CN103969267A - Cleaning control method of particulate matters on probes of probe card - Google Patents
Cleaning control method of particulate matters on probes of probe card Download PDFInfo
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- CN103969267A CN103969267A CN201410215781.6A CN201410215781A CN103969267A CN 103969267 A CN103969267 A CN 103969267A CN 201410215781 A CN201410215781 A CN 201410215781A CN 103969267 A CN103969267 A CN 103969267A
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Abstract
The invention discloses a cleaning control method of particulate matters on probes of a probe card. The method comprises the steps of after the electrical performance test of each piece of wafer is carried out and the probes are cleaned each time, respectively carrying out particulate matter contamination check on the probes by comparing the optical images of the points of the adjacent probes one by one, judging whether the probes need to be cleaned or cleaned again according to the results of the check, and carrying out corresponding treatment; limiting the allowed number of cleaning again, and adopting the measures of alarming and stopping a machine in time to control the effect of repeatedly cleaning; therefore, the particulate matters contaminating the probes can be cleaned in time, the phenomenon of blindly cleaning the probes is avoided, and the serious consequences that the test results have errors and even a device is burnt out caused by the fact that the probes which are contaminated by the particulate matters are continuously applied to the electrical performance test of the wafer due to the lack of probe cleaning effect detection can be avoided; the method can be used for effectively controlling the cleaning period and the cleaning effect of the probes of a probe card machine.
Description
Technical field
The present invention relates to a kind of in semiconductor microactuator Electronic Testing field the clean technologies for the probe of wafer acceptance testing, more specifically, relate to and a kind of the probe of probe carried out to the control method of particle when clean.
Background technology
After semiconductor crystal wafer completes, encapsulate before, in order to ensure the yield of wafer and avoid the waste of encapsulation, in manufacture of semiconductor, need to carry out wafer acceptance testing (Wafer Acceptance Test, WAT).WAT probe board is widely used in the testing electrical property that wafer is carried out, and is the test interface connecting between WAT surveying instrument and wafer.Its principle of work is that the probe that connects the probe of surveying instrument is directly contacted with detection welding pad (PAD) or salient pole on chip to be measured, form measuring circuit, by probe to chip feed-in test signal to be measured and feedback chip signal, conjunction measuring instrument and software control filter out electrically bad chip again, realize robotization and detect.Probe has comprised and being used for and a plurality of probes of testing PAD and contacting.
When testing, due to end of probe tip need to test PAD Surface Contact and scraping (acupuncture treatment), can take up the test oxide on PAD surface or nitride etc. and scrape bits, cause end of probe to be infected with scraping particle, this can disturb probe and test the electrical connection between PAD, causes the deviation of testing result.Therefore, need to be to using the probe employing after certain number of times to clean (clear pin) with the mode (acupuncture treatment) of Sandpapering.
Existing probe clean method, be to wafer after the test of fixing pricking times, or after the wafer of test stator number, by probe and the sand paper clear pin that rubs.But, adopt this cleaning mode cannot confirm the effect of clear pin, and the particle of being infected with for the test in a cleaning cycle (being generally a test being comprised of multi-disc wafer criticizes) also cannot be removed in time midway.
Along with the Highgrade integration of semi-conductor chip, the quantity of test PAD is also corresponding the dwindling of unit area increasing also, the more crypto set that also becomes of the arrangement between test PAD.Under this situation, if the needle point of probe has been infected with particle, not only the detection accuracy of contact resistance in the time of can having influence on test, and, due to the spacing minimum (being about 2 μ m) between test PAD and the plain conductor of chip, the probe of being infected with particle will cause short circuit between test PAD and plain conductor, the serious consequence such as cause that device burns.When carrying out chip testing, fail can be marked with the mark of defective products by the chip of test, and when carrying out chip cutting thereafter by screening out, only have normally functioning chip just can carry out the encapsulation procedure of next stage.Chip testing is just becoming and reduces the cost and improve the indispensable process of yield.Therefore, under the trend improving gradually in current encapsulation unit cost, the accuracy rate of WAT and efficiency have become a material impact link in the control of wafer manufacturing cost, and effective demand for control clean to probe also becomes more and more urgent.
Summary of the invention
The object of the invention is to overcome the above-mentioned defect that prior art exists, a kind of particle cleaning control method of new probe probe is provided, by probe described in each of described probe being adjacent between the optical image at needle point position of probe, whether there are differences, as the condition that judges whether described probe exists particle to be infected with, after the testing electrical property of every wafer and after each the cleaning of described probe, carry out respectively the particle contaminating examination that adjacent described probe is compared one by one, make accordingly whether described probe needs to clean or clean judgement and carry out alignment processing again, and when again clean, increased pricking times and acupuncture treatment pin is pressed, whether realization needs effective control of clean and cleaning effect to described probe.
For achieving the above object, technical scheme of the present invention is as follows:
A particle cleaning control method for probe probe, is characterized in that, comprises the following steps:
Step 1: set the proof cycle that the particle of the described probe of described probe is infected with, and according to proof cycle, the wafer of regulation sheet number is carried out to the testing electrical property of wafer;
Step 2: after described proof cycle regulation sheet is counted the testing electrical property of wafer, the whole described probe of described probe is carried out to the contaminating examination of particle one by one, by probe described in each of described probe being adjacent between the optical image at needle point position of probe, compare, the condition whether there are differences between the optical image at the adjacent described probe tip position comparing according to definition, comes wholely to judge whether described probe exists particle to be infected with; Wherein, when not there are differences between the optical image at every group of adjacent described probe tip position comparing, judge that described probe global non-existence particle is infected with, when as long as while wherein there are differences between the optical image at one group of adjacent described probe tip position comparing, judge that described probe global existence particle is infected with;
Step 3: when the described probe global non-existence particle of judgement is infected with, carry out the testing electrical property that described probe is continued on for carrying out wafer; When the described probe global existence particle of judgement is when be infected with, carry out that whole described probes is carried out to sand paper acupuncture treatment is clean;
Step 4: to clean complete described probe, according to step 2, again carry out the contaminating examination of described particle, and according to the judged result that whether exists particle to be infected with to described probe integral body, according to step 3, carry out described probe is continued on for carrying out the testing electrical property of wafer or the processing of again cleaning;
Step 5: to the described probe after again cleaning; within the scope of the number of times that allows again to clean; repetition is carried out the contaminating examination of described probe and clean processing again according to step 4; until being judged global non-existence particle, is infected with by described probe; can proceed the testing electrical property of wafer; or after the number of times limit value that allows again to clean in arrival, still judge when described probe global existence particle is infected with, report to the police and shut down processing.
Further, in step 1, the proof cycle that the particle of described probe is infected with is set as carrying out after the testing electrical property of every wafer the inspection that the particle of described probe is infected with.
Further, in step 2, between the area of the optical image at the adjacent described probe tip position that definition compares, whether there are differences, as judging the described probe condition whether global existence particle is infected with.
Further, the variance rate tolerance between the area of the optical image at the adjacent described probe tip position comparing by setting, avoids having slightly asynchronous comparison result to be mistaken for adjacent described probe tip position size and exists particle to be infected with.
Further, the optical image at described probe tip position refers to from vertical towards the captured optical image of described probe tip direction.
Further, described probe is cleaned and when again clean, by setting described pricking times and acupuncture treatment pin when clean, press, clean effect is controlled.
Further, when again clean described in described probe is carried out, by settings, increase described pricking times and the pin of having an acupuncture treatment when clean and press, again clean effect is controlled.
Further, when described probe is carried out to repeatedly described again clean, by setting, according to certain ratio or fixed numbers, increase each pricking times and acupuncture treatment pin when clean and press, to repeatedly again clean effect control.
Further, when described probe is carried out to repeatedly described again clean, pricking times and acupuncture treatment pin while increasing each cleaning by setting according to certain ratio or fixed numbers are pressed, to repeatedly again clean effect control, described pricking times when clean and acupuncture treatment pin are pressed has respectively higher limit, the described number of times that again cleans of allowing, the increase ratio of pressing according to described pricking times and acupuncture treatment pin or increase numerical value and its separately the corresponding relation between higher limit draw.
Further, at described pricking times when clean and acupuncture treatment pin, be pressed onto and reach after higher limit, still judge when described probe global existence particle is infected with, report to the police and shut down processing.
In technique scheme, after each wafer is completed, just according to the requirement of the proof cycle of setting, carry out the inspection that the particle of probe is infected with.Existing cleaning mode normally, after a wafer sort of setting is criticized and is all completed, just carries out pin clearly, not only clear pin effect cannot know, and cannot remove in time for testing the particle of being infected with midway.If the needle point of probe has been infected with particle, not only the detection accuracy of contact resistance in the time of can having influence on test, and, due to the spacing minimum (being about 2 μ m) between test PAD and the plain conductor of chip, the probe of being infected with particle will cause short circuit between test PAD and plain conductor, the serious consequence such as even cause that device burns.Adopt technical scheme of the present invention, the test of criticizing a wafer sort midway, just can be by the inspection that particle is infected with, find in time whether probe exists particle to be infected with, and in time clear pin, be by higher inspection frequency, guarantee that probe is in frequent clean use state, thereby effectively avoided being infected with the problem that the probe of particle cannot be found in time.
Technical scheme of the present invention is when implementing, first by the video imaging unit of probe board, probe tip is vertically taken pictures, then probe board can be compared to the formed area of the optical image of adjacent probe needle point, by calculating, distinguish between the optical image of the probe tip comparing, whether size shape is consistent, and one by one each probe is checked.Basic identical between the optical image of normal probe tip, and occur between the optical image of probe tip of particle occurring obvious difference, thereby find out the probe of being infected with particle.Thereby avoided blindly clear pin phenomenon and for want of clearly pin effect detection cause the probe of being infected with particle to continue on for testing electrical property, cause the test result deviation serious consequence that even device burns.
For fear of mistake, having slightly different situations to be mistaken for surface probe tip size has particle to be infected with, need to design the Tolerance Parameters when comparison between the area of optical image of an adjacent probe needle point, the allowed band of the variance rate of the optical image that two probes allow.This tolerance can be according to tolerance, the size difference amount between probe, the size changing rate of probe in serviceable life of probe processing, the correlation experience data such as probe size rate of change when there is smallest particles thing, in WAT probe board, set, and can carry out tolerance adjustment according to the variation of actual conditions, guaranteed the control accuracy of inspection and cleaning course.
For fear of probe when again clean, the problem that particle still can not be eliminated, the method that pricking times while increasing each cleaning by the ratio according to certain or fixed numbers and acupuncture treatment pin are pressed, in WAT probe board, set, to strengthen clear needle force degree until the particle of being infected with drops, to repeatedly again clean effect control.And, the higher limit of pressing according to pricking times and acupuncture treatment pin, the increase ratio of pressing in conjunction with pricking times and acupuncture treatment pin or increase numerical value, obtains allowing the number of times upper limit that again cleans, has avoided board to carry out undying clear pin action repeatedly; Simultaneously; if reaching the number of times upper limit that allows again to clean, reaching after the higher limit that pricking times and acupuncture treatment pin press, in the time of still cannot removing probe particle, be provided with and report to the police and shut down treatment measures; by manpower intervention, be further processed, thereby guaranteed clear pin efficiency.
From technique scheme, can find out, whether the present invention there are differences by probe described in each of described probe being adjacent between the optical image at needle point position of probe, as the condition that judges whether described probe exists particle to be infected with, after the testing electrical property of every wafer and after each the cleaning of described probe, carry out respectively the particle contaminating examination that adjacent described probe is compared one by one, make accordingly whether described probe needs to clean or clean judgement and carry out alignment processing again; And when repeatedly cleaning; according to the higher limit scope of pricking times and acupuncture treatment pin pressure; pricking times and acupuncture treatment pin while increasing each cleaning by setting according to certain ratio or fixed numbers are pressed; define and allow the number of times that again cleans; can take in time to report to the police and shut down treatment measures, repeatedly clean effect is controlled.Thereby can after being completed, a wafer sort BT(batch testing) each wafer midway carry out the contaminating examination of probe particle, the particle that clean probe is infected with in time; If discovery probe tip has been infected with particle, suspend test and carry out pin clearly, and after clear pin, compare probe and whether cleaned, if to have cleaned, strengthen clear needle force degree until cleaned the dropping of particle of being infected with.Therefore, the present invention has the distinguishing feature that probe cleaning cycle and the cleaning effect of described probe board are control effectively, avoided blindly clear pin phenomenon and for want of clearly pin effect detection cause the probe of being infected with particle continue on for wafer testing electrical property, cause the test result deviation serious consequence that even device burns.
Accompanying drawing explanation
Fig. 1 is the control flow chart of the particle cleaning control method of a kind of probe probe of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
In the present embodiment, refer to Fig. 1, Fig. 1 is the control flow chart of the particle cleaning control method of a kind of probe probe of the present invention.As shown in the figure, the particle cleaning control method of probe probe of the present invention is implemented by following steps:
Step S01: set the proof cycle that particle is infected with.At probe board, set the proof cycle that the particle of described probe is infected with, proof cycle is set as carrying out after the testing electrical property of every wafer the inspection that the particle of described probe is infected with.
Step S02: start wafer sort.According to proof cycle, every wafer is started to carry out to the testing electrical property of wafer.
Step S03: complete wafer sort.Complete the testing electrical property to 1 wafer.
Step S04: probe particle checks.After completing the testing electrical property of above-mentioned 1 wafer, the whole described probe of described probe is carried out to the contaminating examination of particle one by one; First by the video imaging unit of probe board, probe tip is vertically taken pictures, then by probe board, the formed size of the optical image of every group of adjacent probe tip and shape are compared, by calculating, distinguish between the optical image of the probe tip comparing, whether size shape is consistent, and one by one each probe is checked.Basic identical between the optical image of normal probe tip, and occur between the optical image of probe tip of particle occurring obvious difference, thereby can find out the probe of being infected with particle.Wherein, when not there are differences between the optical image at every group of adjacent described probe tip position comparing, judge that described probe global non-existence particle is infected with, when as long as while wherein there are differences between the optical image at one group of adjacent described probe tip position comparing, judge that described probe global existence particle is infected with.Like this, can avoid carrying out clear pin blindly, and can avoid for want of clear pin effect detection means, cause the probe of being infected with particle to continue on for mistakenly testing electrical property, cause the test result deviation serious consequence that even device burns.
In step S04, for fear of mistake, having slightly different situations to be mistaken for detecting probe surface probe tip size has particle to be infected with, need to design the Tolerance Parameters when comparison between the area of optical image of an adjacent probe needle point, the allowed band of the variance rate of the optical image that two probes allow.This tolerance can be according to tolerance, the size difference amount between probe, the size changing rate of probe in serviceable life of probe processing, the correlation experience data such as probe size rate of change when there is smallest particles thing, in WAT probe board, set, and can carry out tolerance adjustment according to the variation of actual conditions, guarantee the control accuracy of inspection and cleaning course.
In step S04, when the described probe global non-existence particle of judgement is infected with, described probe can continue on for carrying out the testing electrical property of wafer, and starts lower 1 wafer to carry out testing electrical property; When the described probe global existence particle of judgement is infected with, need that whole described probes is carried out to sand paper acupuncture treatment clean.
Step S05: carry out probe and clean.By probe board, carried out the operation that the clean probe of needs is had an acupuncture treatment to sand paper, rely on the friction between probe and sand paper, probe is cleaned for the first time.And press by setting described pricking times and acupuncture treatment pin when clean, clean effect is controlled.
Step S06: according to the judgement that whether arrives the cleaning time upper limit, make respective handling.In order to guarantee the cleaning quality of probe, must again carry out the contaminating examination of particle to the probe after cleaning for the first time.After again checking, if judge what described probe global non-existence particle was infected with, just probe can be dropped into the testing electrical property use of proceeding down 1 wafer; Otherwise, if still judge what described probe global existence particle was infected with, the processing that just need to again clean described probe, and circulation is carried out.For fear of probe after again clean time, the problem that particle still can not be eliminated, the method that pricking times while at every turn again cleaning by the ratio according to certain or fixed numbers increase and acupuncture treatment pin are pressed, in WAT probe board, set, to strengthen clear needle force degree until the particle of being infected with drops, to each time after clean for the first time again clean effect control.And, the higher limit that the pricking times arranging according to board and acupuncture treatment pin are pressed, increase ratio or increase numerical value in conjunction with pricking times and acupuncture treatment pin pressure, obtain allowing the number of times again cleaning that the upper limit is set, board is only with in being no more than the number of times of above-mentioned limit value, probe is carried out repetitious again clean, to avoid board to automatically perform undying clear pin action repeatedly.When each time again clean, as long as judgement particle is eliminated, just carries out and probe is continued to drop into test use.According to above-mentioned setting, if in the time of cannot removing probe particle after cleaning for the first time, board does not arrive under the precondition of the cleaning time upper limit in judgement, to after each cleaning, loop the inspection of probe particle, and probe that need to be again clean is carried out and proceeded for the second time or clean more frequently, until while disposing the particle of probe; But; if board has arrived the cleaning time upper limit in judgement, has reached after the higher limit of pricking times and acupuncture treatment pin pressure; in the time of still cannot disposing the particle of probe, by the measure that alerting signal is set and shut down at board after the startup of reporting to the police, process.
Step S07: board is reported to the police, shut down and process.Carried out several times probe again clean after; when arriving the cleaning time upper limit, reaching after the higher limit of pricking times and acupuncture treatment pin pressure; in the time of still cannot disposing the particle of probe, board will send alerting signal, and carry out auto stop after the startup of reporting to the police.At this moment, will be further processed by manpower intervention, thereby avoid board to automatically perform undying clear pin action repeatedly, guarantee clear pin efficiency, also be easy to find the leak that exists in cleaning course, to adjust in time and rectify a deviation.
In the present embodiment, after each wafer is completed, just according to the requirement of the proof cycle of setting, carry out the inspection that the particle of probe is infected with.The cleaning mode of prior art, normally criticizes in a wafer sort of setting after (surpassing a slice wafer count) be all completed, and just carries out pin clearly.Not only the clear pin effect of this cleaning mode cannot be known, and the particle of being midway infected with for test also cannot be removed in time.If the needle point of probe has been infected with particle, not only the detection accuracy of contact resistance in the time of can having influence on test, and, due to the spacing minimum (being about 2 μ m) between test PAD and the plain conductor of chip, the probe of being infected with particle will cause short circuit between test PAD and plain conductor, the serious consequence such as even cause that device burns.While adopting the present embodiment, between the test gap of the test of criticizing a wafer sort any two wafers midway, just can find in time whether probe exists particle to be infected with by the inspection that particle is infected with, and in time clear pin.By the present embodiment, with higher inspection frequency, guarantee that probe is in frequent clean use state, thereby effectively avoided being infected with the problem that the probe of particle cannot be found in time.
Pass through the above embodiment of the present invention, can realize probe cleaning cycle and the cleaning effect of described probe board are effectively controlled, avoid clear pin phenomenon blindly and for want of clearly pin effect detection cause the probe of being infected with particle continue on for wafer testing electrical property, cause the test result deviation serious consequence that even device burns.
It should be noted that the setting of the proof cycle that the present invention is infected with probe particle can consider to adjust according to factors such as the numbers of the proterties of probe own, service condition, unit testing amount the gap periods of inspection.The increase mode that pricking times when needs are repeatedly cleaned and acupuncture treatment pin are pressed, according to different test conditions, also can adopt other increase rule, to limit repeatedly clean number of times.Other features that probe board beyond the area of the optical image at the adjacent described probe tip position comparing can also be identified and operate, such as shape contour feature etc. as judging the described probe definite condition whether global existence particle is infected with.
Above-described is only the preferred embodiments of the present invention; described embodiment is not in order to limit scope of patent protection of the present invention; therefore the equivalent structure that every utilization instructions of the present invention and accompanying drawing content are done changes, and in like manner all should be included in protection scope of the present invention.
Claims (10)
1. a particle cleaning control method for probe probe, is characterized in that, comprises the following steps:
Step 1: set the proof cycle that the particle of the described probe of described probe is infected with, and according to proof cycle, the wafer of regulation sheet number is carried out to the testing electrical property of wafer;
Step 2: after described proof cycle regulation sheet is counted the testing electrical property of wafer, the whole described probe of described probe is carried out to the contaminating examination of particle one by one, by probe described in each of described probe being adjacent between the optical image at needle point position of probe, compare, the condition whether there are differences between the optical image at the adjacent described probe tip position comparing according to definition, comes wholely to judge whether described probe exists particle to be infected with; Wherein, when not there are differences between the optical image at every group of adjacent described probe tip position comparing, judge that described probe global non-existence particle is infected with, when as long as while wherein there are differences between the optical image at one group of adjacent described probe tip position comparing, judge that described probe global existence particle is infected with;
Step 3: when the described probe global non-existence particle of judgement is infected with, carry out the testing electrical property that described probe is continued on for carrying out wafer; When the described probe global existence particle of judgement is when be infected with, carry out that whole described probes is carried out to sand paper acupuncture treatment is clean;
Step 4: to clean complete described probe, according to step 2, again carry out the contaminating examination of described particle, and according to the judged result that whether exists particle to be infected with to described probe integral body, according to step 3, carry out described probe is continued on for carrying out the testing electrical property of wafer or the processing of again cleaning;
Step 5: to the described probe after again cleaning; within the scope of the number of times that allows again to clean; repetition is carried out the contaminating examination of described probe and clean processing again according to step 4; until being judged global non-existence particle, is infected with by described probe; can proceed the testing electrical property of wafer; or after the number of times limit value that allows again to clean in arrival, still judge when described probe global existence particle is infected with, report to the police and shut down processing.
2. the particle cleaning control method of probe probe as claimed in claim 1, it is characterized in that, in step 1, the proof cycle that the particle of described probe is infected with is set as carrying out after the testing electrical property of every wafer the inspection that the particle of described probe is infected with.
3. the particle cleaning control method of probe probe as claimed in claim 1, it is characterized in that, in step 2, between the area of the optical image at the adjacent described probe tip position that definition compares, whether there are differences, as judging the described probe condition whether global existence particle is infected with.
4. the particle cleaning control method of probe probe as claimed in claim 3, it is characterized in that, variance rate tolerance between the area of the optical image at the adjacent described probe tip position comparing by setting, avoids having slightly asynchronous comparison result to be mistaken for adjacent described probe tip position size and exists particle to be infected with.
5. the particle cleaning control method of the probe probe as described in claim 1,3 or 4, is characterized in that, the optical image at described probe tip position refers to from vertical towards the captured optical image of described probe tip direction.
6. the particle cleaning control method of probe probe as claimed in claim 1, is characterized in that, described probe is cleaned and when again clean, by setting described pricking times and acupuncture treatment pin when clean, presses, and clean effect is controlled.
7. the particle cleaning control method of the probe probe as described in claim 1 or 6, it is characterized in that, when again clean described in described probe is carried out, by settings, increase described pricking times and the pin of having an acupuncture treatment when clean and press, again clean effect is controlled.
8. the particle cleaning control method of the probe probe as described in claim 1 or 6, it is characterized in that, when described probe is carried out to repeatedly described again clean, by setting, according to certain ratio or fixed numbers, increase each pricking times and acupuncture treatment pin when clean and press, to repeatedly again clean effect control.
9. the particle cleaning control method of probe probe as claimed in claim 1, it is characterized in that, when described probe is carried out to repeatedly described again clean, pricking times and acupuncture treatment pin while increasing each cleaning by setting according to certain ratio or fixed numbers are pressed, to repeatedly again clean effect control, described pricking times when clean and acupuncture treatment pin are pressed has respectively higher limit, the described number of times that again cleans of allowing, the increase ratio of pressing according to described pricking times and acupuncture treatment pin or increase numerical value and its separately the corresponding relation between higher limit draw.
10. the particle cleaning control method of probe probe as claimed in claim 9; it is characterized in that; at described pricking times when clean and acupuncture treatment pin, be pressed onto and reach after higher limit, still judge when described probe global existence particle is infected with, report to the police and shut down processing.
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| CN116046798A (en) * | 2023-03-30 | 2023-05-02 | 合肥新晶集成电路有限公司 | Automatic needle cleaning method, automatic needle cleaning system and wafer acceptance test method |
| CN117405954A (en) * | 2023-12-14 | 2024-01-16 | 北京智芯微电子科技有限公司 | Method for removing oxide layer of probe card, cleaning and testing system |
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