fabricating the same |
KR20110072938A (ko) * | 2009-12-23 | 2011-06-29 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조방법 |
US9472342B2 (en) * | 2010-05-26 | 2016-10-18 | Kemet Electronics Corporation | Leadless multi-layered ceramic capacitor stacks |
JP5246215B2 (ja) * | 2010-07-21 | 2013-07-24 | 株式会社村田製作所 | セラミック電子部品及び配線基板 |
JP2012043947A (ja) * | 2010-08-18 | 2012-03-01 | Tdk Corp | 積層コンデンサの実装構造 |
KR101422929B1 (ko) * | 2012-11-07 | 2014-07-23 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 실장 기판 |
KR102632349B1 (ko) * | 2016-09-05 | 2024-02-02 | 삼성전기주식회사 | 커패시터 부품 |
-
2016
- 2016-09-05 KR KR1020160113880A patent/KR102632349B1/ko active IP Right Grant
-
2017
- 2017-04-14 US US15/487,997 patent/US10373760B2/en active Active
- 2017-04-19 JP JP2017082624A patent/JP7091581B2/ja active Active
- 2017-06-02 CN CN201710412073.5A patent/CN107799305B/zh active Active
-
2019
- 2019-02-12 US US16/273,324 patent/US11031186B2/en active Active
-
2021
- 2021-07-19 JP JP2021119093A patent/JP7371318B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006222442A (ja) | 2002-10-30 | 2006-08-24 | Kyocera Corp | コンデンサ、及び配線基板 |
JP2004207747A (ja) | 2004-01-30 | 2004-07-22 | Tdk Corp | キャパシタ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021184472A (ja) * | 2016-09-05 | 2021-12-02 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | キャパシタ部品 |
JP7371318B2 (ja) | 2016-09-05 | 2023-10-31 | サムソン エレクトロ-メカニックス カンパニーリミテッド. | キャパシタ部品 |
Also Published As
Publication number | Publication date |
---|---|
US20180068794A1 (en) | 2018-03-08 |
JP2018041948A (ja) | 2018-03-15 |
JP7371318B2 (ja) | 2023-10-31 |
JP2021184472A (ja) | 2021-12-02 |
CN107799305A (zh) | 2018-03-13 |
KR20180026932A (ko) | 2018-03-14 |
US11031186B2 (en) | 2021-06-08 |
US20190172648A1 (en) | 2019-06-06 |
US10373760B2 (en) | 2019-08-06 |
KR102632349B1 (ko) | 2024-02-02 |
CN107799305B (zh) | 2020-07-03 |
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