CN107462821B - Remote monitoring method and system for wafer test machine - Google Patents
Remote monitoring method and system for wafer test machine Download PDFInfo
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- CN107462821B CN107462821B CN201610640916.2A CN201610640916A CN107462821B CN 107462821 B CN107462821 B CN 107462821B CN 201610640916 A CN201610640916 A CN 201610640916A CN 107462821 B CN107462821 B CN 107462821B
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- 238000012360 testing method Methods 0.000 title claims abstract description 162
- 238000012544 monitoring process Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000012806 monitoring device Methods 0.000 claims abstract description 58
- 239000013078 crystal Substances 0.000 claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 claims abstract description 34
- 238000004891 communication Methods 0.000 claims description 37
- 238000003860 storage Methods 0.000 claims description 14
- 230000002159 abnormal effect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 78
- 230000006870 function Effects 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000006399 behavior Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2648—Characterising semiconductor materials
Abstract
The invention provides a remote monitoring method and a remote monitoring system for a wafer test machine. The method comprises connecting multiple test machines through network by a monitoring device to control each test machine to move into a wafer, mounting preparation codes on the test machines to control the test machines to read identification parameters of the wafer, and comparing the read identification parameters with product parameters obtained by a manufacturing execution system. If the comparison result is consistent, at least one working code is sequentially mounted on the test machine to control the test machine to test a plurality of crystal grains on the wafer and output test data. And finally, when all the crystal grains of the wafer are tested, controlling each testing machine to move the wafer out. According to the technical scheme, the product information to be operated and the corresponding setting information of the test machine are set on the manufacturing execution system, and the monitoring device is matched to obtain the current condition of the test machine, so that the test efficiency can be effectively improved.
Description
Technical field
The invention relates to a kind of monitoring method and systems, and in particular to a kind of distal end of wafer test board
Monitoring method and system.
Background technique
As integrated circuit (Integrated Circuits, IC) element is for processing speed, function, miniaturization, light weight
Various requirements such as change, manufacture of semiconductor is also towards micromation, densification development.In semiconductor industry, integrated circuit
Production, be broadly divided into three phases: manufacture, the production of integrated circuit and the encapsulation of integrated circuit of wafer (wafer).And
While carrying out above-mentioned production stage, it is also necessary to various tests is carried out to wafer, to pick out the bad crystal grain on wafer,
Ensure process quality and production yield.
Wafer test can mainly divide into two major parts, be the wafer probing (wafer carried out with processing procedure respectively
Probe) and classify, and the final test after the completion of encapsulation.Wherein, wafer probing is utilized after the completion of every one of processing procedure
The tester tables such as wafer probing machine (prober), sequentially test the crystal grain on wafer, to measure the electricity of each crystal grain
Property, and classify to crystal grain.The crystal grain for being wherein classified as defective products will no longer carry out subsequent processing procedure, be fabricated to saving
This.
Wafer probing all relies on operator at present and is manually operated on prober platform, and parameters to be checked simultaneously confirm
Afterwards, it then manually boots board and is tested.During machine up and down is manually operated in operator, product information can enter manufacture
Execution system (Manufacturing Execution System, MES), need to be transferred items manually by operator to board at this time
On.After board is tested into, then need to be transferred items manually by operator to manufacturing execution system again.However, when board operation is complete
At or when having abnormal generate, if operator does not have found immediately, it is idle that it will cause boards.Moreover, operator's carry with
It is poor for a period of time that the time transferred items often exists with the time of board, when product has abnormal generate, it tends to be difficult to which retrospect is made
The industry time
Summary of the invention
The present invention provides the remote monitoring method and system of a kind of wafer test board, utilizes monitoring device and board line
To be managed concentratedly, testing efficiency can be effectively promoted.
The remote monitoring method of wafer test board of the invention, suitable for monitoring multiple tester tables by monitoring device.This
Method moves into (move in) wafer by each tester table of network connectivity, to control tester table, then in tester table
Upper carry prepares (setup) code, to control the identification parameter that tester table reads wafer, and by read identification parameter with
The product parameters that manufacturing execution system (Manufacturing Execution System, MES) obtains compare.Wherein, if than
It is consistent to result, sequentially at least one operation code of carry on tester table, to control tester table to multiple on wafer
Crystal grain is tested, and is outputed test data.Finally, control tester table will be brilliant when all crystal grains of wafer complete test
Circle removes (move out).
In one embodiment of this invention, it above by each tester table of network connectivity, is moved with controlling tester table
Before the step of entering wafer, the method also includes correcting the time of each tester table, so that the time of these tester tables
With the time consistency of monitoring device.
In one embodiment of this invention, sequentially at least one operation code of carry is set forth on tester table, above with control
Tester table tests the crystal grain on wafer, and the step of outputing test data includes the test of carry one on tester table
Code carries out first time test to control tester table to the portion crystal on wafer.At the end of first time tests, then control
Tester table is shut down, and carry one checks code on tester table, to check whether the first time result of test is normal.Its
In, if the result of test is normal for the first time, continue carry others operation code, to control tester table to other on wafer
Crystal grain is tested, and is outputed test data, until all crystal grains of wafer are all completed to test；If the result of test is not for the first time
Normally, then terminate the test of wafer.
In one embodiment of this invention, brilliant the method also includes calculating when all crystal grains of wafer complete test
Circle moves in and out tester table elapsed time, and the number tested according to tester table, and it is every to calculate tester table
Carry out primary test the time it takes.
In one embodiment of this invention, when all crystal grains of wafer complete test, the method also includes accumulative each
A operation code by the time of carry, with assess that tester table executes that the corresponding test job of each operation code spent when
Between.
In one embodiment of this invention, above-mentioned sequentially at least one operation code of carry on tester table, with control
Tester table tests the crystal grain on wafer, and the step of outputing test data further includes judging that tester table is being surveyed
Whether predetermined multiple event (event) one of is occurred when examination.Wherein, it if meeting one of event, exports
This event predetermined test data required when occurring.
In one embodiment of this invention, the above method further includes by each tester table of network connectivity, to obtain respectively
A tester table test generated instant messages, and on the monitoring page display obtained by each tester table it is instant
Information.
In one embodiment of this invention, it is upper be set forth in monitoring the page on show each tester table instant messages step
After rapid, the method also includes receiving the control operation for one of tester table in the monitoring page, to pass through network
This control of line operates corresponding tester table, to carry out control operation to this tester table.
In one embodiment of this invention, the control of one of tester table in the monitoring page is grasped in above-mentioned reception
After the step of making, the method also includes operating corresponding tester table by network connectivity control, to show tester table
Man-machine interface, and receive for this man-machine interface control operate, accordingly control tester table execute this control operation correspond to
Function.
In one embodiment of this invention, above-mentioned the step of showing the instant messages of each tester table on monitoring the page
Further include all tester tables of display with monitoring device line, and receives at least one of for shown tester table
Selection operation is decided by monitor the tester table for showing instant messages in the page accordingly.
A kind of far-end monitoring system of wafer test board of the invention is executed including the manufacture to store product parameters
System, multiple tester tables and monitoring device.Monitoring device includes communication device, storage device and processor.Wherein, communication dress
Set is to by each tester table of network connectivity and manufacturing execution system.Storage device is to store multiple work generations
Code.Processor couples communication device and storage device, to utilize communication device in the above-mentioned work of carry on each tester table
Steady code in code to control the identification parameter that tester table reads wafer, and by read identification parameter and is made
The product parameters for making the acquirement of execution system compare.Wherein, when processor is included in comparison result and is consistent, using communication device in survey
Sequentially at least one operation code of carry in commissioning stage, is tested with controlling tester table to multiple crystal grain on wafer, and
Output test data.And when all crystal grains of wafer are completed to test, processor controls tester table including the use of communication device
Wafer is removed.
In one embodiment of this invention, above-mentioned processor also utilizes each tester table of communication device line, with school
The time of just each tester table, so that the time consistency of the time of these tester tables and monitoring device.
In one embodiment of this invention, above-mentioned processor carry one also on tester table tests code, to utilize
The each tester table of communication device line, control tester table carry out first time test to the portion crystal on wafer, and the
At the end of primary test, control tester table is shut down, and carry one detects code on tester table, is tested for the first time with detection
Result it is whether normal.Wherein, if the result of test is normal for the first time, continue other operation codes of carry, to control test machine
Platform tests other crystal grain on wafer, and outputs test data, until all crystal grains of wafer are all completed to test；And if
The result of test is abnormal for the first time, then terminates the test of wafer.
In one embodiment of this invention, above-mentioned processor also calculates wafer and moves in and out what tester table was passed through
Time, and the number tested according to tester table calculate the primary test the time it takes of the every progress of tester table.
In one embodiment of this invention, above-mentioned processor also adds up each operation code by the time of carry, to comment
Estimate commissioning stage and executes the corresponding test job the time it takes of operation code.
In one embodiment of this invention, it is pre- also to judge whether tester table occurs when testing for above-mentioned processor
One of multiple events first defined, and if meet one of event, control tester table output it is predetermined this
Event test data required when occurring.
In one embodiment of this invention, above-mentioned processor also utilizes communication device to pass through each test machine of network connectivity
Platform carries out testing generated instant messages, and shows packet on the display of monitoring device to obtain each tester table
Include the monitoring page of the instant messages of each tester table.
In one embodiment of this invention, above-mentioned processor is also received using input unit for being shown in display
The control operation of one of tester table in the page is monitored, to pass through this control operation pair of network connectivity using communication device
The tester table answered carries out control operation to this tester table.
In one embodiment of this invention, above-mentioned processor also utilizes communication device to pass through network connectivity control operation pair
The tester table answered, to show the man-machine interface of tester table, and the control using input unit reception for this man-machine interface
System operation controls tester table accordingly and executes this corresponding function of control operation.
In one embodiment of this invention, above-mentioned processor is also shown all with monitoring device line over the display
Tester table, and the selection operation for one of tester table shown by display is received using input unit, accordingly
It is decided by show the tester table of instant messages in the monitoring page that display is shown.
Based on the remote monitoring and system of above-mentioned, of the invention wafer test board, by being set on manufacturing execution system
Surely the product information of machine and the set information of corresponding tester table are gone up, cooperation monitoring device obtains tester table present situation,
And it is confirmed whether can be performed automatically machine up and down by comparing verifying.The information centralized displaying of tester table is existed simultaneously
It in monitoring device, allows operator that can set the tester table to be monitored, and tester table can be directly wired to and do parameter
Setting.Whereby, testing efficiency can effectively be promoted.To make the foregoing features and advantages of the present invention clearer and more comprehensible, hereafter special
For embodiment, and attached drawing is cooperated to be described in detail below.
Detailed description of the invention
Fig. 1 is the schematic diagram according to the far-end monitoring system of wafer test board shown by one embodiment of the invention；
Fig. 2 is the block diagram according to the remote monitoring device of wafer test board shown by one embodiment of the invention；
Fig. 3 is the flow chart according to the remote monitoring method of wafer test board shown by one embodiment of the invention；
Fig. 4 is the flow chart according to the remote monitoring method of wafer test board shown by one embodiment of the invention；
Fig. 5 is the setting page according to the tester table to be monitored of selection shown by one embodiment of the invention；
Fig. 6 is the monitoring page according to monitoring device shown by one embodiment of the invention.
Description of symbols:
1: far-end monitoring system；
10: monitoring device；
12: manufacturing execution system；
20: network；
14,16,18: tester table；
102: communication device；
104: storage device；
106: display；
108: input unit；
110: processor；
50: board inventory；
52: storage button；
60: the monitoring page；
62: field；
64: board diagram；
S302~S314: the step of the remote monitoring method of the wafer test board of one embodiment of the invention；
402~S414: the step of the remote monitoring method of the wafer test board of one embodiment of the invention.
Specific embodiment
Far-end monitoring system of the invention is to pass through each test on network connectivity to producing line by independent monitoring device
Board and manufacturing execution system (Manufacturing Execution System, MES) can receive on manufacturing execution system
The product information of machine, and test machine is received by board automated procedures (Equipment Automatic Program, EAP)
The real-time signal of platform.Monitoring device can distally issue orders to tester table, and by the instant messages and test result of tester table
Centralized displaying is in the monitoring page, the effect of reaching remote control and manage concentratedly.
Fig. 1 is the schematic diagram according to the far-end monitoring system of wafer test board shown by one embodiment of the invention.Please
Referring to Fig.1, the far-end monitoring system 1 of the present embodiment include monitoring device 10, manufacturing execution system 12 and multiple tester tables 14,
16,18.Wherein, the present embodiment is illustrated by taking three tester tables 14,16,18 as an example, but not limited to this, in other implementations
In example, far-end monitoring system 1 may include more tester tables.
12 system of manufacturing execution system is managing the overall flow of wafer test and store product parameters, including processing procedure kind
The parameters such as class, processing time, the batch (batch) of wafer, lot number, serial number.Tester table 14,16,18 be, for example, can be used into
The prober (prober) of row wafer probing is, for example, to survey in a stepping manner to the crystal grain on the wafer of given batch
Examination.Monitoring device 10 be, for example, desktop computer, laptop, work station, servomechanism or other have the intelligence of calculation function
Energy mobile phone, personal digital assistant or tablet computer, the present embodiment are without being limited thereto.10 system of monitoring device passes through the connection manufacture of network 20
Execution system 12 and tester table 14,16,18 carry out machine, production up and down to control 14,16,18 pairs of tester table wafers to be measured
The operation such as product identification and crystal grain test, and test result is received from each tester table 14,16,18, and centralized displaying is monitoring
In the page, so that operator inspects and carries out follow-up management.
In detail, Fig. 2 is the side according to the remote monitoring device of wafer test board shown by one embodiment of the invention
Block figure.Referring to figure 2., this example demonstrates that in Fig. 1 monitoring device 10 composition and function.Wherein, monitoring device 10 includes logical
T unit 102, storage device 104, display 106, input unit 108 and processor 110, function is described below:
Communication device 102 is, for example, to support motor and Electronic Engineering Association (Institute of Electrical and
Electronics Engineers, IEEE) wireless communication standards such as 802.11n/b/g wireless network card or support second too net
The network interface card of the cable networks such as network (Ethernet) connection, can by other devices on wired or wireless way and network 20 into
Row network connectivity.
Storage device 104 be, for example, any kenel random access memory (random access memory, RAM),
Read-only memory (read-only memory, ROM), fast storage (flash memory), hard disk or similar component or on
State the combination of element.Storage unit 104 can be used to store the operation code of tester table.
Display 106 is, for example, to use liquid crystal display (Liquid Crystal Display, LCD), light emitting diode
(Light-Emitting Diode, LED), Field Emission Display (Field Emission Display, FED) or other types
Panel is as display panel, and uses light emitting diode (Light-Emitting Diode, LED) as the screen of backlight module
Curtain.Display 106 can receive externally input picture, to show picture on a display panel.
Input unit 108 be, for example, keyboard, mouse, Trackpad, trace ball etc. can provide user to monitoring device 10 into
The input tool of row operation.Input unit 108 is also possible to resistance-type, condenser type or other kinds of touching detecting element,
It can be integrated into touching screen with display 106, and the touching of user can be detected while showing the picture of monitoring device 10
Operation.
Processor 110 is, for example, central processing unit (the Central Processing with single core or multi-core
Unit, CPU) or other programmables general service or specific use microprocessor (Microprocessor), number
Signal processor (Digital Signal Processor, DSP), programmable controller, Application Specific Integrated Circuit
(Application Specific Integrated Circuits, ASIC), programmable logic device (Programmable
Logic Device, PLD) or other similar device or these devices combination.Processor 110 couples communication device 102, storage
Device 104, display 106 and input unit 108, the remote monitoring function of the wafer test board to execute the embodiment of the present invention
Energy.Illustrate that monitoring device 10 executes the detailed step of remote monitoring to wafer test board for embodiment below.
Fig. 3 is the flow chart according to the remote monitoring method of wafer test board shown by one embodiment of the invention.Please
Referring concurrently to Fig. 1, Fig. 2 and Fig. 3, the method for the present embodiment is suitable for the far-end monitoring system 1 of above-mentioned Fig. 1 and the monitoring dress of Fig. 2
10 are set, each item of the monitoring device 10 of far-end monitoring system 1 and Fig. 2, illustrates the remote of the present embodiment in the Fig. 1 that arranges in pairs or groups below
Hold the detailed step of monitoring method:
Firstly, utilizing 102 connected network 20 of communication device by processor 110, and line test machine is distinguished by network 20
Platform 14,16,18 moves into wafer (step S302) to control tester table 14,16,18.It will be done by taking tester table 14 as an example below
Illustrate, but not limited to this, monitoring method below is suitable for all tester tables with 10 line of monitoring device.It should be noted
It is before the control tester table 14 of processor 110 is operated, such as the time of tester table 14 first to be corrected, so that surveying
The time of commissioning stage 14 and the time consistency of monitoring device 10, with the subsequent tracking of benefit.Wherein, wafer is moved into tester table 14
Afterwards, crystal-boat box and probe card can be put on tester table 14 by operator, to be ready for testing.
Then, by the operation code stored in 110 accessing storage devices 104 of processor, and will be upper using communication device 102
Preparation (setup) the code carry in operation code is stated in tester table 14, to control the identification that tester table 14 reads wafer
Parameter, and the product parameters that read identification parameter and manufacturing execution system 12 obtain are compared into (step S304).Wherein, locate
Reason device 110 can for example obtain the product of upper machine at present using communication device 102 by 20 line manufacturing execution system 12 of network
Parameter, lot number, serial number, piece number including wafer to be measured etc., then these are joined into product parameters and the read wafer of tester table 14
Identification parameter be compared, to judge whether comparison result is consistent (step S306).Processor 110 can also manufacture execution simultaneously
System 12 obtains the process parameters such as processing procedure type, time, with the foundation tested as subsequent control tester table 14.
If comparison result is not inconsistent, processor 110 can control tester table 14 using communication device 102 terminates test (step
Rapid S308).Conversely, processor 110 can be continued with according to the process parameters such as processing procedure type, time if comparison result is consistent
Communication device 102 sequentially carry operation code in tester table 14, with control tester table 14 to multiple crystal grain on wafer into
Row test, and output test data (step S310).Wherein, processor 110 can for example tested for tester table 14
When the various situations that may occur, define multiple events, can so as to during tester table 14 tests wafer
Keep track and judges whether that event predetermined occurs.And if have judgement outgoing event, can according to the movement of predefined,
It controls tester table 14 and exports test data required when this event occurs.
Finally, processor 110 determines whether that all crystal grains on wafer complete test (step S312).If still there is crystalline substance
Grain is not tested, then returns to step S310, and continuation carry operation code is to be tested, when all crystal grains complete test,
Processor 110 can control tester table 14 using communication device 102 and remove wafer (step S314).Wherein, in test end
Afterwards, processor 110 can first notify operator to exit the crystal-boat box on tester table 14, then control tester table 14 and remove crystalline substance
Circle.
It should be noted that monitoring device 10 for example can also additionally be directed to tester table 14 before testing wafer
Pin measuring card checked, it is ensured that pin measuring card does not interfere with the test of wafer.
In detail, Fig. 4 is the stream according to the remote monitoring method of wafer test board shown by one embodiment of the invention
Cheng Tu.Referring to Fig. 1, Fig. 2 and Fig. 4, the far-end monitoring system 1 and Fig. 2 of the method for the present embodiment suitable for above-mentioned Fig. 1
Monitoring device 10 is each item of the monitoring device 10 of far-end monitoring system 1 and Fig. 2 in collocation Fig. 1, illustrates this implementation below
The detailed step of the remote monitoring method of example:
The present embodiment is connected at after the step S306 of Fig. 3, that is, confirms the identification parameter and manufacturing execution system of wafer
After the product parameters of acquirement are consistent, processor 110 can be first with the test code of communication device 102 carry, one pin measuring card in survey
Commissioning stage 14 carries out first time test (step S402) to control tester table 14 to the portion crystal on wafer.And when first
At the end of secondary test, processor 110 can control tester table 14 using communication device 102 and shut down (step S404), then hang again
An inspection code is carried in tester table 14, whether the result to check test for the first time is normal (step S406).Wherein, it tests
Board 14 can for example check whether the needle trace on wafer is normal.
If the result of test is abnormal for the first time, representing pin measuring card may be damaged, and processor 110 can utilize communication at this time
Device 102, which controls tester table 14, terminates test (step S408), to inspect tester table 14 by operator.Conversely, if
The result once tested is normal, that is, it is normal to represent pin measuring card, and processor 110 will continue to sequentially hang using communication device 102 at this time
It carries operation code to test in tester table 14 to control tester table 14 to multiple crystal grain on wafer, and exports test
Data (step S410).
Finally, processor 110 determines whether that all crystal grains on wafer complete test (step S412).If still there is crystalline substance
Grain is not tested, then returns to step S410, and continuation carry operation code is to be tested, when all crystal grains complete test,
Processor 110 can control tester table 14 using communication device 102 and remove wafer (step S414), and terminate test.
By above-mentioned method, production needed for monitoring device 10 can obtain test with 12 line of manufacturing execution system automatically
Product parameter can also replace manually carry by way of the carry operation code of distal end, and it is right to automatically control tester table 14
Crystal grain is tested.The test result that communication device 102 receives each tester table can also be used in monitoring device 10, to these
Data are managed concentratedly.
It should be noted that automatically controlling tester table progress wafer survey by monitoring device since the embodiment of the present invention is used
Examination, this mode can not only save the manpower and time that manually setting board is spent, and can obtain in wafer testing procedure
Tester table executes each practical the time it takes of step, and can be used for calculating the primary test of the every progress of tester table and spent
Time, while operation the time it takes that tester table executes each operation code can also be calculated.
In detail, monitoring device can calculate wafer and move in and out tester table elapsed time, and according to this test
This number for being tested wafer of board calculates the primary test the time it takes of the every progress of tester table.Another party
Face, monitoring device can also add up each operation code by the time of carry, execute each operation code pair to assess tester table
The test job the time it takes answered is used to provide operator as assessment testing cost.
On the other hand, other than the function of said distal ends control tester table, monitoring device can also pass through network connectivity
Each tester table test generated instant messages to obtain each tester table, and by acquired instant messages
It is shown in the monitoring page, so that operator inspects the As-Is of each tester table.
In addition, operator, which can also be provided, in monitoring device edits and controls behaviour to the tester table in the monitoring page
Make, to edit the tester table to be controlled, and to the control that specific tester table carries out.Wherein, monitoring device can be shown
With all tester tables of its line, and operator is received for the selection operation of shown tester table, determine accordingly
It will see the tester table of instant messages in the monitoring page.
On the other hand, monitoring device can for example receive what operator executed the tester table shown in the monitoring page
Control operation to operate corresponding tester table using this control by network connectivity, and carries out control operation to tester table.
It should be noted that monitoring device can operate corresponding tester table by the direct line control of network, to obtain survey
The picture of the man-machine interface of commissioning stage, and show on its display the man-machine interface of this tester table.In addition, monitoring device is also
Operator can further be received to operate the control of man-machine interface, tester table is controlled accordingly and execute this control operation correspondence
Function.
For example, Fig. 5 is the setting according to the tester table to be monitored of selection shown by one embodiment of the invention
The page.Fig. 6 is the monitoring page according to monitoring device shown by one embodiment of the invention.Please also refer to Fig. 5, monitoring device example
It can such as show that one has succeeded and the tester table inventory 50 of monitoring device line at present, and provide core before each tester table
To square so that operator chooses the tester table to be monitored.
After operator chooses and finishes and press storage button 52, monitoring device can show monitoring as shown in FIG. 6
The page 60, this monitoring page 60 is the monitoring data for listing tester table selected by operator, including multiple fields 62
Board state is inspected for operator and carries out subsequent operation accordingly.Wherein, operator may be selected in remote control field
Board diagram 64, with by monitoring device by the corresponding tester table of the direct line of network, to obtain the man-machine of tester table
The picture at interface, and the man-machine interface of this tester table is shown on the monitoring page 60.This man-machine boundary shown by monitoring device
Noodles allow operator to operate in this man-machine interface like the remote desktop of tester table, and directly control tester table
The corresponding function of executive control operation, no longer needs to go to and is operated in front of tester table.
In conclusion the remote monitoring method and system of wafer test board of the invention pass through monitoring device and test machine
Platform establishes line and obtains board present situation, by comparing and verifying confirmation product parameters, and is worked generation by distal end carry
The mode of code, control tester table are tested, and test result is then by monitoring device centralized displaying in the monitoring page.Whereby, it grasps
The state of tester table can be monitored at any time in any position of plant area and dispose immediately by making personnel, to promote testing efficiency.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (18)
1. a kind of remote monitoring method of wafer test board, suitable for monitoring multiple tester tables, the method by monitoring device
Include the following steps:
By each tester table of network connectivity, a wafer is moved into control the tester table；
Carry steady code is in the tester table, to control the identification parameter that the tester table reads the wafer, and
The product parameters that the read identification parameter is obtained with manufacturing execution system are compared；
If comparison result is consistent, sequentially a carry at least operation code is in the tester table, to control the tester table pair
Multiple crystal grain on the wafer are tested, and are outputed test data；And
When all crystal grains of the wafer complete test, controls the tester table and removes the wafer,
Wherein sequentially an at least operation code described in carry is in the tester table, to control the tester table to the wafer
On the crystal grain tested, and the step of outputing test data includes:
Carry one tests code in the tester table, to control the tester table to the part crystal grain on the wafer
Carry out first time test；
It at the end of first time test, controls the tester table and shuts down, and carry one checks code in the test machine
Whether platform, the result to check the first time test are normal；
If the result of first time test is normal, continue carry at least operation code described in other, to control the test
Board tests other described crystal grain on the wafer, and exports the test data, until owning for the wafer
Crystal grain is all completed to test；And
If the result of the first time test is abnormal, terminate the test of the wafer.
2. according to the method described in claim 1, wherein passing through each tester table of network connectivity, to control the test
Board moved into before the step of wafer, further includes:
The time of each tester table is corrected, so that the time one of the time of the tester table and the monitoring device
It causes.
3. according to the method described in claim 1, the method is also wrapped wherein when all crystal grains of the wafer complete test
It includes:
It calculates the wafer and moves in and out the tester table elapsed time, and tested according to the tester table
Number, calculate the primary test the time it takes of the every progress of the tester table.
4. according to the method described in claim 1, the method is also wrapped wherein when all crystal grains of the wafer complete test
It includes:
Add up each operation code by the time of carry, executes the corresponding survey of the operation code to assess the tester table
The time it takes is made in trial work.
5. according to the method described in claim 1, wherein sequentially a carry at least operation code is in the tester table, with control
The tester table tests the crystal grain on the wafer, and the step of outputing test data further include:
Judge whether the tester table occurs one of multiple events predetermined when testing；And
If meeting one of described event, the test data required when the event predetermined occurs is exported.
6. according to the method described in claim 1, further include:
By each tester table of network connectivity, carry out testing generated instant messages to obtain each tester table；
And
Display monitors the page in one by the instant messages that each tester table obtains.
7. according to the method described in claim 6, wherein showing the instant messages of each tester table in the prison
After the step of controlling the page, further includes:
It receives and the control of one of tester table described in the monitoring page is operated；And
The corresponding tester table is operated by control described in the network connectivity, to carry out the control to the tester table
System operation.
8. according to the method described in claim 7, wherein receive for tester table described in the monitoring page wherein it
After the step of one control operation, further includes:
The corresponding tester table is operated by control described in the network connectivity, to show the man-machine boundary of the tester table
Face；And
It receives the control for the man-machine interface to operate, controls the tester table accordingly and execute the control operation pair
The function of answering.
9. according to the method described in claim 6, wherein showing the instant messages of each tester table in the monitoring
The step of page further include:
All tester tables of display and the monitoring device line；And
It receives for the shown at least one of selection operation of the tester table, is determined accordingly in the monitoring page
The tester table of the middle display instant messages.
10. a kind of far-end monitoring system of wafer test board, comprising:
Manufacturing execution system stores product parameters；
Multiple tester tables；And
Monitoring device, comprising:
Communication device passes through each tester table of network connectivity and the manufacturing execution system；
Storage device stores multiple operation codes；And
Processor couples the communication device and the storage device, wherein
The processor is including the use of the steady code in operation code described in the communication device carry in each test
Board, to control the identification parameter that the tester table reads the wafer, and by the read identification parameter with from institute
The product parameters for stating manufacturing execution system acquirement compare；
When the processor is included in comparison result and is consistent, the communication device sequentially operation code of carry at least one is utilized
It in the tester table, is tested with controlling the tester table to multiple crystal grain on the wafer, and exports test number
According to；And
The processor includes controlling the test using the communication device when all crystal grains of the wafer complete test
Board removes the wafer,
Wherein the processor also carry one tests code in the tester table, with each described using the communication device line
Tester table carries out first time test to control the tester table to the part crystal grain on the wafer, and described
It at the end of testing for the first time, controls the tester table and shuts down, carry one detects code in the tester table, described in detection
Whether the result of test is normal for the first time, wherein continuing other described work of carry if the result of first time test is normal
Code is tested with controlling the tester table to other described crystal grain on the wafer, and exports the test data,
Until all crystal grains of the wafer are all completed to test, and if the result of first time test is abnormal, terminate the wafer
Test.
11. system according to claim 10, wherein the processor also utilizes each survey of the communication device line
Commissioning stage, to correct the time of each tester table, so that the time of the tester table and the monitoring device
Time consistency.
12. system according to claim 10, wherein the processor, which also calculates the wafer, moves in and out the survey
Commissioning stage elapsed time, and the number tested according to the tester table calculate the every progress one of the tester table
Secondary test the time it takes.
13. system according to claim 10, wherein the processor also add up each operation code by carry when
Between, the corresponding test job the time it takes of the operation code is executed to assess the tester table.
14. system according to claim 10, wherein the processor also judges the tester table when testing
One of multiple events predetermined whether occur, and if one of meet the event, control the tester table
Export the test data required when the event predetermined occurs.
15. system according to claim 10, wherein the processor also passes through network connectivity using the communication device
Each tester table is carried out testing generated instant messages, and is filled in the monitoring to obtain each tester table
Display includes the monitoring page of the instant messages of each tester table on the display set.
16. system according to claim 15, wherein the processor is also received using input unit for being shown in
The control operation of one of tester table described in the monitoring page of display is stated, to pass through using the communication device
Control described in the network connectivity operates the corresponding tester table, is operated with carrying out the control to the tester table.
17. system according to claim 16, wherein the processor also passes through the network using the communication device
Control described in line operates the corresponding tester table, to show the man-machine interface of the tester table, and described in utilization
Input unit receives the control for the man-machine interface and operates, and controls the tester table accordingly and executes the control behaviour
Make corresponding function.
18. system according to claim 15, wherein the processor also show it is all with the monitoring device line
Tester table is received for the tester table shown by the display at least in the display, and using input unit
The selection operation of one of them, determines to show the instant messages in the monitoring page that the display is shown accordingly
The tester table.
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| TW105117326A TWI621191B (en) | 2016-06-02 | 2016-06-02 | Method and system for remotely monitoring wafer testing equipment |
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| CN108227250B (en) * | 2017-12-25 | 2021-03-16 | 武汉华显光电技术有限公司 | LCD quality inspection method, device, CIM system and computer storage medium |
| CN108172154B (en) * | 2018-01-03 | 2021-03-19 | 惠科股份有限公司 | Test method and test equipment |
| TWI693564B (en) * | 2018-01-05 | 2020-05-11 | 竹陞科技股份有限公司 | Automatic equipment management system and method thereof |
| CN110675084A (en) * | 2019-10-08 | 2020-01-10 | 东莞长城开发科技有限公司 | LED wafer test management system based on MES system |
| CN112435937B (en) * | 2020-11-27 | 2022-06-07 | 华虹半导体(无锡)有限公司 | Automatic control system and method for wafer test |
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| TWI621191B (en) | 2018-04-11 |
| CN107462821A (en) | 2017-12-12 |
| TW201743388A (en) | 2017-12-16 |
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