JP7077400B2 - 保護フィルムで被覆されたプリント回路基板の製造方法 - Google Patents

保護フィルムで被覆されたプリント回路基板の製造方法 Download PDF

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Publication number
JP7077400B2
JP7077400B2 JP2020513126A JP2020513126A JP7077400B2 JP 7077400 B2 JP7077400 B2 JP 7077400B2 JP 2020513126 A JP2020513126 A JP 2020513126A JP 2020513126 A JP2020513126 A JP 2020513126A JP 7077400 B2 JP7077400 B2 JP 7077400B2
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Prior art keywords
protective film
circuit board
printed circuit
region
adhesive layer
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JP2020513126A
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Japanese (ja)
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JPWO2019198404A1 (ja
Inventor
剛 田邊
真次 朝山
彰一 味岡
俊介 佐々木
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2020513126A 2018-04-12 2019-03-12 保護フィルムで被覆されたプリント回路基板の製造方法 Active JP7077400B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018077046 2018-04-12
JP2018077046 2018-04-12
PCT/JP2019/009909 WO2019198404A1 (ja) 2018-04-12 2019-03-12 保護フィルムで被覆されたプリント回路基板及びその製造方法

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JPWO2019198404A1 JPWO2019198404A1 (ja) 2020-12-03
JP7077400B2 true JP7077400B2 (ja) 2022-05-30

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JP2020513126A Active JP7077400B2 (ja) 2018-04-12 2019-03-12 保護フィルムで被覆されたプリント回路基板の製造方法

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JP (1) JP7077400B2 (zh)
CN (1) CN111919519B (zh)
WO (1) WO2019198404A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6738077B1 (ja) * 2019-11-05 2020-08-12 エレファンテック株式会社 電子装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008186937A (ja) 2007-01-29 2008-08-14 Toyo Tire & Rubber Co Ltd 樹脂シート封止実装回路基板の製造方法およびそれに用いられるマスキング治具
JP2010199514A (ja) 2009-02-27 2010-09-09 Autonetworks Technologies Ltd 回路構成体
JP2013165207A (ja) 2012-02-13 2013-08-22 Denso Corp 導線付き回路基板及びその製造方法
WO2018008657A1 (ja) 2016-07-08 2018-01-11 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09324153A (ja) * 1996-06-07 1997-12-16 Japan Tobacco Inc 遮光フィルム
JP3751379B2 (ja) * 1996-10-09 2006-03-01 株式会社フジクラ プリント基板への実装方法及びプリント基板
JP4890539B2 (ja) * 2006-04-19 2012-03-07 ソマール株式会社 熱プレス用離型シート及びそれを用いたフレキシブルプリント配線板の製造方法
JP5020624B2 (ja) * 2006-12-22 2012-09-05 キヤノン株式会社 ヘッドカートリッジ、保護テープ、インクジェット記録ヘッドカートリッジの吐出口封止方法
CN104025726A (zh) * 2012-02-10 2014-09-03 三菱树脂株式会社 表面保护膜、发光元件搭载用基板及光源装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008186937A (ja) 2007-01-29 2008-08-14 Toyo Tire & Rubber Co Ltd 樹脂シート封止実装回路基板の製造方法およびそれに用いられるマスキング治具
JP2010199514A (ja) 2009-02-27 2010-09-09 Autonetworks Technologies Ltd 回路構成体
JP2013165207A (ja) 2012-02-13 2013-08-22 Denso Corp 導線付き回路基板及びその製造方法
WO2018008657A1 (ja) 2016-07-08 2018-01-11 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板

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WO2019198404A1 (ja) 2019-10-17
CN111919519B (zh) 2024-01-12
JPWO2019198404A1 (ja) 2020-12-03
CN111919519A (zh) 2020-11-10

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