JP7088687B2 - 樹脂モールド装置及び樹脂モールド方法 - Google Patents

樹脂モールド装置及び樹脂モールド方法 Download PDF

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JP7088687B2
JP7088687B2 JP2018025730A JP2018025730A JP7088687B2 JP 7088687 B2 JP7088687 B2 JP 7088687B2 JP 2018025730 A JP2018025730 A JP 2018025730A JP 2018025730 A JP2018025730 A JP 2018025730A JP 7088687 B2 JP7088687 B2 JP 7088687B2
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mold
film
resin
work
holding
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JP2019145550A5 (enrdf_load_stackoverflow
JP2019145550A (ja
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和広 鈴木
良尚 轟
高志 斉藤
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Apic Yamada Corp
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Apic Yamada Corp
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Priority to JP2018025730A priority Critical patent/JP7088687B2/ja
Priority to TW107144278A priority patent/TWI787411B/zh
Priority to CN201910117010.6A priority patent/CN110154300B/zh
Priority to KR1020190018210A priority patent/KR102521504B1/ko
Publication of JP2019145550A publication Critical patent/JP2019145550A/ja
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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2018025730A 2018-02-16 2018-02-16 樹脂モールド装置及び樹脂モールド方法 Active JP7088687B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018025730A JP7088687B2 (ja) 2018-02-16 2018-02-16 樹脂モールド装置及び樹脂モールド方法
TW107144278A TWI787411B (zh) 2018-02-16 2018-12-10 樹脂模製裝置
CN201910117010.6A CN110154300B (zh) 2018-02-16 2019-02-15 树脂模制装置以及树脂模制方法
KR1020190018210A KR102521504B1 (ko) 2018-02-16 2019-02-15 수지 몰드 장치 및 수지 몰드 방법

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JP2018025730A JP7088687B2 (ja) 2018-02-16 2018-02-16 樹脂モールド装置及び樹脂モールド方法

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JP2019145550A JP2019145550A (ja) 2019-08-29
JP2019145550A5 JP2019145550A5 (enrdf_load_stackoverflow) 2021-02-25
JP7088687B2 true JP7088687B2 (ja) 2022-06-21

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7175869B2 (ja) * 2019-10-03 2022-11-21 Ｔｏｗａ株式会社 樹脂成形装置および樹脂成形方法
JP7312452B2 (ja) * 2020-01-24 2023-07-21 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
WO2022254656A1 (ja) * 2021-06-03 2022-12-08 アピックヤマダ株式会社 圧縮成形装置
JP7644494B2 (ja) * 2021-09-28 2025-03-12 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP7562146B2 (ja) * 2021-10-21 2024-10-07 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
CN114005763A (zh) * 2021-11-30 2022-02-01 东莞市天贺电子科技有限公司 一种以压缩成形的设备上能配合模具结构
JP2024074488A (ja) * 2022-11-21 2024-05-31 Ｔｏｗａ株式会社 樹脂成形装置、及び、樹脂成形品の製造方法
JP2024107566A (ja) 2023-01-30 2024-08-09 アピックヤマダ株式会社 圧縮成形装置及び圧縮成形方法
JP2024107567A (ja) 2023-01-30 2024-08-09 アピックヤマダ株式会社 圧縮成形に用いられる封止樹脂及びその形成方法
JP7732640B2 (ja) * 2023-05-09 2025-09-02 ダイキン工業株式会社 成形条件提案システム、試料評価システムおよびプログラム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012023147A (ja) 2010-07-13 2012-02-02 Apic Yamada Corp 樹脂モールド装置及びワーク板厚測定装置
JP2015101082A (ja) 2013-11-28 2015-06-04 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置
JP2018024140A (ja) 2016-08-09 2018-02-15 アピックヤマダ株式会社 樹脂供給装置、プレスユニット及び樹脂モールド装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012023147A (ja) 2010-07-13 2012-02-02 Apic Yamada Corp 樹脂モールド装置及びワーク板厚測定装置
JP2015101082A (ja) 2013-11-28 2015-06-04 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置
JP2018024140A (ja) 2016-08-09 2018-02-15 アピックヤマダ株式会社 樹脂供給装置、プレスユニット及び樹脂モールド装置

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