TWI621191B - Method and system for remotely monitoring wafer testing equipment - Google Patents

Abstract

A remote monitoring method and system for a wafer testing machine. In this method, a monitoring device is connected to multiple test machines through a network to control each test machine to move a wafer, and then a preparation code is mounted on the test machine to control the test machine to read the identification of the wafer. Parameters, and compare the read identification parameters with the product parameters obtained from the manufacturing execution system. Wherein, if the comparison results match, at least one work code is sequentially mounted on the test machine to control the test machine to test multiple dies on the wafer and output test data. Finally, when all the dies of the wafer are tested, each test machine is controlled to move the wafer out.

Description

Remote monitoring method and system for wafer testing machine

The invention relates to a monitoring method and system, and in particular to a remote monitoring method and system of a wafer testing machine.

With the requirements of integrated circuit (Integrated Circuits, IC) components in terms of processing speed, function, miniaturization, and weight reduction, semiconductor processes are also developing toward miniaturization and high density. In the semiconductor industry, the production of integrated circuits is mainly divided into three stages: the manufacture of wafers, the production of integrated circuits, and the packaging of integrated circuits. While carrying out the above-mentioned production steps, it is necessary to perform various tests on the wafer in order to sort out the bad dies on the wafer to ensure the process quality and production yield.

Wafer testing can be divided into two major parts, namely wafer probe and classification carried out with the process, and final testing after packaging is completed. Among them, the wafer pin test is performed after each process is completed, using a test machine such as a wafer pin tester (prober) to sequentially test the die on the wafer to measure the electrical properties of each die. And classify the grains. The grains classified as defective will not be subjected to subsequent processes to save production costs.

Wafer pin testing currently relies on operators to manually operate on the pin testing machine. After checking various parameters and confirming, manually start the machine for testing. During the manual operation of the operator by the operator, the product information will enter the Manufacturing Execution System (MES). At this time, the operator needs to manually post to the machine. After the standby test is completed, it is manually posted to the manufacturing execution system by the operator. However, when the machine operation is completed or there is an abnormality, if the operator does not find it immediately, the machine will be idle. In addition, the time for the operator to hang and charge the account often differs from the time of the machine. Once the product is abnormal, it is often difficult to trace the operation time.

The invention provides a remote monitoring method and system for a wafer testing machine. The monitoring device is connected to the machine for centralized management, which can effectively improve the testing efficiency.

The remote monitoring method of the wafer testing machine of the present invention is suitable for monitoring multiple testing machines by a monitoring device. This method connects each test machine through the network to control the test machine to move in a wafer, and then mounts a setup code on the test machine to control the test machine to read the wafer. Identification parameters, and the read identification parameters are compared with product parameters obtained from Manufacturing Execution System (MES). Wherein, if the comparison results match, at least one work code is sequentially mounted on the test machine to control the test machine to test multiple dies on the wafer and output test data. Finally, when all the dies of the wafer are tested, the test machine is controlled to move the wafer out.

In an embodiment of the present invention, before the step of connecting each test machine through the network to control the test machine to move into the wafer, the method further includes calibrating the time of each test machine so that these test machines The time of the station is consistent with the time of the monitoring device.

In an embodiment of the present invention, the step of sequentially mounting at least one work code on the test machine to control the test machine to test the die on the wafer and output the test data includes the test machine. A test code is mounted on the test machine to control the test machine to perform the first test on a part of the wafers on the wafer. When the first test is over, the test machine is controlled to stop and a check code is mounted on the test machine to check whether the result of the first test is normal. Among them, if the result of the first test is normal, continue to mount other work codes to control the test machine to test other dies on the wafer and output test data until all the dies of the wafer have been tested. ; If the result of the first test is abnormal, the wafer test is ended.

In an embodiment of the present invention, when all the dies of the wafer have been tested, the method further includes calculating the elapsed time of the wafer moving in and out of the test machine, and calculating the test according to the number of tests performed by the test machine. The time it takes the machine to perform each test.

In an embodiment of the present invention, when all the dies of the wafer are tested, the method further includes accumulating the time when each work code is mounted to evaluate the test machine's cost of executing the test work corresponding to each work code. time.

In an embodiment of the present invention, the step of sequentially mounting at least one work code on the test machine to control the test machine to test the die on the wafer and output the test data further includes judging the test machine. Whether one of the predefined events occurred during the test. Among them, if one of the events is met, the predefined test data required when the event occurs is output.

In an embodiment of the present invention, the method further includes connecting each test machine through a network to obtain real-time messages generated by each test machine for testing, and displaying the monitoring information obtained by each test machine on a monitoring page. Instant message.

In an embodiment of the present invention, after the step of displaying the instant messages of each testing machine on the monitoring page, the method further includes receiving a control operation for one of the testing machines in the monitoring page to pass through the network. Connect the test machine corresponding to this control operation to control the test machine.

In an embodiment of the present invention, after the step of receiving a control operation on one of the test machines in the monitoring page, the method further includes controlling the corresponding test machine through a network connection to display the test machine. The man-machine interface of the test platform receives a control operation on the man-machine interface, and controls the test machine to perform a function corresponding to the control operation.

In an embodiment of the present invention, the step of displaying the instant messages of each testing machine on the monitoring page further includes displaying all testing machines connected to the monitoring device, and receiving at least one of the displayed testing machines. The selection operation is based on the test machine that displays the instant message on the monitoring page.

A remote monitoring system for a wafer testing machine of the present invention includes a manufacturing execution system for storing product parameters, a plurality of testing machines, and a monitoring device. The monitoring device includes a communication device, a storage device and a processor. Among them, the communication device is used to connect various test machines and manufacturing execution systems through the network. The storage device is used to store a plurality of work codes. The processor is coupled to the communication device and the storage device, and is configured to use the communication device to mount a preparation code among the work codes on each test machine to control the test machine to read the identification parameters of the wafer and read the read parameters. Comparison of the identification parameters with the product parameters obtained from the manufacturing execution system. Wherein, the processor includes, when the comparison results match, using the communication device to sequentially mount at least one work code on the test machine to control the test machine to test multiple dies on the wafer and output test data. . When all the dies of the wafer are tested, the processor includes a communication device to control the test machine to remove the wafer.

In an embodiment of the present invention, the processor further uses a communication device to connect each test machine to correct the time of each test machine, so that the time of these test machines is consistent with the time of the monitoring device.

In an embodiment of the present invention, the above-mentioned processor further loads a test code on the test machine, so as to connect each test machine with a communication device, and control the test machine to perform the first step on part of the dies on the wafer. One test, and at the end of the first test, control the test machine to stop, and mount a test code on the test machine to check whether the result of the first test is normal. Among them, if the result of the first test is normal, continue to mount other work codes to control the test machine to test other die on the wafer and output test data until all the die of the wafer have been tested; If the result of the first test is abnormal, the wafer test is ended.

In an embodiment of the present invention, the processor further calculates the elapsed time for the wafer to move in and out of the test machine, and calculates the time taken by the test machine for each test based on the number of tests performed by the test machine.

In an embodiment of the present invention, the processor further accumulates the time during which each work code is mounted to evaluate the time taken by the test machine to perform the test work corresponding to the work code.

In an embodiment of the present invention, the processor further determines whether one of a plurality of predefined events occurs when the test machine performs a test, and if one of the events is met, the test machine is controlled to output a predefined Test information required when this event occurs.

In an embodiment of the present invention, the processor further uses a communication device to connect to each test machine through a network to obtain instant messages generated by each test machine for testing, and displays on the monitor of the monitoring device including: Monitoring page for instant messages of each test machine.

In an embodiment of the present invention, the processor further uses an input device to receive a control operation on one of the test machines displayed on the monitoring page of the display, so as to use a communication device to connect to the control operation through a network. The test machine controls the test machine.

In an embodiment of the present invention, the processor further uses a communication device to control and operate a corresponding test machine through a network connection to display a human-machine interface of the test machine, and uses an input device to receive the human-machine interface. Control operation to control the test machine to perform the function corresponding to this control operation.

In an embodiment of the present invention, the processor further displays all the test machines connected to the monitoring device on the display, and uses the input device to receive a selection operation for one of the test machines displayed on the display, so that Determine the test machine that displays instant messages on the monitoring page displayed on the monitor.

Based on the above, the remote monitoring and system of the wafer test machine of the present invention cooperates with the monitoring device to obtain the test machine by setting the product information to be used on the manufacturing execution system and the corresponding test machine setting information. The current situation, and through data comparison verification to confirm whether you can automatically go on and off. At the same time, the information of the testing machine is collectively displayed in the monitoring device, so that the operator can set the testing machine to be monitored, and can directly connect to the testing machine to set the parameters. This can effectively improve test efficiency. In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

The remote monitoring system of the present invention is an independent monitoring device connected to each test machine and Manufacturing Execution System (MES) on the production line through a network, which can receive product information on the manufacturing execution system. And receive the real-time signal of the test machine through the Equipment Automatic Program (EAP). The monitoring device can remotely give commands to the test machine, and display the instant messages and test results of the test machine on the monitoring page in a centralized manner to achieve the effect of remote control and centralized management.

FIG. 1 is a schematic diagram of a remote monitoring system of a wafer testing machine according to an embodiment of the present invention. Referring to FIG. 1, the remote monitoring system 1 of this embodiment includes a monitoring device 10, a manufacturing execution system 12, and a plurality of testing machines 14, 16, and 18. Wherein, this embodiment is described by taking three test machines 14, 16, and 18 as an example, but is not limited thereto. In other embodiments, the remote monitoring system 1 may include more test machines.

The manufacturing execution system 12 is used to control the overall process of wafer testing and store product parameters, including process type, process time, wafer batch, batch number, serial number and other parameters. The testing machines 14, 16, 18 are, for example, probers that can be used for wafer pin testing, which test, for example, the die on a specified batch of wafers in a stepwise manner. The monitoring device 10 is, for example, a desktop computer, a notebook computer, a workstation, a server, or other smart phones, personal digital assistants, or tablet computers with computing functions. This embodiment is not limited thereto. The monitoring device 10 is connected to the manufacturing execution system 12 and the testing machines 14, 16, 18 through the network 20, and is used to control the testing machine 14, 16, 18 to perform operations such as loading and unloading, product identification, and die testing of the wafer to be tested. , And receive the test results from each test machine 14, 16, 18, and display them on the monitoring page for the operator to review and follow-up management.

Specifically, FIG. 2 is a block diagram of a remote monitoring device of a wafer testing machine according to an embodiment of the present invention. Please refer to FIG. 2, this embodiment illustrates the composition and functions of the monitoring device 10 in FIG. 1. The monitoring device 10 includes a communication device 102, a storage device 104, a display 106, an input device 108, and a processor 110, and its functions are described as follows:

The communication device 102 is, for example, a wireless network card supporting a wireless communication standard such as the Institute of Electrical and Electronics Engineers (IEEE) 802.11n / b / g or a wired network such as Ethernet. The connected network card can be connected to other devices on the network 20 through a wired or wireless method.

The storage device 104 is, for example, any type of random access memory (RAM), read-only memory (ROM), flash memory, hard disk, or similar components, or A combination of the above elements. The storage unit 104 can be used to store the work code of the test machine.

The display 106 adopts, for example, a liquid crystal display (LCD), a light-emitting diode (LED), a field emission display (FED), or other types of panels as the display panel, and uses a light-emitting panel. Light-Emitting Diode (LED) is used as the screen of the backlight module. The display 106 may receive an externally input picture to display the picture on the display panel.

The input device 108 is, for example, a keyboard, a mouse, a touch pad, a trackball, and other input tools that can provide a user to operate the monitoring device 10. The input device 108 may also be a resistive, capacitive or other type of touch detection element, which can be integrated with the display 106 as a touch screen, and can detect the user's touch while displaying the screen of the monitoring device 10 Touch operation.

The processor 110 is, for example, a central processing unit (CPU) with a single core or multiple cores, or other programmable general-purpose or special-purpose microprocessors (Microprocessors), digital signal processors (Digital Signal Processors) Processor (DSP), programmable controller, Application Specific Integrated Circuits (ASIC), Programmable Logic Device (PLD) or other similar devices or a combination of these devices. The processor 110 is coupled to the communication device 102, the storage device 104, the display 106, and the input device 108, and is configured to perform a remote monitoring function of the wafer testing machine in the embodiment of the present invention. The following examples illustrate the detailed steps of the monitoring device 10 performing remote monitoring on the wafer testing machine.

FIG. 3 is a flowchart of a remote monitoring method for a wafer testing machine according to an embodiment of the present invention. Please refer to FIG. 1, FIG. 2, and FIG. 3 at the same time. The method in this embodiment is applicable to the remote monitoring system 1 and the monitoring device 10 in FIG. 2 described above, and the following is used in conjunction with the remote monitoring system 1 and FIG. 2 in FIG. 1. Each element of the monitoring device 10 describes the detailed steps of the remote monitoring method in this embodiment:

First, the processor 110 uses the communication device 102 to connect to the network 20, and connects the test machines 14, 16, and 18 through the network 20, respectively, to control the test machines 14, 16, and 18 to move into the wafer (step S302). The following uses the test machine 14 as an example for description, but is not limited thereto. The following monitoring method is applicable to all test machines connected to the monitoring device 10. It should be noted that before the processor 110 controls the test machine 14 for operation, for example, the time of the test machine 14 is first corrected so that the time of the test machine 14 is consistent with the time of the monitoring device 10 to facilitate subsequent tracking. Among them, after the test machine 14 is moved into the wafer, an operator can put a wafer box and a probe card on the test machine 14 to prepare for testing.

Next, the processor 110 accesses the work code stored in the storage device 104, and uses the communication device 102 to mount the setup code in the work code on the test machine 14 to control the test machine 14 to read the crystal. Identification parameters of the circle, and compare the read identification parameters with the product parameters obtained from the manufacturing execution system 12 (step S304). The processor 110, for example, uses the communication device 102 to connect to the manufacturing execution system 12 through the network 20 to obtain the current product parameters, including the batch number, serial number, and wafer number of the wafer to be tested, and then sets these parameters. A comparison is performed with the identification parameters of the wafer read by the test machine 14 to determine whether the comparison result is consistent (step S306). At the same time, the processor 110 also obtains process parameters such as process type and time from the manufacturing execution system 12 as a basis for controlling the test machine 14 for subsequent testing.

If the comparison result does not match, the processor 110 uses the communication device 102 to control the test machine 14 to end the test (step S308). On the contrary, if the comparison results match, the processor 110 will continue to use the communication device 102 to sequentially mount the work code on the test machine 14 according to the process parameters such as the process type and time, so as to control the test machine 14 on the wafer. The multiple dies are tested and test data is output (step S310). The processor 110, for example, defines multiple events for various conditions that may occur when the test machine 14 performs a test, so that during the test of the wafer by the test machine 14, it is possible to continuously track and determine whether or not Pre-defined events. If an event is determined, the test machine 14 can be controlled to output the test data required when the event occurs according to a predefined action.

Finally, the processor 110 determines whether all the dies on the wafer have been tested (step S312). If there are still dies that have not been tested, go back to step S310 and continue to mount the work code for testing. Until all the dies are tested, the processor 110 will use the communication device 102 to control the test machine 14 to remove the wafer (step S314). After the test is completed, the processor 110 may first notify an operator to withdraw the wafer box on the test machine 14, and then control the test machine 14 to remove the wafer.

It should be noted that, before the wafer is tested, the monitoring device 10, for example, additionally checks the pin test card of the test machine 14 to ensure that the pin test card does not affect the test of the wafer.

In detail, FIG. 4 is a flowchart of a remote monitoring method of a wafer testing machine according to an embodiment of the present invention. Please refer to FIG. 1, FIG. 2, and FIG. 4 at the same time. The method in this embodiment is applicable to the remote monitoring system 1 and the monitoring device 10 in FIG. 2 described above. The following is used in conjunction with the remote monitoring system 1 and FIG. 2 in FIG. 1. Each element of the monitoring device 10 describes the detailed steps of the remote monitoring method in this embodiment:

In this embodiment, after step S306 in FIG. 3, that is, after confirming that the identification parameters of the wafer are consistent with the product parameters obtained from the manufacturing execution system, the processor 110 first uses the communication device 102 to mount a test code of a pin test card At the test machine 14, the test machine 14 is controlled to perform a first test on a part of the dies on the wafer (step S402). When the first test is over, the processor 110 uses the communication device 102 to control the test machine 14 to stop (step S404), and then mounts a check code on the test machine 14 to check whether the result of the first test Normal (step S406). Among them, the test machine 14 may check, for example, whether the pin marks on the wafer are normal.

If the result of the first test is abnormal, it means that the probe card may be damaged. At this time, the processor 110 uses the communication device 102 to control the test machine 14 to end the test (step S408), so that the operator can inspect the test machine 14. Conversely, if the result of the first test is normal, it means that the probe card is normal. At this time, the processor 110 will continue to use the communication device 102 to sequentially mount the work code on the test machine 14 to control the test machine 14 to the wafer. The plurality of dies on the chip are tested, and test data is output (step S410).

Finally, the processor 110 determines whether all the dies on the wafer have been tested (step S412). If there are still dies that have not been tested, go back to step S410 and continue to mount the work code for testing. Until all the dies are tested, the processor 110 will use the communication device 102 to control the test machine 14 to remove the wafer (step S414), and the test is ended.

With the above method, the monitoring device 10 can automatically connect with the manufacturing execution system 12 to obtain the product parameters required for the test. It can also remotely mount the work code instead of manually mounting it, and automatically control the test machine. The stage 14 tests the die. The monitoring device 10 can also use the communication device 102 to receive the test results of each test machine to centrally manage these data.

It should be noted that, since the embodiment of the present invention uses a monitoring device to automatically control the testing machine for wafer testing, this method not only saves the labor and time spent manually setting up the machine, but also enables testing during wafer testing. The time actually taken by the machine to execute each step can be used to calculate the time taken by the test machine for each test, and the time taken by the test machine to perform the operations of each working code.

In detail, the monitoring device can calculate the elapsed time of the wafer moving in and out of the test machine, and calculate the time taken by the test machine for each test based on the number of times the test machine has tested the wafer this time. On the other hand, the monitoring device can also accumulate the time when each work code is mounted to evaluate the time taken by the test machine to perform the test work corresponding to each work code, thereby providing an operator for evaluating the test cost.

On the other hand, in addition to the functions of the remote control test machine described above, the monitoring device can also connect to each test machine through the network to obtain real-time messages generated by each test machine for testing, and Instant messages are displayed on the monitoring page for operators to view the current status of each test machine.

In addition, the monitoring device can also provide an operator to edit and control the test machine in the monitoring page to edit the test machine to be controlled and control the specific test machine. Among them, the monitoring device can display all the testing machines connected to it, and receive the operator's selection operation on the displayed testing machines, so as to determine the testing machines that they want to see instant messages on the monitoring page.

On the other hand, the monitoring device receives, for example, a control operation performed by the operator on the test machine displayed on the monitoring page, so as to control the test machine by using the test machine corresponding to the control operation via a network connection.

It should be noted that the monitoring device can directly control and operate the corresponding test machine through the network to obtain the screen of the man-machine interface of the test machine and display the man-machine interface of the test machine on its display. In addition, the monitoring device can further receive an operator's control operation on the human-machine interface, thereby controlling the test machine to perform a function corresponding to the control operation.

For example, FIG. 5 is a setting page for selecting a testing machine to be monitored according to an embodiment of the present invention. FIG. 6 is a monitoring page of a monitoring device according to an embodiment of the present invention. Please refer to FIG. 5 first. For example, the monitoring device displays a list 50 of testing machines that have been successfully connected to the monitoring device. A check box is provided in front of each testing machine for the operator to select the testing machine to be monitored. .

After the operator selects and presses the save button 52, the monitoring device will display a monitoring page 60 as shown in FIG. 6. This monitoring page 60 lists the monitoring data of the test machine selected by the operator, including multiple The field 62 is for the operator to check the status of the machine and perform subsequent operations accordingly. Among them, the operator can select the machine icon 64 in the remote control field, so that the monitoring device can directly connect to the corresponding test machine through the network to obtain the screen of the man-machine interface of the test machine and monitor the machine. The man-machine interface of this test machine is displayed on page 60. The human-machine interface displayed on the monitoring device is similar to the remote desktop of the test machine, which allows the operator to operate on this man-machine interface, and directly controls the test machine to perform the functions corresponding to the control operation without having to go to the test machine. Operate forward.

In summary, the method and system for remote monitoring of a wafer testing machine of the present invention obtain the status of the machine by establishing a connection between the monitoring device and the testing machine, confirming product parameters through data comparison and verification, and The method of loading work codes on the end controls the test machine for testing, and the test results are centrally displayed on the monitoring page by the monitoring device. In this way, the operator can monitor the status of the test machine at any time in the factory and dispose of it immediately, thereby improving the test efficiency.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

1: Remote monitoring system 10: Monitoring device 12: Execution system 14, 16, 18: Test machine 102: Communication device 104: Storage device 106: Display 108: Input device 110: Processor 50: Machine list 52: Storage button 60: Monitoring page 62: Field 64: Machine icon S302 ~ S314: Steps S402 ~ S414: Wafer of an embodiment of the present invention Steps of testing machine's remote monitoring method

FIG. 1 is a schematic diagram of a remote monitoring system of a wafer testing machine according to an embodiment of the present invention. FIG. 2 is a block diagram of a remote monitoring device of a wafer testing machine according to an embodiment of the present invention. FIG. 3 is a flowchart of a remote monitoring method for a wafer testing machine according to an embodiment of the present invention. FIG. 4 is a flowchart of a remote monitoring method for a wafer testing machine according to an embodiment of the present invention. FIG. 5 is a setting page for selecting a testing machine to be monitored according to an embodiment of the present invention. FIG. 6 is a monitoring page of a monitoring device according to an embodiment of the present invention.

Claims (18)

A remote monitoring method for a wafer testing machine is suitable for monitoring a plurality of testing machines by a monitoring device. The method includes the following steps: each of the testing machines is connected through a network to control the testing machine to move in ( move in) a wafer; mount a setup code on the test machine to control the test machine to read the identification parameters of the wafer, and compare the read identification parameters with the self-manufacturing execution system (Manufacturing Execution System, MES) comparison of product parameters; if the comparison results match, at least one work code is sequentially mounted on the test machine to control the test machine to multiple dies on the wafer Perform testing and output test data, wherein if one of a plurality of predefined events occurs during the test on the test machine, output the test data required when the predefined event occurs; and when the When all the dies of the wafer are tested, the test machine is controlled to move out of the wafer. The method according to item 1 of the scope of patent application, wherein before the step of connecting each of the test machines through a network to control the test machine to move into the wafer, the method further includes: calibrating each of the test machines Time so that the time of the test machine is consistent with the time of the monitoring device. The method according to item 1 of the scope of patent application, wherein the at least one work code is sequentially mounted on the test machine to control the test machine to test the die on the wafer and output The step of testing data includes: mounting a test code on the test machine to control the test machine to perform a first test on a part of the dies on the wafer; when the first test ends, control The test machine is stopped and a check code is mounted on the test machine to check whether the result of the first test is normal; if the result of the first test is normal, continue to mount the other at least one working code To control the test machine to test other said dies on the wafer and output the test data until all the dies of the wafer have completed the test; and if the result of the first test is abnormal To end the test of the wafer. The method according to item 1 of the scope of patent application, wherein when all the dies of the wafer have been tested, the method further comprises: calculating the elapsed time of the wafer moving in and out of the testing machine, and according to the test The number of times the machine performs tests and calculates the time it takes for the test machine to perform each test. The method according to item 1 of the scope of patent application, wherein when all the dies of the wafer have been tested, the method further includes: accumulating the time when each of the work codes is mounted to evaluate the test machine The time it took to execute the test job corresponding to the working code. The method according to item 1 of the scope of patent application, further comprising: connecting each of the test machines through a network to obtain each of the test machines for The instant message generated during the test; and displaying the instant message obtained by each of the test machines on a monitoring page. The method according to item 6 of the patent application, wherein after the step of displaying the instant message of each of the test machines on the monitoring page, the method further comprises: receiving one of the test machines in the monitoring page Control operation; and connecting the test machine corresponding to the control operation through the network to perform the control operation on the test machine. The method according to item 7 of the scope of patent application, wherein after receiving the control operation for one of the test machines described in the monitoring page, the method further includes connecting the test corresponding to the control operation through the network. A machine to display the man-machine interface of the test machine; and receive the control operation for the man-machine interface to control the test machine to perform a function corresponding to the control operation. The method according to item 6 of the scope of patent application, wherein the step of displaying the instant message of each of the testing machines on the monitoring page further comprises: displaying all the testing machines connected to the monitoring device; The selecting operation of at least one of the displayed testing machines is determined based on the testing machine displaying the instant message on the monitoring page. A remote monitoring system for a wafer testing machine includes: a manufacturing execution system that stores product parameters; A plurality of test machines; and a monitoring device, including: a communication device, connecting each of the test machines and the manufacturing execution system through a network; a storage device that stores a plurality of work codes; and a processor that is coupled to the communication device And the storage device, wherein the processor includes using the communication device to mount a preparation code in the work code to each of the test machines to control the test machine to read the identification parameters of the wafer, and The read identification parameter is compared with the product parameter obtained from the manufacturing execution system; the processor includes when the comparison result matches, using the communication device to sequentially mount at least one of the working codes on the test machine Platform to control the test machine to test multiple dies on the wafer and output test data, wherein the processor further determines whether one of a plurality of predefined events occurs during the test of the test machine First, if one of the events is met, controlling the test machine to output the test data required when the event occurs in advance as defined; and the processor includes the Upon completion of the test with a die, by using the communication means controls the wafer out of the testing machine. The system according to item 10 of the scope of patent application, wherein the processor further uses the communication device to connect to each of the test machines to correct the time of each of the test machines, so that the test machine The time is consistent with the time of the monitoring device. The system according to item 10 of the scope of patent application, wherein the processor further loads a test code on the test machine to use the communication device to connect each of the test machines to control the test machine to the test machine. Some of the dies on the wafer are tested for the first time, and at the end of the first test, the test machine is controlled to stop, and a test code is mounted on the test machine to test the first test. Whether the result of the test is normal, and if the result of the first test is normal, continue to mount other work codes to control the test machine to test the other die on the wafer and output the test data Until all the dies of the wafer are tested, and if the result of the first test is abnormal, the test of the wafer ends. The system according to item 10 of the scope of patent application, wherein the processor further calculates the elapsed time for the wafer to move in and out of the test machine, and calculates each time the test machine performs according to the number of tests performed by the test machine. Time spent on one test. The system according to item 10 of the scope of patent application, wherein the processor further accumulates the time when each work code is mounted to evaluate the time taken by the test machine to perform the test work corresponding to the work code. The system according to item 10 of the scope of patent application, wherein the processor further uses the communication device to connect each of the test machines through a network to obtain instant messages generated by each of the test machines for testing, and A monitoring page including the instant message of each of the testing machines is displayed on a display of the monitoring device. The system of claim 15, wherein the processor further uses an input device to receive the test described in the monitoring page displayed on the display. One of the control operations of the machine is to use the communication device to connect the test machine corresponding to the control operation through the network to perform the control operation on the test machine. The system according to item 16 of the patent application scope, wherein the processor further uses the communication device to connect the test machine corresponding to the control operation through the network to display the human-machine interface of the test machine, and utilizes The input device receives the control operation for the man-machine interface, and controls the test machine to perform a function corresponding to the control operation. The system according to item 15 of the scope of patent application, wherein the processor further displays all test machines connected to the monitoring device on the display, and uses an input device to receive at least the test machines displayed on the display. One of the selection operations is based on the test machine displaying the instant message on the monitoring page displayed on the display.