JP7074489B2 - データ処理方法、データ処理装置、および、データ処理プログラム - Google Patents

データ処理方法、データ処理装置、および、データ処理プログラム Download PDF

Info

Publication number
JP7074489B2
JP7074489B2 JP2018020797A JP2018020797A JP7074489B2 JP 7074489 B2 JP7074489 B2 JP 7074489B2 JP 2018020797 A JP2018020797 A JP 2018020797A JP 2018020797 A JP2018020797 A JP 2018020797A JP 7074489 B2 JP7074489 B2 JP 7074489B2
Authority
JP
Japan
Prior art keywords
series data
sampling
time
cycle
sampling cycle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018020797A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019140194A (ja
JP2019140194A5 (enExample
Inventor
英司 猶原
正史 秋田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2018020797A priority Critical patent/JP7074489B2/ja
Priority to KR1020190006849A priority patent/KR102247116B1/ko
Priority to TW108103095A priority patent/TWI691047B/zh
Priority to US16/261,654 priority patent/US11274995B2/en
Priority to CN201910096735.1A priority patent/CN110134077B/zh
Publication of JP2019140194A publication Critical patent/JP2019140194A/ja
Publication of JP2019140194A5 publication Critical patent/JP2019140194A5/ja
Application granted granted Critical
Publication of JP7074489B2 publication Critical patent/JP7074489B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0221—Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0208—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the configuration of the monitoring system
    • G05B23/021—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the configuration of the monitoring system adopting a different treatment of each operating region or a different mode of the monitored system, e.g. transient modes; different operating configurations of monitored system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
    • G05B23/0227—Qualitative history assessment, whereby the type of data acted upon, e.g. waveforms, images or patterns, is not relevant, e.g. rule based assessment; if-then decisions
    • G05B23/0235—Qualitative history assessment, whereby the type of data acted upon, e.g. waveforms, images or patterns, is not relevant, e.g. rule based assessment; if-then decisions based on a comparison with predetermined threshold or range, e.g. "classical methods", carried out during normal operation; threshold adaptation or choice; when or how to compare with the threshold
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0262—Confirmation of fault detection, e.g. extra checks to confirm that a failure has indeed occurred
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
    • G07C3/00—Registering or indicating the condition or the working of machines or other apparatus, other than vehicles
    • G07C3/005—Registering or indicating the condition or the working of machines or other apparatus, other than vehicles during manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31282—Data acquisition, BDE MDE

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Testing And Monitoring For Control Systems (AREA)
JP2018020797A 2018-02-08 2018-02-08 データ処理方法、データ処理装置、および、データ処理プログラム Active JP7074489B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018020797A JP7074489B2 (ja) 2018-02-08 2018-02-08 データ処理方法、データ処理装置、および、データ処理プログラム
KR1020190006849A KR102247116B1 (ko) 2018-02-08 2019-01-18 데이터 처리 방법, 데이터 처리 장치, 및 데이터 처리 프로그램
TW108103095A TWI691047B (zh) 2018-02-08 2019-01-28 資料處理方法、資料處理裝置以及資料處理程式
US16/261,654 US11274995B2 (en) 2018-02-08 2019-01-30 Data processing method, data processing device, and computer-readable recording medium having recorded thereon data processing program
CN201910096735.1A CN110134077B (zh) 2018-02-08 2019-01-31 数据处理方法、数据处理装置及记录介质

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018020797A JP7074489B2 (ja) 2018-02-08 2018-02-08 データ処理方法、データ処理装置、および、データ処理プログラム

Publications (3)

Publication Number Publication Date
JP2019140194A JP2019140194A (ja) 2019-08-22
JP2019140194A5 JP2019140194A5 (enExample) 2021-02-18
JP7074489B2 true JP7074489B2 (ja) 2022-05-24

Family

ID=67475524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018020797A Active JP7074489B2 (ja) 2018-02-08 2018-02-08 データ処理方法、データ処理装置、および、データ処理プログラム

Country Status (5)

Country Link
US (1) US11274995B2 (enExample)
JP (1) JP7074489B2 (enExample)
KR (1) KR102247116B1 (enExample)
CN (1) CN110134077B (enExample)
TW (1) TWI691047B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6933630B2 (ja) * 2018-12-06 2021-09-08 ファナック株式会社 処理時間監視装置
JP7249902B2 (ja) * 2019-07-17 2023-03-31 東京エレクトロン株式会社 状態管理システム及び状態管理方法
KR102455758B1 (ko) 2020-01-30 2022-10-17 가부시키가이샤 스크린 홀딩스 데이터 처리 방법, 데이터 처리 장치 및 기억 매체
CN113342610B (zh) * 2021-06-11 2023-10-13 北京奇艺世纪科技有限公司 一种时序数据异常检测方法、装置、电子设备及存储介质
CN116561545B (zh) * 2023-05-17 2025-11-04 广东恒翼能科技股份有限公司 锂电池化成和分容工艺的多元时间序列实时异常检测方法、电子设备、存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001273336A (ja) 2000-03-27 2001-10-05 Matsushita Electric Ind Co Ltd データ収集方法
JP2005142467A (ja) 2003-11-10 2005-06-02 Renesas Technology Corp 半導体デバイスの製造方法および半導体製造システム
JP2008042005A (ja) 2006-08-08 2008-02-21 Tokyo Electron Ltd データ収集方法，基板処理装置，基板処理システム
JP2012123521A (ja) 2010-12-07 2012-06-28 Toppan Printing Co Ltd 製造装置のプロセス条件と判定条件の自動変更システム

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4128339B2 (ja) * 2001-03-05 2008-07-30 株式会社日立製作所 試料処理装置用プロセスモニタ及び試料の製造方法
US7745803B2 (en) * 2004-02-03 2010-06-29 Sharp Kabushiki Kaisha Ion doping apparatus, ion doping method, semiconductor device and method of fabricating semiconductor device
US7200523B1 (en) * 2005-11-30 2007-04-03 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for filtering statistical process data to enhance process performance
US7877233B2 (en) * 2006-07-26 2011-01-25 Invensys Systems, Inc. Selectively presenting timestamped time-series data values for retrieved supervisory control and manufacturing/production parameters
US7490010B2 (en) 2006-08-08 2009-02-10 Tokyo Electron Limited Data collection method, substrate processing apparatus, and substrate processing system
KR101381341B1 (ko) 2006-10-06 2014-04-04 가부시끼가이샤 도시바 가공 종점 검지방법, 연마방법 및 연마장치
US20080120346A1 (en) * 2006-11-22 2008-05-22 Anindya Neogi Purging of stored timeseries data
US8078552B2 (en) * 2008-03-08 2011-12-13 Tokyo Electron Limited Autonomous adaptive system and method for improving semiconductor manufacturing quality
JP5363213B2 (ja) * 2009-06-30 2013-12-11 東京エレクトロン株式会社 異常検出システム、異常検出方法、記憶媒体及び基板処理装置
JP2011243088A (ja) 2010-05-20 2011-12-01 Sony Corp データ処理装置、データ処理方法、及び、プログラム
JP5616174B2 (ja) * 2010-09-14 2014-10-29 株式会社トプコン レーザ測量装置
JP5455866B2 (ja) 2010-10-28 2014-03-26 株式会社日立製作所 異常診断装置および産業機械
JP5764473B2 (ja) 2011-11-17 2015-08-19 株式会社日立製作所 イベントデータ処理装置
JP2013257712A (ja) * 2012-06-12 2013-12-26 Nippon Telegr & Teleph Corp <Ntt> 類似部分シーケンス検出装置、方法、及びプログラム
JP2014130077A (ja) * 2012-12-28 2014-07-10 Hitachi High-Technologies Corp パターン形状評価方法、半導体装置の製造方法及びパターン形状評価装置
EP3101497B1 (en) * 2014-03-14 2020-02-26 Omron Corporation Control system
US10210606B2 (en) * 2014-10-14 2019-02-19 Kla-Tencor Corporation Signal response metrology for image based and scatterometry overlay measurements
WO2016162231A1 (en) 2015-04-10 2016-10-13 Asml Netherlands B.V. Method and apparatus for inspection and metrology
CN112485971B (zh) 2015-04-21 2024-12-03 科磊股份有限公司 用于倾斜装置设计的计量目标设计
TWI539298B (zh) * 2015-05-27 2016-06-21 國立成功大學 具取樣率決定機制的量測抽樣方法 與其電腦程式產品
US9983148B2 (en) 2015-05-28 2018-05-29 Kla-Tencor Corporation System and method for production line monitoring
SG11201710646TA (en) 2015-08-06 2018-01-30 Ns Solutions Corp Information processing apparatus, information processing system, information processing method and program
JP6599727B2 (ja) 2015-10-26 2019-10-30 株式会社Ｓｃｒｅｅｎホールディングス 時系列データ処理方法、時系列データ処理プログラム、および、時系列データ処理装置
US20180047646A1 (en) * 2016-02-24 2018-02-15 Kla-Tencor Corporation Accuracy improvements in optical metrology
CN106548035B (zh) 2016-11-24 2019-08-06 腾讯科技（深圳）有限公司 一种数据异常的诊断方法及装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001273336A (ja) 2000-03-27 2001-10-05 Matsushita Electric Ind Co Ltd データ収集方法
JP2005142467A (ja) 2003-11-10 2005-06-02 Renesas Technology Corp 半導体デバイスの製造方法および半導体製造システム
JP2008042005A (ja) 2006-08-08 2008-02-21 Tokyo Electron Ltd データ収集方法，基板処理装置，基板処理システム
JP2012123521A (ja) 2010-12-07 2012-06-28 Toppan Printing Co Ltd 製造装置のプロセス条件と判定条件の自動変更システム

Also Published As

Publication number Publication date
TWI691047B (zh) 2020-04-11
CN110134077A (zh) 2019-08-16
US11274995B2 (en) 2022-03-15
JP2019140194A (ja) 2019-08-22
US20190242788A1 (en) 2019-08-08
TW201937690A (zh) 2019-09-16
CN110134077B (zh) 2022-07-19
KR102247116B1 (ko) 2021-04-30
KR20190096276A (ko) 2019-08-19

Similar Documents

Publication Publication Date Title
JP7074489B2 (ja) データ処理方法、データ処理装置、および、データ処理プログラム
JP7181033B2 (ja) データ処理方法、データ処理装置、および、データ処理プログラム
TWI770348B (zh) 資料處理方法、資料處理裝置以及電腦可讀取記錄媒體
JP7413159B2 (ja) 情報処理装置、プログラム及び監視方法
JP2023052477A (ja) データ処理方法およびデータ処理プログラム
CN115235257A (zh) 一种温度控制方法及半导体设备
US7212950B2 (en) Methods and apparatus for equipment matching and characterization
CN113655370B (zh) 确定芯片异常测试工况的方法、装置、系统及相关设备
JP6959879B2 (ja) データ処理方法、データ処理装置、および、データ処理プログラム
KR102280390B1 (ko) 데이터 처리 방법, 데이터 처리 장치, 데이터 처리 시스템, 및 데이터 처리 프로그램을 저장한 컴퓨터 판독 가능한 기록 매체
CN106918773A (zh) 工艺型硬件木马监测方法与装置
CN118330439B (zh) 一种半导体芯片测试电路和测试方法
JP2019140196A (ja) データ処理方法、データ処理装置、データ処理システム、およびデータ処理プログラム
WO2012048734A1 (en) Method for controlling an industrial process
JP2001338856A (ja) 半導体製造システムのプロセスコントローラ
CN115096463A (zh) 玻璃通道焊接式热偶温度补偿方法、系统、设备及介质
US7272540B2 (en) Method and device for multistage data processing, of a power generating station
CN112073544A (zh) 用于处理传感器数据的方法、计算设备和计算机存储介质
JP2021113730A (ja) 蓄電デバイスの測定装置、測定方法及び検出装置
WO2021216092A1 (en) Method of process control and monitoring in dynamic plasma condition by plasma spectrum
CN100508113C (zh) 蚀刻设备在线故障诊断的方法
TW449791B (en) System and method for data collection along with data analysis
US20090216470A1 (en) Method and Computer Code for Statistical Process Control for Censored Production Data
CN118197484A (zh) 用于控制测量装置的方法和测量装置
JPH0682280A (ja) 警報処理装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20201218

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210105

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210916

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20211102

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211210

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220506

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220512

R150 Certificate of patent or registration of utility model

Ref document number: 7074489

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250