CN102937594A - Defect detecting system and method - Google Patents
Defect detecting system and method Download PDFInfo
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- CN102937594A CN102937594A CN2012104323991A CN201210432399A CN102937594A CN 102937594 A CN102937594 A CN 102937594A CN 2012104323991 A CN2012104323991 A CN 2012104323991A CN 201210432399 A CN201210432399 A CN 201210432399A CN 102937594 A CN102937594 A CN 102937594A
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Abstract
The invention relates to the field of semiconductor fabrication and particularly relates to a defect detecting system and a method. According to the defect detecting system and the method, servers for performing defect data processing on each process device are integrated into a high-performance data base concentration server, so that defect information data processing speeds are greatly increased, a chip can enter a corresponding next process according to defect conditions after the chip is subjected to defect detecting, waiting time of the chip in a defect detection device is effectively reduced, efficiencies of the defect detecting process are greatly improved, the probability that wafers produce new defects is reduced, yield of products is increased, and production costs are reduced.
Description
Technical field
The present invention relates to field of semiconductor manufacture, relate in particular to a kind of defect detecting system and method.
Background technology
Along with the integrated level of semi-conductor chip improves constantly, integrated circuit (IC) design now develops into again the integrated of IP from transistorized integrated the integrated of logic gate that develop into, so that the integrated level of chip is more and more higher, and then causes circuit on the chip to distribute to become increasingly complex.The circuit of chip distributes more complicated, defective in chip manufacturing proces will be larger to the function effect of whole chip, even some defective can cause the fully breaking-up of whole chip, think the defective that can find timely chip, to prevent a large amount of generations of bad chip, generally can be at the corresponding defect detection equipment of production line configuration so that chip be carried out defects detection technique in the prior art.
At present, the principle in the defects detection technique is by after projecting first light beam on the chip, utilizes detector to accept the light signal of reflection and/or scattering, and the light signal of accepting again is converted into the datagraphic of different bright dark distributions; Shown in Fig. 1 a-1c, adopt first the figure of optical signal launcher emission sensed light signal to the die circuit features 1(optical microscope) on, then utilize detector to accept the light signal figure 2 of die circuit features 1 reflection and/or bounce back, again light signal figure 2 is converted to GTG figure 3 afterwards, again the GTG graph data of adjacent chips group is compared at last, to determine the particular location of defective on chip.
But, in the production technology of reality, when the defects count on the detection chip during greater than some, the server that arranges on the checkout equipment to the processing speed of data will be serious the speed that lags behind signals collecting, and then cause detection chip in the cavity of checkout equipment, to stop long time, after waiting for the finishing dealing with of defective data, just can carry out next step technique.
As shown in Figure 2, at first, will be placed into through the wafer after the process equipment in the cavity of checkout equipment, so that it is carried out defects detection technique; Then, checkout equipment can be with the Information generation defective data of this wafer of detecting, and be sent to and carry out data in the server and process, if the quantity of information of this defective data is larger, server will need the regular hour that this defective data is carried out analyzing and processing, because next step technique of wafer is to set according to the result that server is processed defective data, so this wafer just need to rest on finishing of wait server process data in the cavity of checkout equipment; At last, export defect report behind the complete defective data of server process, system judges according to this defect report whether the defective value of this wafer meets technological requirement, if meet technological requirement, then automatically carry out next processing step, otherwise, then be responsible for the further analyzing and processing of this wafer by the slip-stick artist; Because wafer can stay for some time in the cavity of checkout equipment when carrying out defects detection, will reduce like this detection efficiency of checkout equipment, and wafer rests on also can increase the probability that wafer produces new defective in the cavity of checkout equipment, further reduce the yield of product, increased production cost.
Summary of the invention
For the problem of above-mentioned existence, the present invention has disclosed a kind of defect detecting system and method, mainly is the technique of carrying out defects detection by preseting the chip circuit density profile.
The objective of the invention is to be achieved through the following technical solutions:
A kind of defect detecting system is applied to comprise a plurality of process equipments on the chip production line, be provided with pick-up unit on each described process equipment, wherein, also comprise a centralized database server, each described pick-up unit all is connected with described centralized database server.
Above-mentioned defect detecting system wherein, is provided with system's judge module on the described chip production line, and described system judge module is connected with described centralized database server.
A kind of defect inspection method comprises above-mentioned defect detecting system, wherein,
With a plurality of chips be placed into respectively carry out PROCESS FOR TREATMENT in the corresponding process equipment after, and utilize the pick-up unit that is arranged on the process equipment to detect through the defect situation on each chip after this process equipment, and the corresponding defect information that generates each chip;
Judge according to described defect information whether corresponding chip after treatment meets process requirements; If meet, then continue next processing step; If do not meet, then carry out slip-stick artist's treatment process.
Above-mentioned defect inspection method wherein, judges by system's judge module whether chip meets process requirements.
Above-mentioned defect inspection method, wherein, described system module is compared by the chip information data to the adjacent chips group, judges whether chip meets process requirements.
In sum, a kind of defect detecting system of the present invention and method, by will carry out on each process equipment the Server Consolidation processed of defective data be the centralized database server of a superior performance, thereby greatly improved the speed that the defect information data are processed, chip can enter corresponding next step technique according to defect situation immediately after carrying out defects detection, effectively reduce the stand-by period of chip in defect detection equipment, when having improved greatly the efficient of defects detection technique, also reduced the probability that wafer produces new defective, improve the yield of product, reduced production cost.
Description of drawings
Fig. 1 a-1c is the synoptic diagram that in the background technology of the present invention the optical picture of circuit is converted to data GTG figure;
Fig. 2 is the schematic flow sheet of defect inspection method in the background technology of the present invention;
Fig. 3 is the structural representation of defect detecting system in the embodiment of the invention one;
Fig. 4 is the schematic flow sheet of defect inspection method in the embodiment of the invention two.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is further described:
Embodiment one:
Fig. 3 is the structural representation of defect detecting system in the embodiment of the invention one; As shown in Figure 3, a kind of defect detecting system of the present invention, be applied on the wafer production line, comprise a plurality of process equipments that carry out wafer production, be provided with pick-up unit on each process equipment, a plurality of pick-up units all communicate with a database centralized servers and are connected, with the wafer defect information of receiving detection device generation, and after this defect information compared, carry out corresponding next step technique by wafer in system's judge module control pick-up unit.
Concrete, with a plurality of wafers be placed into respectively carry out PROCESS FOR TREATMENT in a plurality of process equipments after, the pick-up unit that arranges on each process equipment detects the defect situation on the wafer after this process equipment, as passing through the light characterization processes, change the dress of the optical imagery on the wafer into the data image feature, with the production defect information, and each pick-up unit all is sent to the centralized database server with the defect information of the corresponding wafer of its generation; This centralized database server carries out analyzing and processing to the defect information of each wafer, carrying out on the same row or column adjacent wafers information such as the data message that will gather compares, generate the defect report of each wafer, and this defect report is sent to system's judge module judges, if meet process requirements, then this wafer is continued subsequent technique, if do not meet process requirements, then enter slip-stick artist's treatment process, eliminate defective on this wafer etc. by manual operation.
Embodiment two:
Fig. 4 is the schematic flow sheet of defect inspection method in the embodiment of the invention two; As shown in Figure 4, on the basis of embodiment one, a kind of defect inspection method of the present invention, be applied on the wafer production line, at first, a plurality of wafers are placed into respectively carry out PROCESS FOR TREATMENT in a plurality of process equipments, and the pick-up unit that arranges by being arranged on technique, and generate defects detection information, and this defect information is sent to the centralized database server.
Secondly, the centralized database server is compared adjacent wafers information on same row or column according to the defect information of all wafers that receive, and generates the defect report of each wafer, and this defect report is sent to system's judge module judges.
At last, system's judge module is according to the wafer parameters that presets within it, judge whether each wafer meets process requirements, if meet process requirements, then this wafer is continued subsequent technique, if do not meet process requirements, then enter slip-stick artist's treatment process, eliminate defective on this wafer etc. by manual operation.
Wherein, predefined wafer parameters carries out according to process equipment in system's judge module technique and original wafer setting parameter.
In sum, owing to adopted technique scheme, the embodiment of the invention proposes a kind of defect detecting system and method, by will carry out on each process equipment the Server Consolidation processed of defective data be the centralized database server of a superior performance, thereby greatly improved the speed that the defect information data are processed, chip can enter corresponding next step technique according to defect situation immediately after carrying out defects detection, effectively reduce the stand-by period of chip in defect detection equipment, when having improved greatly the efficient of defects detection technique, also reduced the probability that wafer produces new defective, improve the yield of product, reduced production cost.
By explanation and accompanying drawing, provided the exemplary embodiments of the ad hoc structure of embodiment, based on the present invention's spirit, also can do other conversion.Although foregoing invention has proposed existing preferred embodiment, yet these contents are not as limitation.
For a person skilled in the art, read above-mentioned explanation after, various changes and modifications undoubtedly will be apparent.Therefore, appending claims should be regarded whole variations and the correction of containing true intention of the present invention and scope as.Any and all scope of equal value and contents all should be thought still to belong in the intent of the present invention and the scope in claims scope.
Claims (5)
1. a defect detecting system is applied to comprise a plurality of process equipments on the chip production line, be provided with pick-up unit on each described process equipment, it is characterized in that, also comprise a centralized database server, each described pick-up unit all is connected with described centralized database server.
2. defect detecting system according to claim 1 is characterized in that, is provided with system's judge module on the described chip production line, and described system judge module is connected with described centralized database server.
3. a defect inspection method comprises such as the defect detecting system in claim 1 or 2, it is characterized in that,
With a plurality of chips be placed into respectively carry out PROCESS FOR TREATMENT in the corresponding process equipment after, and utilize the pick-up unit that is arranged on the process equipment to detect through the defect situation on each chip after this process equipment, and the corresponding defect information that generates each chip;
Judge according to described defect information whether corresponding chip after treatment meets process requirements; If meet, then continue next processing step; If do not meet, then carry out slip-stick artist's treatment process.
4. defect inspection method according to claim 3 is characterized in that, judges by system's judge module whether chip meets process requirements.
5. defect inspection method according to claim 4 is characterized in that, described system module is compared by the chip information data to the adjacent chips group, judges whether chip meets process requirements.
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| CN201210432399.1A CN102937594B (en) | 2012-11-02 | 2012-11-02 | Defect detecting system and method |
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| CN201210432399.1A CN102937594B (en) | 2012-11-02 | 2012-11-02 | Defect detecting system and method |
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| CN102937594B CN102937594B (en) | 2015-01-21 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103196922A (en) * | 2013-04-09 | 2013-07-10 | 上海华力微电子有限公司 | Defect checking load counting system and method |
| CN103295930A (en) * | 2013-06-04 | 2013-09-11 | 上海华力微电子有限公司 | Quick efficient wafer back defect identification method |
| CN103346105A (en) * | 2013-06-27 | 2013-10-09 | 上海华力微电子有限公司 | Defect casual inspection method capable of dynamically adjusting according to technology wafer number load |
| CN103645692A (en) * | 2013-11-26 | 2014-03-19 | 上海华力微电子有限公司 | Wafer operation control system |
| CN105096021A (en) * | 2014-05-23 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | System and method for tracing a queue time of a semiconductor |
| CN105204377A (en) * | 2014-06-18 | 2015-12-30 | 上海华力微电子有限公司 | Method for improving product standard |
| CN106898563A (en) * | 2015-12-18 | 2017-06-27 | 中芯国际集成电路制造(上海)有限公司 | Product Acceptance Review system and Product Acceptance Review method |
| CN108802047A (en) * | 2018-06-05 | 2018-11-13 | 安徽得亿文教用品有限公司 | A kind of detecting system of pencil-lead transmission process |
| CN110646167A (en) * | 2019-09-20 | 2020-01-03 | 珠海京天世纪科技有限公司 | Printer selenium drum component detection method |
| CN112082760A (en) * | 2020-08-25 | 2020-12-15 | 耒阳金悦科技发展有限公司 | Bearing detection method for compression mechanism |
| CN115358914A (en) * | 2022-10-20 | 2022-11-18 | 深圳市壹倍科技有限公司 | Data processing method and device for visual detection, computer equipment and medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106898563A (en) * | 2015-12-18 | 2017-06-27 | 中芯国际集成电路制造(上海)有限公司 | Product Acceptance Review system and Product Acceptance Review method |
| CN108802047A (en) * | 2018-06-05 | 2018-11-13 | 安徽得亿文教用品有限公司 | A kind of detecting system of pencil-lead transmission process |
| CN110646167A (en) * | 2019-09-20 | 2020-01-03 | 珠海京天世纪科技有限公司 | Printer selenium drum component detection method |
| CN112082760A (en) * | 2020-08-25 | 2020-12-15 | 耒阳金悦科技发展有限公司 | Bearing detection method for compression mechanism |
| CN115358914A (en) * | 2022-10-20 | 2022-11-18 | 深圳市壹倍科技有限公司 | Data processing method and device for visual detection, computer equipment and medium |
| CN115358914B (en) * | 2022-10-20 | 2023-01-20 | 深圳市壹倍科技有限公司 | Data processing method and device for visual detection, computer equipment and medium |
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| CN102937594B (en) | 2015-01-21 |
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