CN106898563A - Product Acceptance Review system and Product Acceptance Review method - Google Patents
Product Acceptance Review system and Product Acceptance Review method Download PDFInfo
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- CN106898563A CN106898563A CN201510960988.0A CN201510960988A CN106898563A CN 106898563 A CN106898563 A CN 106898563A CN 201510960988 A CN201510960988 A CN 201510960988A CN 106898563 A CN106898563 A CN 106898563A
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- acceptance review
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Abstract
Present invention is disclosed a kind of Product Acceptance Review system and Product Acceptance Review method.The Product Acceptance Review system that the present invention is provided, including detection module and judge module, the judge module determine detaining and letting pass for product according to the testing result of the detection module；Wherein, the detection module includes multiple submodule；In the case of the testing result of previous submodule running completion and the previous submodule is normal, next submodule is operated to be detected with to product；In the case of the testing result of any sub- module is abnormal, the judge module determines that product is detained, and in the case of the testing result of each submodule is normal, the judge module determines that product is let pass.Compared with prior art, carry out Product Acceptance Review using Product Acceptance Review system of the invention, it is to avoid wasting time and energy for manual detection, shorten detection time, improve detection quality.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of Product Acceptance Review system and Product Acceptance Review side
Method.
Background technology
, it is necessary to carry out probe (CP) test to wafer after wafer (wafer) manufacture is completed.In CP
In test process, each step can detain (hold) and live the inspection that wafer waits technical staff.Technical staff
Wafer can be checked or while check more wafers according to the result of test, and decide whether to put
Row (release) arrives next step.
As shown in figure 1, the detection method to wafer in CP test process includes at present：
Step S1, obtains the wafer that MES (manufacturing execution system) is detained；
Step S2, checks test pattern；
Step S3, checks yield；
Step S4, relatively more known figure；
Step S5, lets pass.
Specifically, technical staff obtains the wafer that a pile is arrested, the test chart (CP map) first according to probe
Test；It is afterwards to check yield and performance (bin yield)；Then, technical staff by virtue of experience enters
The inspection of row pattern (pattern), this includes whether the pattern occurred before comparing is problematic,
And go through single-wafer, and need it is manual more wafers are overlapped after test.By anti-
Multiple inspection, finally decides whether the wafer that can let pass.
As can be seen here, current technical staff is that by virtue of experience range estimation goes to judge, error is likely to be occurred.
And technical staff will spend a big chunk time to check and judge, increase workload, also cause crystalline substance
Circle is long by the time of hold.
In the conventional method, if wafer is detained in a step for a long time, operating efficiency is often reduced,
Influence shipment speed；Or because technical staff's experience lacks, cause what this detained not detain, can influence
The quality of shipment；Or the wafer of the clearance is arrested always, shipment speed is also influenceed.
Therefore, a kind of system that can be checked and accepted automatically is needed badly at present to avoid the generation of above-mentioned variety of problems.
The content of the invention
It is an object of the invention to provide a kind of Product Acceptance Review system and Product Acceptance Review method, to improve existing skill
The problem of manual detection thus inefficiency is needed in art.
In order to solve the above technical problems, the present invention provides a kind of Product Acceptance Review system, including detection module and sentence
Disconnected module, the judge module determines detaining and letting pass for product according to the testing result of the detection module；
Wherein, the detection module includes multiple submodule；Operated in previous submodule and completed and before this
In the case of the testing result of one submodule is normal, next submodule is operated to be examined with to product
Survey；In the case of the testing result of any sub- module is abnormal, the judge module determines that product is detained,
In the case of the testing result of each submodule is normal, the judge module determines that product is let pass.
Optionally, for described Product Acceptance Review system, the multiple submodule includes：Yield and performance are examined
Survey module, superposition detection module, monolithic detection module and add-on module, the yield and performance detection module
Whether the yield and performance of analysis product are normal, and the superposition detection module is by with the product on a collection of wafer
Detected after test result superposition, test result of the monolithic detection module to the product in single-wafer
Detected, the add-on module is detected according to the additional requirement of setting.
Optionally, for described Product Acceptance Review system, the quantity of the additional requirement is more than or equal to 2.
Optionally, for described Product Acceptance Review system, the submodule also includes a filtering module, by crystalline substance
Setting regions filtering in circle.
Optionally, for described Product Acceptance Review system, the filtering module, the order of running is inferior to described
Yield and performance detection module, prior to the superposition detection module.
Accordingly, the present invention provides a kind of Product Acceptance Review method, is entered using Product Acceptance Review system as described above
The examination of row product.
Optionally, for described Product Acceptance Review method, including：
Step one：First submodule judges the yield and performance of product, if there are abnormal conditions, judges mould
Block detains product；Conversely, performing step 2；
Step 2：Second submodule filtering settings region, and then perform step 3；
Step 3：3rd submodule will with the test result of the product on a collection of wafer be superimposed after detected,
If there are abnormal conditions, judge module detains product；Conversely, performing step 4；
Step 4：4th submodule is detected to the test result of the product in single-wafer, if existing different
Reason condition, then judge module product is detained；Conversely, performing step 5；
Step 5：5th submodule is detected according to additional requirement, if there are abnormal conditions, judges mould
Block detains product；Conversely, judge module lets pass product.
Optionally, for described Product Acceptance Review method, the step 3 includes：
Step 3 one：Detect whether there is block or stack defect, if in the presence of, judge module by product
Detain；Conversely, performing step 3 two；
Step 3 two：Detect whether there is periodicity defect, if in the presence of judge module detains product；
Conversely, performing step 3 three；
Step 3 three：Detect whether there are continuity defects, if in the presence of judge module detains product；
Conversely, performing step 4.
Optionally, for described Product Acceptance Review method, the step 4 includes：
Step 4 one：Domain of the existence defect is detected whether, if in the presence of judge module detains product；
Conversely, performing step 4 two；
Step 4 two：Detect whether there are continuity defects, if in the presence of judge module detains product；
Conversely, performing step 4 three；
Step 4 three：Detect whether there is block or stack defect, if in the presence of, judge module by product
Detain；Conversely, performing step 4 four；
Step 4 four：Detect whether there is repeated defect, if in the presence of judge module detains product；
Conversely, performing step 5.
Optionally, for described Product Acceptance Review method, if product is detained, by the whole of where the product batches
Wafer is detained, and product of the additional detection before and after on each a collection of wafer.
The Product Acceptance Review system that the present invention is provided, including detection module and judge module, the judge module according to
Detaining and letting pass for product is determined according to the testing result of the detection module；Wherein, the detection module includes
Multiple submodule；The testing result for operating completion and the previous submodule in previous submodule is normal
In the case of, next submodule is operated to be detected with to product；In any detection knot of sub- module
In the case of really abnormal, the judge module determines that product is detained, in the testing result of each submodule
In the case of all normal, the judge module determines that product is let pass.Compared with prior art, using the product
Product Acceptance Review method that product Acceptance Test System is carried out, it is to avoid wasting time and energy for manual detection, substantially reduces inspection
The survey time, improve detection quality.
Brief description of the drawings
Fig. 1 is a kind of flow chart of Product Acceptance Review method in the prior art；
Fig. 2 is the structural representation of the Product Acceptance Review system in the embodiment of the present invention；
Fig. 3 is the flow chart of the Product Acceptance Review method in the embodiment of the present invention.
Specific embodiment
Product Acceptance Review system of the invention and Product Acceptance Review method are carried out in more detail below in conjunction with schematic diagram
Description, which show the preferred embodiments of the present invention, it should be appreciated that those skilled in the art can change
The present invention of this description, and still realize advantageous effects of the invention.Therefore, description below should be appreciated that
It is widely known for those skilled in the art, and is not intended as limitation of the present invention.
The present invention is more specifically described by way of example referring to the drawings in the following passage.According to it is following explanation and
Claims, advantages and features of the invention will become apparent from.It should be noted that, accompanying drawing is using very simple
The form of change and use non-accurately ratio, be only used to conveniently, lucidly aid in illustrating the embodiment of the present invention
Purpose.
Core concept of the invention is to provide a kind of Product Acceptance Review system, including detection module and judge module,
The judge module determines detaining and letting pass for product according to the testing result of the detection module；Wherein, institute
Stating detection module includes multiple submodule；Operated in previous submodule and completed and the previous submodule
In the case of testing result is normal, next submodule is operated to be detected with to product；At any one
In the case of the testing result of submodule is abnormal, the judge module determines that product is detained, in each height
In the case of the testing result of module is all normal, the judge module determines that product is let pass.
Below, Fig. 2-Fig. 3 is refer to, Product Acceptance Review system of the invention and Product Acceptance Review method is carried out in detail
Explanation.Wherein Fig. 2 is the structural representation of the Product Acceptance Review system in the embodiment of the present invention, and Fig. 3 is this hair
The flow chart of the Product Acceptance Review method in bright embodiment.
As shown in Fig. 2 the Product Acceptance Review system that the present invention is provided, including：Detection module 10 and judge module
20, the judge module 20 determines detaining and letting pass for product according to the testing result of detection module 10.
In the present invention, the detection module 10 includes multiple submodule；Each submodule is in progressive relationship,
Specifically, operating completion and the normal situation of testing result of the previous submodule in previous submodule
Under, next submodule is operated to be detected with to product；In any testing result of sub- module not
In the case of normal, the judge module 20 determines that product is detained, in the testing result of each submodule
In the case of normal, the judge module 20 determines that product is let pass.
Specifically, as shown in Fig. 2 the submodule includes：Yield and performance detection module 101, superposition inspection
Survey module 103, monolithic detection module 104 and add-on module 105.
Whether the yield and performance (bin yield) of the yield and the analysis product of performance detection module 101 are normal,
Can all there is SPC (statistical Process Control) chart of bin and yield, the yield and property in MES system
Energy detection module 101 can obtain data from MES system, judge whether yield and performance are normal, generally
Directly can be performed according to the result of MES.
The superposition detection module 103 will be laggard with the superposition of the test result of the product on a collection of (lot) wafer
Row detection, the superposition detection module 103 has Three models, including：Block or stack defects detection
Pattern (Cluster fail pattern), for detecting that the point heap of defect, some failures occurs in such as wafer peripheral
Product defect together；Periodicity defect detection pattern (Periodic fail pattern), for detecting for example
Occurs the defect of the point of failure repeatedly in a direction (the typically conventional X/Y directions of industry)；And even
Continuous property defects detection pattern (Continuous fail pattern), the point continuity for detecting several failures
Appearance defect.These three patterns equally use progressive relationship, so as to realize according to the serious of generation problem
Degree priority check, reaches the purpose for economizing on resources.
The monolithic detection module 104 detects to the test result of the product in single-wafer, specifically,
The system also has different patterns to the product in single-wafer, including：Regional defect mode (Zone
Pattern), all fail such defect for detecting the point in larger area；Continuity defects pattern
(Continuous fail pattern), the defect of the successional appearance of point for detecting several failures；Block
Shape or stack defect mode (Cluster single＆multi bin pattern), for detecting such as wafer week
While there is defect, the defect that is packed together of points of some failures；And repeated defect (Reticle/DUT
Pattern), for detecting the defect that the point in different region identical failures occurs, this defect for example may be used
Can be that light shield reason is caused.Likewise, based on the purpose for economizing on resources, these four patterns use progressive relationship.
The add-on module 105 is detected that this can be by technical staff's foundation according to the additional requirement of setting
Oneself definition, such as specify specific region the need for difference, if this range test is unqualified, just thinks whole
Wafer is all unqualified.Based on above-mentioned progressive relationship, the underproof possibility very little of product is can be concluded that substantially,
Therefore, it can cause the quantity of the additional requirement more than or equal to 2, certainly, according to actual requirement, adding will
It 1 is also acceptable that the quantity asked is.
Additionally, it is considered that can there are some specific regions on wafer in inventor, although detection failure
Point is a lot, but due to some cause specifics, technical staff is these regions not to be checked, then this
System also avoids the need for testing these regions, so as to realize efficient detection.Then, the submodule
Also include filtering module 102, by the setting regions filtering in wafer.In order to play the purpose of efficient detection, will
The order of the running of the filtering module 102 is set to inferior to yield and performance detection module 101, prior to superposition
Detection module 103.
Below, Fig. 3 is refer to, Product Acceptance Review method of the invention is described in detail.This method is using this
The Product Acceptance Review system of invention carries out the examination of product.
Specific the method includes：
Step one, the first submodule judge the yield and performance of product, if there are abnormal conditions, judge mould
Block 20 detains product, here, first submodule can be yield and performance detection module 101, such as
It is upper described, this step can the direct called data from MES system, the data in even MES are
Abnormal (i.e. existing defects, labeled as Y, similarly hereinafter) are represented, then the first submodule transmits signal to judging mould
Block 20 detains product.Otherwise (i.e. in the absence of defect, labeled as N, similarly hereinafter), perform next step.
Step 2, the second submodule filtering settings region, here, the second submodule can be filtering module 102,
Because the second submodule is only to play a part of filtering, therefore the step of after necessarily can then performing.
Step 3, the 3rd submodule will with the test result of the product on a collection of wafer be superimposed after detected,
If there are abnormal conditions, the 3rd submodule transmission signal to judge module 20 detains product, here, institute
It can be superposition detection module 103 to state the 3rd submodule.Conversely, performing next step.
Specifically, in this step, detected using progressive the carrying out of the Three models for being superimposed detection module 103,
First detect whether there is block or stack defect, if in the presence of (Y), judge module 20 is by product
Detain；Otherwise (N), next detects whether there is periodicity defect, if in the presence of (Y), judge module
20 detain product；(otherwise N), then detect whether there are continuity defects, if in the presence of (Y), sentencing
Disconnected module 20 detains product；Otherwise (N), performs step 4.
Step 4, the 4th submodule are detected to the test result of the product in single-wafer, if existing different
Reason condition, then transmit signal to judge module 20 and detain product, here, the 4th submodule can be
Monolithic detection module 104.Conversely, performing next step.
Specifically, in this step, detected using four kinds of progressive carrying out of pattern of monolithic detection module 104,
Domain of the existence defect is first detected whether, if in the presence of (Y), judge module 20 detains product；
Otherwise (N), next detects whether there are continuity defects, if in the presence of (Y), judge module 20 will
Product is detained；(otherwise N), then detect whether there is block or stack defect, if in the presence of (Y),
Judge module 20 detains product；Otherwise (N), finally detects whether there is repeated defect, if in the presence of
(Y), then judge module 20 detains product；Otherwise (N), performs step 5.
Step 5, the 5th submodule are detected according to additional requirement, if there are abnormal conditions (Y), sentenced
Disconnected module 20 detains product, here, the 5th submodule can be add-on module 105, and preferably,
The quantity for meeting additional requirement is more than or equal to 2.Otherwise (N), judge module 20 lets pass product.
Additionally, in order to avoid omitting, delivery quality is improved as far as possible, if there is product button when checking and accepting
Stay, be first to detain whole wafers of where the product batches, then feelings of the labor per wafer again
Condition.Also, product of the detection before and after on each a collection of wafer can also be added, is reaffirmed.
It is visible by foregoing description, Product Acceptance Review system of the invention and Product Acceptance Review method, convenient reliability.
The present invention establishes an easily Product Acceptance Review method, has led new Product Acceptance Review direction.Using this hair
When bright system and method carries out an acceptance inspection, time of inspection from the prior art about 12 hours it is even more many
Shorten to 10 minutes or so, substantially reduce the time.Additionally, avoiding the error of manual work, and liberate
The working time of technical staff, there can be the more time to process other work, be conducive to improving production effect
Rate.
Obviously, those skilled in the art can carry out various changes and modification without deviating from this hair to the present invention
Bright spirit and scope.So, if it is of the invention these modification and modification belong to the claims in the present invention and
Within the scope of its equivalent technologies, then the present invention is also intended to comprising these changes and modification.
Claims (10)
1. a kind of Product Acceptance Review system, including detection module and judge module, the judge module is according to described
The testing result of detection module determines detaining and letting pass for product；
Wherein, the detection module includes multiple submodule；Operated in previous submodule and completed and before this
In the case of the testing result of one submodule is normal, next submodule is operated to be examined with to product
Survey；In the case of the testing result of any sub- module is abnormal, the judge module determines that product is detained,
In the case of the testing result of each submodule is normal, the judge module determines that product is let pass.
2. Product Acceptance Review system as claimed in claim 1, it is characterised in that the multiple submodule includes：
Yield and performance detection module, superposition detection module, monolithic detection module and add-on module, the yield and
Whether the yield and performance of performance detection module analysis product are normal, and the superposition detection module will be with a collection of crystalline substance
Detected after the test result superposition of the product on circle, the monolithic detection module is to the product in single-wafer
The test result of product is detected that the add-on module is detected according to the additional requirement of setting.
3. Product Acceptance Review system as claimed in claim 2, it is characterised in that the quantity of the additional requirement
More than or equal to 2.
4. Product Acceptance Review system as claimed in claim 2, it is characterised in that the submodule also includes
Filtering module, by the setting regions filtering in wafer.
5. Product Acceptance Review system as claimed in claim 4, it is characterised in that the filtering module, running
Order be inferior to the yield and performance detection module, prior to the superposition detection module.
6. a kind of Product Acceptance Review method, using the Product Acceptance Review system as described in any one in claim 1-5
System carries out the examination of product.
7. Product Acceptance Review method as claimed in claim 6, it is characterised in that including：
Step one：First submodule judges the yield and performance of product, if there are abnormal conditions, judges mould
Block detains product；Conversely, performing step 2；
Step 2：Second submodule filtering settings region, and then perform step 3；
Step 3：3rd submodule will with the test result of the product on a collection of wafer be superimposed after detected,
If there are abnormal conditions, judge module detains product；Conversely, performing step 4；
Step 4：4th submodule is detected to the test result of the product in single-wafer, if existing different
Reason condition, then judge module product is detained；Conversely, performing step 5；
Step 5：5th submodule is detected according to additional requirement, if there are abnormal conditions, judges mould
Block detains product；Conversely, judge module lets pass product.
8. Product Acceptance Review method as claimed in claim 7, it is characterised in that the step 3 includes：
Step 3 one：Detect whether there is block or stack defect, if in the presence of, judge module by product
Detain；Conversely, performing step 3 two；
Step 3 two：Detect whether there is periodicity defect, if in the presence of judge module detains product；
Conversely, performing step 3 three；
Step 3 three：Detect whether there are continuity defects, if in the presence of judge module detains product；
Conversely, performing step 4.
9. Product Acceptance Review method as claimed in claim 7 or 8, it is characterised in that the step 4 includes：
Step 4 one：Domain of the existence defect is detected whether, if in the presence of judge module detains product；
Conversely, performing step 4 two；
Step 4 two：Detect whether there are continuity defects, if in the presence of judge module detains product；
Conversely, performing step 4 three；
Step 4 three：Detect whether there is block or stack defect, if in the presence of, judge module by product
Detain；Conversely, performing step 4 four；
Step 4 four：Detect whether there is repeated defect, if in the presence of judge module detains product；
Conversely, performing step 5.
10. Product Acceptance Review method as claimed in claim 9, it is characterised in that if product is detained, by this
The whole wafers criticized where product are detained, and product of the additional detection before and after on each a collection of wafer.
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| CN106898563B (en) | 2019-12-27 |
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