TW449791B - System and method for data collection along with data analysis - Google Patents

Abstract

The invention discloses a system and method for controlling data collection in manufacturing equipment. The system at least includes a connection port communicating with manufacturing equipment used to receive multiple production process parameter signals during operation of manufacturing equipment and a control element capable of targeting at production parameter signals for execution of a stored procedure, in which the control element at least consists of multiple event commands targeting at the stored procedure. The method at least contains collection of a set of production process parameter signals generated by manufacturing equipment; setup for inputting multiple production process events in a control element including at least an initialization event value, a sampled event value, an effective time event value and an execution event value. Next, compare the production process parameter signals with production event setup in the control element, and selectively store the data of production parameter signals in control element.

Description

449791 Five 'invention description (1) 5-1 Field of invention: The present invention relates to a system and method for collecting data for a process machine, in particular a system and method for controlling data collection by setting a set of event commands by a control element. . 5-2 Background of the Invention: In a typical semiconductor process, wafers are transferred between various process equipment and machines on a wafer process assembly line. The wafers undergo a number of processes in each equipment or machine, such as wafers. Add different levels of village quality, after processing these levels into the final product. Examples of wafer processing include metal deposition, oxide layer formation, and source / electrode doping. When a wafer moves through any process assembly line, the quality of the wafer must be checked periodically, for example, by checking the tiny line width on the wafer and the thickness of the film to detect whether the process parameters deviate from the correct values. However, 'these quality monitoring work can often only be performed when the wafer has completed the aberrat i on procedures, so the purpose of these monitoring work is to reduce the number of unstable batches (1 〇t) The human and material resources invested in the wafers, rather than bringing the scrapped wafers back to life. Here a batch of wafers refers to a set of multiple wafers placed in a wafer boat or a cassette set.

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5. Description of the invention (2)-The general quality inspection and measurement work increases the cost during the manufacturing process. Furthermore, during the period from the off-track occurrence to detection and equipment expenditure, many batches of unavailable wafers have been seeded to the off-track—'Many various methods have been tried to track this down. Situation, and brother processing 'Therefore, nowadays, to directly detect and collect process machine parameters, " is used to detect situations that may deviate from the normal track. Most of them are most commonly used. There are built-in sensors for collecting process parameters. The values of the system and the machine are converted into electronic signals, such as volt signals. —The system f is to measure the temperature and power. It is defined as a process machine to complete a specific crystal, such as-,, such as metal deposition, oxide layer formation, and source / drain hybrid effects. A stimulating factor. For example, the data of the mechanical parameters are often in accordance with the protocol of Semiconductor Equipment ° Semi-Communications Standard II (SECS Π) or Generic Equipment Model (GEM). Fu on pass. Generally speaking, a process event signal is detected by a process machine, and the process event signal is transmitted to the communication unit of the machine in a manner consistent with the above two protocols. The process event signal includes a notification of a new process recipe (recepe), the start of a new wafer process, the wafer in the end of the process, and an abnormality warning, etc. The so-called recipe can be defined as a set of process recipes' such as process parameters and prior preparations based on a set of process steps.

Page 5 449 79 1 V. Description of the invention (3) However, the communication mode as described above has some disadvantages. First of all, all the parameters are set by the machine's own control system. When the machine's control system cannot perform the notification of process event signals, the data collection cannot be completed. Secondly, the process machine may not be able to provide process parameters in a linear time scale, such as a fixed sampling speed. This will increase the difficulty in analyzing the collected data. Moreover, this data collection method is not collected in the process machine processor, so there is a lack of machine status or event data, such as process steps, wafer numbers, wafer batches, and so on. As a result, machine status Or event data can only be obtained by inference. 5-3 Objects and Summary of the Invention: In view of the above-mentioned backgrounds of the invention, various shortcomings of data collection in traditional process machines, the present invention provides a system and method for controlling data collection in process machines. The system and method of the invention can issue event setting commands for process parameters generated from a process machine. Another object of the present invention is to provide a system and method for controlling data collection in a process machine when a process event signal of the process machine cannot perform its function. The invented system and method can directly distinguish each wafer data of each batch of wafers in the process machine from each other.

Page 6 44979 1 V. Description of the invention (4) Another object of the present invention is to provide a system and method for controlling data collection in a process machine. The system and method of the present invention can selectively store those process parameter signals that truly represent each wafer, rather than the collection records of the process parameter signals. The procedure for controlling the parameters of the control system in Taiwan and Taiwan. And it is based on the above-mentioned data processing machine communication number, and controlling the collected control element to the method at least includes the number; in a control element, an initial event value and a value. Second, set the data in the control event. The purpose, system, and methods used to control the components in the component can include a collection of input events and various control elements. The operation system is aimed at manufacturing multiple needle-process machines, each process value, and one-by-one selection. The system machine process parameters are set to be effective when the events generated by the storage are set to be more effective than the process storage. Receive multiple process signals during connection and execute a set of event commands and data messages. A set of event parameters, process parameters, event parameters, and parameters are included. 5-4 Invention details including a process number: 〇 When the present invention is illustrated by a comparative example, those skilled in the art should recognize that many steps can be changed. These general substitutions undoubtedly do not depart from the spirit and scope of the present invention. In addition, the preferred embodiments are not intended to limit the scope of patent application of the present invention;

Page 7 449791 V. Description of the invention (5) Equivalent changes or modifications made under the spirit disclosed in the present invention shall all be included in the scope of patent application described below. In the present invention, a system and method for controlling data collection in a process machine are provided. The system includes at least a communication link connecting the process machine and the process machine to receive a plurality of process parameter signals when the process machine is operated; a data collection module A group for executing a storage program according to several event commands, which includes at least one, a start command, a sampling command, a valid time command, and an execution command; and a control module is connected to the data collection module and includes at least Store the stored data of the program. The method at least includes collecting a set of process parameter signals generated by the process machine; inputting a plurality of process event settings in a control element, which includes at least a start event value, a sampling event value, a valid time event value, and a Execution event value. Secondly, the process parameter signal and process event settings are compared in the control element, and then the data of the process parameter signal is selectively stored in the control element. Referring now to the first figure, a block schematic diagram of a system 11 shows data collection in a wafer fabrication machine according to the present invention. The system 11 includes at least a control element 12 and a communication unit 14. The control element 12 receives the process parameter signal 16 from the sensor 15 through the communication module 14. Sensor 15 measurement—wafer program. Process parameters of device 13 and these measurements are converted into electronic signals $, which are generally converted into voltage signals ′ to provide to the control element 12. The control element j 2 can control the communication unit 14 to collect negative data. dagger

Page 8 4 49 * 79 1 V. Description of the Invention (6) ... In the second embodiment, iCommunication 14 is a RS23 (Synchronous Serial Port). The manufacturing machine 13 also includes R (not shown in the figure), which can generate data bytes in series for the control unit: Shangfu 1 4 receives. The control element 1 2 receives the analog input signal, and the master " No. 16 contains at least Analog signal. In the present invention, when the manufacturing machine 13 has several failures and cannot communicate with the communication device 14 using the communication standard of the semiconductor device or the protocol of the universal 1 and the mold J, the control element 12 is still based on the detailed description with reference to the second figure To collect process data. Now refer to the second figure, which is a block diagram of collecting process data for system 11 in the first figure. Β First, the user turns a group of process settings with control elements (step 2 1) ^ These process settings are transmitted from the communication control system. Data collection 'has a function similar to process events generated by the process machine itself. In the present invention, when the process machine fails and a light event signal cannot be generated, the process setting in the control element can still be set Lead the data collection of process parameter signals. These process settings include at least the start event value, the sampling event value (the value), and the execution event value. The initiation event value and the effective time value can touch Ϊ ί: a step of initiation collection ’, the electronic signal is transformed from the process signal. When a certain value in the electronic signal is greater than the start and the time that this value continues to appear continuously is greater than the effective time value, ":, the data collection of wafers is started ... The effective value of the effective time value is to avoid misjudgment A noise

44 ^ 791, invention ^ 7 ^^ Jingshi fίΐ π. The value of the noise due to noise is usually larger than the initial event value β-" Interim sampling event value is a sample representing the data collected from the electric hand signal Hour_θ 'The user can set the sampling event value suitable for δ according to the characteristics of each batch of wafers in the process machine. The execution event value represents the execution time of each wafer-round operation in each batch of wafers, which can be used to avoid incorrect data collection for each wafer. * When the communication unit receives the process parameter signal from the process machine, the control element can compare the process parameter signal with the above-mentioned process setting value on the line [-· 丨 and execute the data collection step (step 2 2) . Then, these process parameter signals are selectively stored in the control element (step 2 3). The first figure shows an embodiment of the present invention. Referring to the third figure, the process machine is a # carving machine. First, the user enters the batch data and process settings for the batch of wafers being processed in the process machine (step 31). The signal of each batch of wafers can include the batch number, machine name, and batch size in the machine. and many more. The process setting includes at least the start event value, sampling event value, valid time value, and execution event value. Then, the etching machine starts processing each wafer in each batch (step 3 2). The etching machine generates a series of process parameters ν) signals, such as RF voltage values. The communication unit receives this series of process parameter signals, and the control element compares this RF value with the process setting. When the control element detects that the 〆RF value is larger than the start event value (step 33), it starts a data collection work in a storage step according to the sample event value (step 34).

10th stomach 449 79 1 V. Description of the invention (8) Next, when the data collection time is longer than the execution event value, the control element will end the data collection step of the wafer (step 3 5). In addition, the control element compares the initial RF value with the effective time value. When the initial RF value continuously appears for a period of time that does not exceed the effective time value, the control element orders the etching machine to re-do the wafer. Processing steps (steps 3 6). And when the initial RF value appears continuously for more than the valid time value, the step of collecting data on this wafer is ended (step 37), and then the control element confirms the operation statistics of this batch of wafers (step 38) ). If this batch of wafers has not been fully processed, the silver engraving machine will operate the next wafer processing step.

Page 11 4 '4 9 79 1' Schematic description The first diagram is a block diagram of the system of the present invention; the second diagram is a block diagram of the method of the present invention; and the third diagram is a schematic diagram of the process according to the present invention Symbols of main parts 11 System 1 2 Control element 1 3 Program equipment 14 Communication unit 15 Sensor

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Claims (1)

449791 The control data in the machine is connected to the control system. The connection system and the process at least include a control element, a signal, and a parameter signal lever used to control the control element. Including a number of instructions for this storage process; library storage procedures such as the patent application scope of the "!" Command. &Amp; ·, '' Among the above control-Du Yi input module to use ~ 丨 A more. Control module for two; event command; display module for ordering light; and display ... order and the data of the order of the remaining program 3. If the scope of the patent application includes the following at least: ',' Enter a start command, use ~ 々 to the sampling command, and use. Jun and edge process parameter signals to set a valid time to set a comparison in the stored program; the valid time command and # use a valid value to review the process parameter Time; an initial step; "The Haiqi start command is now being stored in the system. It is said that when an order is executed, the line value is the stored procedure. The execution value is reviewed by the process parameter sequence. The unit execution cycle β is also , Recording 4. If the scope of the patent application / the system of ____ members, the above-mentioned storage 449791 6. The scope of the patent application includes: reading the process parameter signal from the connection; using the start command, the sampling command, the validity The time order and the execution-execution order review the process parameter signals; and store a process data in the control element. 5. The system according to item 1 of the scope of patent application, wherein the above-mentioned process parameter signals are a series of analog signals " The system for controlling data collection in the machine at least includes:, / \ A connection Fu, the connection Fu communicates with the process machine to receive multiple process parameter signals when operating the process machine; a data collection module, according to A number of event commands execute a stored procedure, the event commands include at least a start command, a sampling command, a valid time command, and an execution command; and a control module is connected to the data collection module and includes at least the 'storage' Program stored data. 7. If the system of claim 6 is applied for, the data of the above-mentioned stored procedure is selected from the process parameter signals. C ^ 8. If the system of claim 6 is applied for, the above-mentioned start command at least includes a start value to be compared with the process parameter signal, and a command to issue a start step of a storage procedure. Page 14 449791 Sixth, the scope of patent application Fan Li Zhuan, please apply to the order of the order to the above description. In the meantime, the sample is taken from the following: one of the items 6 is set to be stored in the process, including the 9 interests, please apply for the association. The brackets include the information from the minority to the ordering process, and the time to check the effectiveness of the trial, the time and the effectiveness of the time, and the unified order of the order from the beginning of the order of 6 to the execution of the order This, 11 · "-Pass, the number of newsletters on the number of 'participating in the process. In the meantime, the time sequence is checked and executed. The time sequence of the time is one-time and one-line. The order is to save and store the relevant benefits and apply for the application. For example, if you apply for the system of item 6 of the patent scope, the above control module It further includes: an input module for inputting the start command, the sampling command, the effective time command, and the execution command; and an output module for displaying the start command, the sampling command, and the effective time Command, the execution command, and the data in the stored program. 1 3. If the system of item 6 of the scope of patent application, the above-mentioned process parameter signal is a series of analog signals. 14. The method of data collection in the machine at least includes: collecting a set of process parameter signals generated by the process machine Page 15 449791, 79 Γ… 6. Scope of patent application Enter multiple process event settings in a control element. The process event settings include at least a start event value, a sampling event value, a valid time event value and a Executing event values; comparing the process parameter signals and the process event settings in the control element; and, selectively storing data of the process parameter signals in the control element. -1 5. The method according to item 14 of the scope of patent application, wherein the selective storage step is to store some data of the process parameter signal after comparing the process parameter signal and the setting of the process event. 16. The method according to item 14 of the scope of patent application, wherein the above-mentioned sampling event value is used to control a sampling time of the process parameter signal. 17. The method according to item 14 of the scope of patent application, wherein the valid time event value described above is used to check the duration of a value of the process parameter signal, which value is greater than the start event value. 1 8. The method according to item 14 of the scope of patent application, wherein the above-mentioned execution event value is used to check a unit execution time of the process parameter signal. 19. The method of claim 18 in the scope of patent application, wherein the unit execution time is the time to operate one wafer in a batch in the process machine, and the batch includes at least multiple wafers. Page 16