CN103969267B - Cleaning control method of particulate matters on probes of probe card - Google Patents
Cleaning control method of particulate matters on probes of probe card Download PDFInfo
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- CN103969267B CN103969267B CN201410215781.6A CN201410215781A CN103969267B CN 103969267 B CN103969267 B CN 103969267B CN 201410215781 A CN201410215781 A CN 201410215781A CN 103969267 B CN103969267 B CN 103969267B
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Abstract
The invention discloses a cleaning control method of particulate matters on probes of a probe card. The method comprises the steps of after the electrical performance test of each piece of wafer is carried out and the probes are cleaned each time, respectively carrying out particulate matter contamination check on the probes by comparing the optical images of the points of the adjacent probes one by one, judging whether the probes need to be cleaned or cleaned again according to the results of the check, and carrying out corresponding treatment; limiting the allowed number of cleaning again, and adopting the measures of alarming and stopping a machine in time to control the effect of repeatedly cleaning; therefore, the particulate matters contaminating the probes can be cleaned in time, the phenomenon of blindly cleaning the probes is avoided, and the serious consequences that the test results have errors and even a device is burnt out caused by the fact that the probes which are contaminated by the particulate matters are continuously applied to the electrical performance test of the wafer due to the lack of probe cleaning effect detection can be avoided; the method can be used for effectively controlling the cleaning period and the cleaning effect of the probes of a probe card machine.
Description
Technical field
The present invention relates to a kind of cleaning skill of the probe card being used for wafer acceptance testing in semiconductor microelectronic field tests
Art, carries out control method during particulate matter cleaning more particularly, to a kind of probe to probe card.
Background technology
After semiconductor crystal wafer completes, be packaged before, in order to ensure the yield of wafer and avoid the waste encapsulating,
Need in manufacture of semiconductor to carry out wafer acceptance testing (wafer acceptance test, wat).Wat probe card board is extensive
For the testing electrical property that wafer is carried out, it is the test interface connecting between wat measuring instrument and wafer.Its operation principle be by
Connect the detection welding pad (pad) on the probe of probe card and chip to be measured of measuring instrument or salient pole directly contact, constitute
Measuring loop, by probe to chip feed-in test signal to be measured and feedback chip signal, then conjunction measuring instrument and software control
System filters out electrically bad chip, realizes Aulomatizeted Detect.Probe card includes the multiple spies for contacting with test pad
Pin.
When being tested, need because end of probe is most advanced and sophisticated to contact and swipe (acupuncture treatment) with test pad surface, can take up
The oxide on test pad surface or nitride etc. scrape bits, and lead to swipe in end of probe contamination particulate matter, and this can disturb probe
Electrical connection and test pad between, causes the deviation of testing result.Accordingly, it would be desirable to adopt to using the probe after certain number of times
It is cleaned (clear pin) with the mode (acupuncture treatment) of Sandpapering.
Existing probe card cleaning method, be to wafer after the test of fixing pricking times, or in test
After the wafer of stator number, probe and sand paper are carried out the next clear pin that rubs.But, cannot be confirmed clearly using this cleaning mode
The effect of pin, and for the test midway in a cleaning cycle (usually a test being made up of more wafers is criticized)
Particulate matter in contamination also cannot be removed in time.
With the Highgrade integration of semiconductor chip, also in increase, unit area also accordingly contracts the quantity of test pad
Little, the arrangement between test pad also becomes more crypto set.In this condition, if the needle point contamination of probe has particulate matter, non-
But the detection accuracy of contact resistance when influencing whether to test, between being additionally, since between test pad and the plain conductor of chip
Away from minimum (about 2 μm), the probe being infected with particulate matter will result in short circuit between test pad and plain conductor, leads to device to burn
Etc. serious consequence.When carrying out chip testing, fail to be marked with the mark of defective products by the chip of test, and at it
After carry out being screened out during chip cutting coming, only normally functioning chip just can carry out the encapsulation procedure of next stage.Chip
Test just becoming and reduce the cost and improve the indispensable process of yield.Therefore, gradually step up in current encapsulation unit cost
Under trend, the accuracy rate of wat and efficiency have become one of wafer manufacturing cost control material impact link, and probe is cleaned
Effective control demand also become more and more urgent.
Content of the invention
It is an object of the invention to overcome prior art exist drawbacks described above, provide a kind of new probe card probe
Grain thing cleaning control method, by being adjacent the optics shadow at the needle point position of probe by each described probe of described probe card
Whether there is difference between picture, as judging the condition with the presence or absence of particulate contamination for the described probe, electrical in every wafer
After being completed and after each cleaning of described probe, carry out the particulate contamination that adjacent described probe is compared one by one respectively
Check, make described probe accordingly the need of being cleaned or the judgement cleaned again and carry out alignment processing, and again
Increased during cleaning pricking times and acupuncture treatment pin pressure, realize to described probe the need of cleaning and cleaning effect effective control
System.
For achieving the above object, technical scheme is as follows:
A kind of particulate matter cleaning control method of probe card probe is it is characterised in that comprise the following steps:
Step one: set the proof cycle of the particulate contamination of described probe of described probe card, and according to proof cycle,
The testing electrical property of wafer is carried out to the wafer of regulation piece number；
Step 2: after the testing electrical property that described proof cycle specifies piece number wafer finishes, whole to described probe card
Described probe carries out the contaminating examination of particulate matter one by one, by each described probe of described probe card is adjacent probe
Compare between the optical image at needle point position, the optical image at the adjacent described probe tip position mutually being compared according to definition
Area between with the presence or absence of difference condition, come overall judge that described probe whether there is particulate contamination, and set and compare
To adjacent described probe tip position optical image area between variance rate tolerance, to avoid adjacent described probe
Comparison result when needle point site area size has slightly different is mistaken for there is particulate contamination；Wherein, when every group of phase compares
The optical image at adjacent described probe tip position between when not having differences, judge described probe global non-existence particle
Thing is infected with, as long as have differences between the optical image at the adjacent described probe tip position that one of which phase compares, that is,
Judge that described probe integrally has particulate contamination；Wherein, the optical image at described probe tip position refers to from vertically
Optical image captured by described probe tip direction；
Step 3: when judging described probe global non-existence particulate contamination, execution described probe continued on for into
The testing electrical property of row wafer；When judging that described probe integrally has particulate contamination, that is, execute and whole described probes is entered
Row sand paper acupuncture treatment cleaning；
Step 4: the described probe that cleaning is finished, carry out the contaminating examination of described particulate matter again according to step 2, and
According to the judged result that described probe integrally be whether there is with particulate contamination, according to step 3 execution, described probe is continued to use
In the testing electrical property carrying out wafer or the process cleaned again；
Step 5: to the described probe after being cleaned again, in the numbers range allowing to clean again, repeat according to
Step 4 executes the contaminating examination to described probe and the process cleaned again, until described probe is judged global non-existence
Particulate contamination, can proceed with the testing electrical property of wafer, or still judges institute after arrival allows the number of times limit value cleaning again
When stating probe and integrally there is particulate contamination, reported to the police and shut down process；
Wherein, described probe is cleaned and again clean when, by set described cleaning when pricking times and
Acupuncture treatment pin pressure, the effect of cleaning is controlled, and, when cleaning again described in described probe is carried out, is increased by setting
Plus pricking times during described cleaning and acupuncture treatment pin pressure, the effect cleaning again is controlled.
Further, in step one, the proof cycle of the particulate contamination of described probe is set as the electricity in every wafer
Property carries out the inspection of the particulate contamination of described probe after being completed.
Further, described probe is carried out multiple described in when cleaning again, by setting according to certain ratio or
Fixed numbers increase the pricking times and acupuncture treatment pin pressure when cleaning every time, the effect repeatedly cleaning again is controlled.
Further, described probe is carried out multiple described in when cleaning again, by setting according to certain ratio or
Fixed numbers increase the pricking times and acupuncture treatment pin pressure when cleaning every time, the effect repeatedly cleaning again is controlled,
Pricking times during described cleaning and acupuncture treatment pin pressure are respectively provided with higher limit, and the described number of times allowing to clean again, according to institute
State pricking times and acupuncture treatment pin pressure increase ratio or increase numerical value and its each the corresponding relation between higher limit draw.
Further, the pricking times in described cleaning and acupuncture treatment pin are pressed onto after reaching higher limit, still judge described spy
When pin integrally has particulate contamination, reported to the police and shut down process.
In technique scheme, after every wafer is completed, just according to the requirement of the proof cycle setting, enter
The inspection of the particulate contamination of row probe.Existing cleaning mode is typically criticized in the wafer sort setting and has all been tested
Bi Hou, just carries out clear pin, not only clear pin effect cannot know, and the particulate matter for the contamination of test midway cannot be clear in time
Remove.If the needle point of probe is infected with particulate matter, not only influence whether the detection accuracy of contact resistance during test, and, by
Spacing minimum (about 2 μm) between test pad and the plain conductor of chip, the probe of contamination particulate matter will result in test
Short circuit between pad and plain conductor, even results in device and the serious consequence such as burns.Using technical scheme, at one
The test midway that wafer sort is criticized is so that it may by the inspection to particulate contamination, find that probe is stained with the presence or absence of particulate matter in time
Dye, and clear pin in time, are by higher inspection frequency, to ensure that probe is in frequent cleaning use state, thus effectively
Avoid the problem that the probe of contamination particulate matter cannot be found in time.
When implementing, the video imaging unit first passing through probe card board is carried out technical scheme to probe tip
Vertically take pictures, the area that then probe card board can be formed to the optical image of adjacent probe needle point is compared, by meter
Calculate and distinguish between the optical image of the probe tip mutually comparing, whether size shape is consistent, and one by one each probe is examined
Look into.Essentially identical between the optical image of normal probe tip, and occur between the optical image of the probe tip of particulate matter
Will appear from obvious difference, thus finding out the probe of contamination particulate matter.Thus avoid the clear pin phenomenon of blindness and due to a lack of clear pin
Effect detection causes the probe being infected with particulate matter to continue on for testing electrical property, lead to test result deviation or even that device burns is tight
Weight consequence.
There is particulate contamination, need to set in order to avoid having slightly different situation to be mistaken for surface probe tip size by mistake
Tolerance Parameters when comparing, the optics that is, two probes allow between the area of optical image of one adjacent probe needle point of meter
The allowed band of the variance rate of image.This tolerance can exist according to the size difference amount between the tolerance of probe processing, probe, probe
Size changing rate in service life, in conjunction with correlation experience data such as the probe size rates of change occurring during smallest particles thing,
Set in wat probe card board, and tolerance adjustment can be carried out according to the change of actual conditions it is ensured that checking and cleaning
The control accuracy of journey.
In order to avoid probe is when cleaning again, the problem that particulate matter still can not be eliminated, by according to certain ratio
Or the method that fixed numbers increase pricking times when cleaning every time and pin pressure of having an acupuncture treatment, set in wat probe card board
Fixed, to increase clear needle force degree until the particulate matter of contamination drops, the effect repeatedly cleaning again is controlled.And, root
According to the higher limit of pricking times and acupuncture treatment pin pressure, the increase ratio in conjunction with pricking times and acupuncture treatment pin pressure or increase numerical value,
Obtain the number of times upper limit allowing to clean again, it is to avoid the undying repeatedly clear pin action of board execution；Meanwhile, if reached
Allow the number of times upper limit cleaning again, reach pricking times and acupuncture treatment pin pressure higher limit after, still cannot remove probe
During grain thing, it is provided with and reports to the police and shut down treatment measures, be further processed by manpower intervention, thus ensure that clear pin efficiency.
From technique scheme as can be seen that the present invention is by being adjacent spy by each described probe of described probe card
Between the optical image at needle point position of pin whether there is difference, as judge described probe with the presence or absence of particulate contamination bar
Part, after the testing electrical property of every wafer finishes and after each cleaning of described probe, is carried out respectively to adjacent described probe
The particulate contamination inspection comparing one by one, makes described probe accordingly the need of being cleaned or the judgement cleaned again and entering
Row alignment processing；And when repeatedly being cleaned, according to the higher limit scope of pricking times and acupuncture treatment pin pressure, pressed by setting
Increase pricking times and acupuncture treatment pin pressure when cleaning every time according to certain ratio or fixed numbers, define and allow to clean again
Number of times, warning can be taken in time and shut down treatment measures, the effect of multiple cleaning is controlled.Such that it is able in a crystalline substance
After every wafer of circle test batch test midway is completed, carries out the contaminating examination of probe particles thing, clean probe in time
The particulate matter of contamination；If finding, probe tip has been infected with particulate matter, suspends test and carries out clear pin, and compares after clear pin finishes
Whether probe is cleaned to complete, and completes without cleaning, then increase clear needle force degree until the particulate matter of contamination is cleaned
Drop.Therefore, the present invention has a probe cleaning cycle to described probe card board and that cleaning effect control effectively is aobvious
Work feature, it is to avoid blindly clear pin phenomenon and cause the probe being infected with particulate matter to continue on for wafer due to a lack of clear pin effect detection
Testing electrical property, lead to the serious consequence that test result deviation or even device burn.
Brief description
Fig. 1 is a kind of control flow chart of the particulate matter cleaning control method of present invention probe card probe.
Specific embodiment
Below in conjunction with the accompanying drawings, the specific embodiment of the present invention is described in further detail.
In the present embodiment, refer to Fig. 1, Fig. 1 is a kind of particulate matter cleaning control method of present invention probe card probe
Control flow chart.As illustrated, the particulate matter cleaning control method of the probe card probe of the present invention by following steps Lai real
Apply:
Step s01: set the proof cycle of particulate contamination.Set the particulate contamination of described probe in probe card board
Proof cycle, proof cycle is set as carrying out the particulate contamination of described probe after the testing electrical property of every wafer finishes
Inspection.
Step s02: start wafer sort.According to proof cycle, every wafer is proceeded by with the testing electrical property of wafer.
Step s03: complete wafer sort.Complete the testing electrical property to 1 wafer.
Step s04: probe particles quality testing is looked into.After completing the testing electrical property to above-mentioned 1 wafer, to described probe card
All described probe carries out the contaminating examination of particulate matter one by one；The video imaging unit first passing through probe card board is to probe tip
Vertically taken pictures, then passed through the size that the optical image of the probe card board probe tip adjacent to every group is formed
Compare with shape, by calculating between the optical image distinguishing the probe tip mutually comparing, whether size shape is consistent, and
One by one each probe is checked.Essentially identical between the optical image of normal probe tip, and particulate matter occurs
Obvious difference is will appear from, thus the probe of contamination particulate matter can be found out between the optical image of probe tip.Wherein, when every group
When not having differences between the optical image at adjacent described probe tip position mutually comparing, judge that described probe is not integrally deposited
In particulate contamination, as long as having differences between the optical image at the adjacent described probe tip position that one of which phase compares
When, that is, judge that described probe integrally has particulate contamination.So, can avoid carrying out blindly clear pin, and can avoid due to a lack of
Clear pin effect detection means, cause the probe being infected with particulate matter mistakenly to continue on for testing electrical property, lead to test result deviation
The serious consequence that even device burns.
In step s04, have in order to avoid having slightly different situation to be mistaken for detecting probe surface probe tip size by mistake
Particulate contamination, needs to design the Tolerance Parameters when comparing between the area of the optical image of an adjacent probe needle point, that is,
The allowed band of the variance rate of optical image of two probe permissions.This tolerance can be according between the tolerance of probe processing, probe
Size difference amount, size changing rate in service life for the probe, in conjunction with occur during smallest particles thing probe size change
The correlation experience data such as rate, is set in wat probe card board, and can carry out tolerance tune according to the change of actual conditions
Whole it is ensured that check and cleaning process control accuracy.
In step s04, when judging described probe global non-existence particulate contamination, described probe can continue on for into
The testing electrical property of row wafer, and start to carry out testing electrical property to lower 1 wafer；When judging that described probe integrally has particulate matter and be stained with
During dye, that is, need whole described probes is carried out with sand paper acupuncture treatment cleaning.
Step s05: carry out probe cleaning.By the execution of probe card board, the probe needing cleaning is had an acupuncture treatment to sand paper
Operation, relies on the friction between probe and sand paper, probe to be carried out clean for the first time.And by setting bundle during described cleaning
Pin number of times and acupuncture treatment pin pressure, the effect of cleaning is controlled.
Step s06: according to whether reaching the judgement of the cleaning time upper limit, make respective handling.In order to ensure the clear of probe
Clean quality it is necessary to carry out the contaminating examination of particulate matter again to the probe carrying out after cleaning for the first time.After checking again for, if sentenced
Break described probe global non-existence particulate contamination it is possible to probe be put into the testing electrical property proceeding lower 1 wafer
Use；Whereas if still judge described probe integrally exist particulate contamination it is necessary to carry out clear again to described probe
Clean process, and circulate implementation.In order to avoid probe is in cleaning again afterwards, what particulate matter still can not be eliminated asks
Topic, by increasing the side of pricking times when cleaning again every time and pin pressure of having an acupuncture treatment according to certain ratio or fixed numbers
Method, is set in wat probe card board, to increase clear needle force degree until the particulate matter of contamination drops, comes to clear for the first time
The effect that after clean each time is cleaned again is controlled.And, the pricking times according to board setting and the upper of pin pressure of having an acupuncture treatment
Limit value, the increase ratio in conjunction with pricking times and acupuncture treatment pin pressure or increase numerical value, obtain allowing the number of times cleaning again to arrange
The upper limit, board may only carry out repetitious cleaning again, to avoid machine in the number of times less than above-mentioned limit value to probe
The platform undying repeatedly clear pin action of execution automatically.In the cleaning again of each time, as long as judging that particulate matter is eliminated, just hold
It is about to probe to continue to put into test use.According to above-mentioned setting, if probe particles thing cannot be removed after cleaning for the first time, machine
Platform, under the precondition judging not reaching the cleaning time upper limit, will carry out probe particles quality testing in each cleaning Posterior circle and look into,
And proceed second or more cleaning to needing the probe cleaning again to execute, until disposing the particulate matter of probe
When till；But, if board is judging to have reached the cleaning time upper limit, is reaching pricking times and the upper limit of acupuncture treatment pin pressure
After value, still cannot dispose probe particulate matter when, by board arrange alarm signal and report to the police start after shut down
Measure processed.
Step s07: board is reported to the police, shutdown is processed.Carrying out after probe cleans again several times, when arrival cleaning time
The upper limit, reach pricking times and acupuncture treatment pin pressure higher limit after, still cannot dispose probe particulate matter when, board will be sent out
Go out alarm signal, and carry out autostop after startup of reporting to the police.At this moment, will be further processed by manpower intervention, thus
The undying repeatedly clear pin action of execution, it is ensured that clear pin efficiency, exists during being also easy to find cleaning automatically to avoid board
Leak so that timely adjust and rectify a deviation.
In the present embodiment, after every wafer is completed, just according to the requirement of the proof cycle setting, visited
The inspection of the particulate contamination of pin.The cleaning mode of prior art, typically criticizes in the wafer sort setting and (exceedes a piece of
Wafer count) be all completed after, just carry out clear pin.Not only the clear pin effect of this cleaning mode cannot know, and for survey
The particulate matter of examination midway contamination also cannot be removed in time.If the needle point contamination of probe has particulate matter, not only influences whether to test
When contact resistance detection accuracy, be additionally, since test pad and the plain conductor of chip between minimum (about 2 μ of spacing
M), the probe of contamination particulate matter will result in short circuit between test pad and plain conductor, even results in after device burns and wait seriously
Really.During using the present embodiment, a wafer sort criticize test midway any two wafers test gap between so that it may
By the inspection to particulate contamination, find that probe whether there is particulate contamination in time, and clear pin in time.By the present embodiment
With higher inspection frequency, to ensure that probe is in frequent cleaning use state, thus effectively prevent contamination particulate matter
The problem that probe cannot be found in time.
By the above embodiment of the present invention, it is possible to achieve the probe cleaning cycle to described probe card board and cleaning effect
Fruit is effectively controlled, it is to avoid blindly clear pin phenomenon and the probe causing contamination particulate matter due to a lack of clear pin effect detection continue
For the testing electrical property of wafer, lead to the serious consequence that test result deviation or even device burn.
It should be noted that the setting to the proof cycle that probe particles thing is infected with for the present invention, can be according to probe property itself
The factors such as shape, use condition, the number of unit testing amount carry out considering the gap periods to adjust inspection.Needs are carried out
Pricking times when repeatedly cleaning and the increase mode of acupuncture treatment pin pressure, according to different test conditions, it would however also be possible to employ other
Increase rule, to limit the number of times of multiple cleaning.Can also be by the optics shadow at the adjacent described probe tip position mutually comparing
Other features that probe card board beyond the area of picture can recognize that and operates, such as shape contour feature etc. are described as judging
Whether probe integrally has the definition condition of particulate contamination.
Above-described only the preferred embodiments of the present invention, the patent that described embodiment is simultaneously not used to limit the present invention is protected
The equivalent structure change that shield scope, the specification of therefore every utilization present invention and accompanying drawing content are made, should be included in the same manner
In protection scope of the present invention.
Claims (5)
1. a kind of particulate matter cleaning control method of probe card probe is it is characterised in that comprise the following steps:
Step one: set the proof cycle of the particulate contamination of described probe of described probe card, and according to proof cycle, to rule
The wafer of stator number carries out the testing electrical property of wafer；
Step 2: after the testing electrical property that described proof cycle specifies piece number wafer finishes, whole described to described probe card
Probe carries out the contaminating examination of particulate matter one by one, by each described probe of described probe card is adjacent the needle point of probe
Compare between the optical image at position, the face of the optical image at the adjacent described probe tip position mutually being compared according to definition
With the presence or absence of the condition of difference between long-pending, come overall judge that described probe whether there is particulate contamination, and set and mutually compare
Variance rate tolerance between the area of optical image at adjacent described probe tip position, to avoid adjacent described probe tip
Comparison result when site area size has slightly different is mistaken for there is particulate contamination；Wherein, the phase comparing when every group of phase
When not having differences between the optical image at adjacent described probe tip position, judge that described probe global non-existence particulate matter is stained with
Dye, as long as have differences between the optical image at the adjacent described probe tip position that one of which phase compares, that is, judges
Integrally there is particulate contamination in described probe；Wherein, the optical image at described probe tip position refers to from vertically described
Optical image captured by probe tip direction；
Step 3: when judging described probe global non-existence particulate contamination, execution continues on for carrying out crystalline substance to described probe
The testing electrical property of circle；When judging that described probe integrally has particulate contamination, that is, execute and sand is carried out to whole described probes
Paper acupuncture treatment cleaning；
Step 4: the described probe that cleaning is finished, carry out the contaminating examination of described particulate matter again according to step 2, and according to
Described probe integrally be whether there is with the judged result of particulate contamination, according to step 3 execution described probe continued on for into
The testing electrical property of row wafer or the process cleaned again；
Step 5: to the described probe after being cleaned again, in the numbers range allowing to clean again, repeat according to step
Four execute the contaminating examination to described probe and the process cleaned again, until described probe is judged global non-existence particle
Thing is infected with, and can proceed with the testing electrical property of wafer, or still judges described spy after arrival allows the number of times limit value cleaning again
When pin integrally has particulate contamination, reported to the police and shut down process；
Wherein, when described probe being cleaned and cleans again, by setting pricking times and acupuncture treatment during described cleaning
Pin pressure, the effect of cleaning is controlled, and, when cleaning again described in described probe is carried out, increases institute by setting
State pricking times during cleaning and acupuncture treatment pin pressure, the effect cleaning again is controlled.
2. the particulate matter cleaning control method of probe card probe as claimed in claim 1 is it is characterised in that in step one, institute
State the particulate contamination of probe proof cycle be set as carrying out after the testing electrical property of every wafer finishes described probe
The inspection of grain thing contamination.
3. the particulate matter cleaning control method of probe card probe as claimed in claim 1 is it is characterised in that enter to described probe
Row is multiple described when cleaning again, by setting the acupuncture treatment time increasing when cleaning every time according to certain ratio or fixed numbers
Number and acupuncture treatment pin pressure, the effect repeatedly cleaning again is controlled.
4. the particulate matter cleaning control method of probe card probe as claimed in claim 1 is it is characterised in that enter to described probe
Row is multiple described when cleaning again, by setting the acupuncture treatment time increasing when cleaning every time according to certain ratio or fixed numbers
Number and acupuncture treatment pin pressure, the effect repeatedly cleaning again is controlled, pricking times during described cleaning and acupuncture treatment pin
Pressure is respectively provided with higher limit, and the described number of times allowing to clean again, according to the increase ratio of described pricking times and acupuncture treatment pin pressure
Example or increase numerical value and its each the corresponding relation between higher limit draw.
5. the particulate matter cleaning control method of probe card probe as claimed in claim 4 is it is characterised in that in described cleaning
Pricking times and after acupuncture treatment pin is pressed onto and reaches higher limit, when still judging that described probe integrally has particulate contamination, reported
Warn and shut down process.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410215781.6A CN103969267B (en) | 2014-05-20 | 2014-05-20 | Cleaning control method of particulate matters on probes of probe card |
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| CN201410215781.6A CN103969267B (en) | 2014-05-20 | 2014-05-20 | Cleaning control method of particulate matters on probes of probe card |
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| CN103185729A (en) * | 2011-12-29 | 2013-07-03 | 百励科技股份有限公司 | Appearance inspection apparatus and execution method thereof |
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