CN107784660B - Image processing method, image processing system and defect detection device - Google Patents
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Abstract
The present invention relates to an image processing method, an image processing system, and a defect detection apparatus, which are used for processing an original image (raw image) formed after optically scanning a wafer. The image processing system comprises an image edge identification unit, an image segmentation unit, an image enhancement unit, an image denoising unit, an image marking unit and a data storage unit, so as to obtain the position and size information of a target defect, such as a bubble defect, from an original image. The defect detection device comprises the image processing system. The image processing method, the image processing system and the defect detection device provided by the invention can reduce the cost and the error of manually judging the defects, improve the image processing efficiency, effectively determine the abnormal condition of the process or the machine in time and help to reduce the loss caused by the abnormality of the process or the machine.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to an image processing method, an image processing system, and a defect detection apparatus.
Background
With the continuous and mature development of semiconductor manufacturing technology, image sensors are increasingly and intensively applied to numerous fields such as digital cameras, PC cameras, video phones, video conferences, intelligent security systems, automobile reversing radars, game machines, industrial medicine and the like.
Image sensors can be classified into CCD (Charge Coupled Device) image sensors and CMOS (Complementary Metal Oxide Semiconductor) image sensors according to the difference between the photosensitive elements and the photosensitive principle. The CMOS image sensor belongs to a photoelectric component, and because the manufacturing method of the CMOS image sensor is compatible with the manufacturing method of the existing integrated circuit, the CMOS image sensor can integrate a driving circuit and pixels together, so that the hardware design is simplified, the power consumption of a system is reduced, the CMOS image sensor can acquire an electric signal while acquiring an optical signal, can process image information in real time, and has high reaction speed; meanwhile, the CMOS image sensor has the advantages of low price, large bandwidth, anti-blur, flexible access, and large fill factor, and is gradually becoming the mainstream of the image sensor.
A method of manufacturing a CMOS Image Sensor (also referred to as CIS) is as follows: after a device wafer (device wafer) with a photosensitive area formed on one surface and a bottom layer wafer (carrier wafer) without the photosensitive area are subjected to related processes such as edge grinding (wafer) and Chemical Mechanical Polishing (CMP), bonding (bond) is carried out through an adhesive, and then a metal lead, a color filter, a micro lens, a metal isolation grid and the like are formed on the bonded wafer, so that a complete CMOS image sensor is finally formed.
However, the inventors have found that bubble defects (bubble defects) are present in the bonded wafer as detected by the defect scanning system after bonding the device wafer and the underlying wafer using the above method. The existing image analysis system has errors in analyzing the bubble defects, the size and the number of the bubble defects need to be manually estimated, the existing image analysis system cannot identify the bubble defects at the edge of the wafer and can only depend on manual judgment to judge whether the edge bubble defects exist, the labor cost is increased and manual errors exist in the process, and the abnormal (abnormal) conditions of the process or the machine table are difficult to find in time.
Disclosure of Invention
The invention aims to provide an image processing method, an image processing system and a defect detection device, which can improve the existing image analysis process, improve the image processing efficiency and reduce the labor cost.
In order to achieve the above object, in one aspect, the present invention provides an image processing method for processing an original image formed after an optical scanning of a wafer, comprising:
an image segmentation step, namely removing information of a first type interference image in the original image;
an image enhancement step, which is used for carrying out image enhancement on the target defects in the original image;
an image denoising step, namely removing information of a second interference image in the original image;
a defect identification step, wherein the target defects in the original image are identified; and the number of the first and second groups,
and a data storage step of storing information of the target defect.
Optionally, before the image segmentation step, an image edge recognition step is further included, where the edge recognition is performed on the original image to obtain an edge region and a central region in the original image.
Optionally, the wafer includes a bottom layer wafer and a device wafer, and the bottom layer wafer and the device wafer have surfaces that contact and coincide with each other. The target defect is a bubble defect, the first type of interference image comprises a gray edge defect and an edge defect, and the second type of interference image comprises a grain line on the wafer.
Optionally, the image segmentation step utilizes a threshold segmentation algorithm. The image denoising step utilizes a morphological denoising algorithm.
In another aspect, the present invention further provides an image processing system for processing an original image formed after an optical scan of a wafer, the image processing system including an image segmentation unit for removing information of a first type interference image in the original image; the image enhancement unit is used for carrying out image enhancement on the target defect in the original image; the image denoising unit is used for removing information of a second type interference image in the original image, wherein the information of the second type interference image is different from the information of the first type interference image; the defect identification unit is used for identifying target defects in the original image; and a data storage unit for storing information of the target defect.
Optionally, the image processing system further includes an image edge recognition unit, configured to perform edge recognition on the original image to obtain an edge region and a center region of the original image.
In still another aspect, the invention further provides a defect detection apparatus, which includes the image processing system.
Optionally, the defect detecting apparatus further includes a defect scanning module and a data processing and outputting module, wherein the defect scanning module is configured to scan the wafer so as to form the original image; the data processing and output module is used for calling the target defect information in the data storage unit and performing data processing and output.
Compared with the prior art, the image processing method provided by the invention can be used for processing the original image obtained by optically scanning the wafer, removing interference information, emphasizing and identifying the target defect on the wafer and storing the information of the target defect.
Further, before the image segmentation step, edge recognition may be performed on the original image to obtain an edge region and a central region in the original image, and then image processing may be performed on the original image of the edge region and/or the central region to obtain target defect information of the central region and/or the edge region on the wafer, so as to improve the existing image analysis process and obtain the target defect information on the wafer more accurately and comprehensively.
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Fig. 1 is a flowchart illustrating an image processing method according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of an image processing system according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a defect detection apparatus according to an embodiment of the invention.
Description of reference numerals:
1-a defect scanning module; 2-an image processing system; 21-an image edge identification unit; 22-an image segmentation unit; 23-an image enhancement unit; 24-an image denoising unit; 25-a defect identification unit; 26-a data storage unit; 3-a data processing and output module; 31-a data extraction unit; 32-a data output unit; 4-defect detection device.
Detailed Description
The image processing method, the image processing system and the defect detecting apparatus according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. It is to be understood that those skilled in the art can modify the invention described herein while still obtaining the beneficial results of the present invention. Accordingly, the following description is to be construed as broadly as possible to those skilled in the art and not as limiting the invention. It should be noted that the order of the methods or steps described below is not necessarily the only order in which the methods or steps may be performed, and that some of the described steps may be omitted and/or some other steps not described herein may be added to the method. The present invention may be practiced with various integrated circuit fabrication techniques, which are merely those required for an understanding of the present invention.
As described in the background of the invention, in the manufacturing process of a CMOS image sensor, a device wafer having a photosensitive region formed on one surface thereof and a bottom layer wafer having no photosensitive region formed thereon are usually bonded by processes such as edge grinding and CMP. The bonded wafer may have bubble defects, gray edge (chipping) defects or other defects through scanning, the existing image analysis system has errors in analyzing the bubble defects, and the bubble defects at the edge of the wafer cannot be identified, so that many labor hours are needed for analyzing, manual errors may be introduced, and it is difficult to find out the abnormality of a machine on a production line and a process in time, which may cause waste to some affected product batches.
In the image processing method provided by this embodiment, an original image (raw image) obtained by optically scanning a wafer is subjected to image processing to remove interference information and emphasize and identify a target defect on the wafer, so as to obtain and store information of the target defect, and further, by using the image processing method provided by this embodiment, edge identification is performed on the original image, so as to obtain information of the target defect on the wafer, including a central area and an edge area; the image processing system provided by the embodiment comprises a plurality of image processing units, a plurality of image processing units and a plurality of image processing units, wherein the image processing units are respectively used for carrying out image processing on an original image obtained by carrying out optical scanning on a wafer to obtain and store information of target defects in the original image; the defect detecting apparatus provided in this embodiment includes the image processing system, and further includes a defect scanning module that scans a wafer to form an original image, performs image processing on the original image by using the image processing system to obtain information about a target defect, and performs data processing and outputting on the information about the target defect by using a data processing and outputting module, for example, to generate a user-oriented chart. By using the image processing method, the image processing system and the defect detection device provided by the embodiment, the existing image analysis process can be improved, the target defect information on the wafer can be acquired, and the labor cost can be reduced.
Fig. 1 is a flowchart illustrating an image processing method according to an embodiment of the present invention. As shown in fig. 1, the image processing method includes:
s1: an image edge identification step, namely performing edge identification on an original image to obtain an edge area and a central area in the original image;
s2: an image segmentation step, namely removing information of a first type interference image in the original image;
s3: an image enhancement step, which is used for carrying out image enhancement on the target defects in the original image;
s4: an image denoising step, namely removing information of a second interference image in the original image;
s5: a defect identification step, wherein the target defects in the original image are identified; and the number of the first and second groups,
s6: and a data storage step of storing information of the target defect.
Fig. 2 is a schematic structural diagram of an image processing system 2 according to an embodiment of the present invention. The image processing system 2 is configured to perform image processing on an original image obtained after the wafer is optically scanned, and obtain and store information about a target defect. As shown in fig. 2, the image processing system 2 includes:
an image edge recognition unit 21, configured to perform edge recognition on the original image to obtain an edge region and a center region of the original image;
an image segmentation unit 22, configured to remove information of a first type interference image in the original image;
an image enhancement unit 23, configured to perform image enhancement on the target defect in the original image;
an image denoising unit 24, configured to remove information of a second-class interference image in the original image;
a defect identifying unit 25 for identifying a target defect in the original image; and
a data storage unit 26 for storing information of the target defect.
The image processing method and the image processing system in the present embodiment are further described with reference to fig. 1 and fig. 2.
Specifically, the wafer in this embodiment includes a bottom layer wafer and a device wafer, which have surfaces that are in contact with and coincide with each other, and both of which use silicon as a substrate, for manufacturing a CMOS Image Sensor (CIS). Of course, the wafer may be other wafers requiring optical scanning and image processing.
The wafer of this embodiment may have bubble defects due to the combination of the two wafers, and the original image obtained by optically scanning one side of the bottom wafer may contain information of the corresponding bubble defects. Meanwhile, the original image often includes various other interference information, for example, there may be gray edge defect (chipping defect) and edge defect (trim defect) in the edge area of the original image, which may cause the existing image parsing system to be unable to parse the bubble defect of the edge, and there is a line of crystal grains (die) on the original image, because the crystal grains distributed on the silicon cell are usually arranged in the horizontal and vertical directions, scribe lanes (scribe lines) are provided between the crystal grains, and the package process is divided along the scribe lanes to obtain a plurality of chips (for example, CMOS image sensor chips), so that a plurality of horizontal and vertical lines (generated by the scribe lanes) are formed on the original image, and the analysis of the bubble defect by the crystal grains lines may also cause interference. The above description has been made by taking as an example that the target defect is a bubble defect, the first type of interference image includes a gray edge defect and/or an edge defect, and the second type of interference image includes a line of a grain, but it should be understood that the invention is not limited to the description herein.
The original image can be obtained by using the defect scanning module 1 in the defect detecting device 4 (fig. 3), and the defect scanning module 1 is, for example, a scanning table, and optically scans the wafer by a photographing or line scanning manner, so as to obtain the original image of the wafer. Of course, the original image is directly obtained by an external machine with an image scanning function, and the obtained original image is provided to the image processing system 2 for subsequent processing.
The image edge recognition unit 21 is configured to perform the image edge recognition step, perform edge recognition on the original image obtained by scanning, where the edge area is, for example, a surrounding central area, and a boundary between the edge area and the central area may be determined according to an actual product, for example, an edge area of the wafer within 2cm from an edge on the original image may be used. In other embodiments of the present invention, the image edge recognition step may not be performed, and all the regions on the original image may be directly subjected to subsequent image processing.
The image segmentation unit 22 is configured to perform an image segmentation step to remove information of the first type interference image in the original image, and it should be noted that in this embodiment, the image segmentation step may be performed on all regions of the original image, or may be performed on a partial region (for example, an edge region) of the original image.
Specifically, in the embodiment, the threshold segmentation algorithm is used to perform image segmentation processing on the image edge region, and the information of the first type interference image is removed, so as to obtain the information of the target defect in the image edge region. In this embodiment, the first type of interference image includes a gray edge defect and an edge grinding defect in an edge region of the original image, and since a connected region between the gray edge defect and the edge grinding defect is relatively large (i.e., the area is larger than the area of the bubble defect), image information of the gray edge defect and the edge grinding defect can be removed by a threshold segmentation method, and image information of the bubble defect is left. In the threshold segmentation method in this embodiment, the input image f is transformed into the output image g as follows:
wherein T is a threshold value of the area or distance of the gray edge defect and the edge grinding defect (in this embodiment, expressed by the number of pixels in the corresponding area or distance), i and j are coordinates of a certain point on the image edge region, specifically, coordinates of a certain point on the image edge region on a wafer map (wafer map), f (i) represents the area of the i-th connected region on the input image, g (i) represents the gray level value of the image after threshold segmentation, when f (i) is greater than T, g (i) is 1, the gray edge defect and the edge grinding defect having an area larger than that of the bubble defect in the original image are removed in the output image, and when f (i) is less than T, g (i) is 0, and other information having an area smaller than that of the bubble defect in the original image is retained in the output image.
The image enhancement unit 23 is configured to perform an image enhancement step to perform image enhancement on the target defect in the original image, so that the image of the target defect is clearer and is easy to distinguish. In this embodiment, the image enhancement of the target defect in the original image refers to color enhancement of the bubble defect in the central region and the edge region of the image. For example, the image enhancement unit 23 may perform a calculation to enhance the gray level (color) in the bubble defect region according to the difference between the gray level value of the bubble defect and the gray level value outside the bubble defect, so that the image of the bubble defect is clearer. The image enhancement method may utilize various image enhancement techniques of the existing art.
The image denoising unit 24 is configured to perform an image denoising step, remove information of a second type interference image in the original image, where the information of the second type interference image is different from the information of the first type interference image, and perform the image denoising step on the entire region of the original image or on a partial region (e.g., a central region) of the original image. In this embodiment, the second type of interference image includes lines of the grains, and the influence of the lines of the grains can be removed by using a morphological denoising algorithm. The method specifically comprises the steps of selecting a proper structural element and carrying out opening and closing operation on an original image or the original image subjected to image enhancement, so that the horizontal and vertical lineation patterns are removed.
Through the processing of the original image by the image edge identifying unit 21, the image dividing unit 22, the image enhancing unit 23 and the image denoising unit 24, the interference information on the original image is significantly reduced, and the image of the target defect is enhanced.
On the basis, the defect identification unit 25 may be utilized to perform a defect identification step to identify the target defect in the original image, and in this embodiment, the target defect including the central region and the edge region may be specifically identified and marked. In the present embodiment, the defect identifying unit 25 may identify the target defect and mark the size and position information of the target defect at the identified position, for example, the size and position information may specifically include the area to which the bubble defect belongs, the central abscissa of the bubble defect, the central ordinate of the bubble defect, the area of the bubble defect, the maximum diameter and the minimum diameter of the bubble defect, and in another embodiment of the present invention, the bubble defect may be further classified, so as to be easily classified into a large bubble defect and a small bubble defect according to a certain predetermined criterion, but the present invention is not limited to this description.
The image processing system 2 of the present embodiment further includes a data storage unit 26 for executing a data storage step of storing information of the target defect. In another embodiment of the present invention, the data storage unit 26 may also be connected to the defect scanning module 1 (fig. 3) to store the original image.
Fig. 3 is a schematic structural diagram of the defect scanning apparatus 4 according to the embodiment of the invention. As shown in fig. 3, the defect scanning apparatus 4 includes the image processing system 2, and further includes a defect scanning module 1 for optically scanning a wafer to obtain an original image; and a data processing and output module 3, for calling the target defect information in the data storage unit 26, and performing data processing and output.
Specifically, the data processing and output module 3 may perform processing by calling information of the target defect in the data storage unit 26, and output a processing result to a user, where the interface content is, for example, a bubble defect table (or schematic diagram) or a bubble defect trend chart (or trend table). The bubble defect table may include information such as a product lot, a bubble defect number, a bubble defect area, a bubble defect average diameter, a bubble defect maximum diameter, a bubble defect minimum diameter, a bubble defect center abscissa, and a bubble defect center ordinate, for example, and the bubble defect trend graph may be, for example, a bubble defect position distribution trend graph, a bubble defect number distribution trend graph, a bubble defect size distribution trend graph, and the like. The present invention is not limited thereto.
In a preferred embodiment of the present invention, the data processing and outputting module 3 may include a data extracting unit 31 and a data outputting unit 32, the data extracting unit 31 is connected with the data storing unit 26 to extract information of the target defect, and the data outputting unit 32 is connected with the data extracting unit 31 to process the information of the target defect and output the processing result to the user.
It should be noted that the embodiments are described in a progressive manner in this specification, and the structures and methods described later are all different from the structures and methods described earlier, and the same and similar parts may be referred to each other. For the system or the device disclosed by the embodiment, the description is relatively simple because the system or the device corresponds to the method disclosed by the embodiment, and the relevant points can be referred to the method part for description.
The processes and implementations of the methods and/or systems in the above embodiments are generally implemented in a software program, which is executed by a device or apparatus, however, all (or a part of) them may also be implemented in an electronic hardware manner. Whether implemented in software or hardware, the details of which are not repeated in this specification since those skilled in the electronic and software arts can implement them.
The above description is only for the purpose of describing the preferred embodiments of the present invention and is not intended to limit the scope of the claims of the present invention, and any person skilled in the art can make possible the variations and modifications of the technical solutions of the present invention using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention, and therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention belong to the protection scope of the technical solutions of the present invention.
Claims (6)
1. An image processing method for computer processing of an original image formed after optical scanning of a wafer, said wafer comprising an underlying wafer and a device wafer, said underlying wafer and said device wafer having surfaces that contact and coincide with each other, said image processing method comprising:
an image edge identification step, namely performing edge identification on the original image to obtain an edge area and a central area in the original image;
an image segmentation step, namely removing information of a first type of interference image in an edge area in the original image, wherein the first type of interference image comprises a gray edge defect and/or an edging defect;
an image enhancement step of performing image enhancement on target defects distributed in all regions of the original image, wherein the target defects are bubble defects;
an image denoising step, namely removing information of a second interference image in the original image, wherein the information of the second interference image is different from the information of the first interference image, and the second interference image comprises grain lines on the wafer;
a defect identification step, which is used for identifying target defects distributed in all areas of the original image; and the number of the first and second groups,
and a data storage step of storing information of the target defect.
2. The image processing method of claim 1, wherein the image segmentation step utilizes a threshold segmentation algorithm.
3. The image processing method of claim 1, wherein said image denoising step utilizes a morphological denoising algorithm.
4. An image processing system for computer processing of an original image formed after optical scanning of a wafer, said wafer comprising an underlying wafer and a device wafer, said underlying wafer and said device wafer having surfaces that contact and coincide with each other, said image processing system comprising:
the image edge identification unit is used for carrying out edge identification on the original image to obtain an edge area and a central area of the original image;
the image segmentation unit is used for removing information of a first type of interference image in an edge area of the original image, wherein the first type of interference image comprises a gray edge defect and/or an edging defect;
the image enhancement unit is used for carrying out image enhancement on target defects distributed in all areas of the original image, wherein the target defects are bubble defects;
the image denoising unit is used for removing information of a second interference image in the original image, wherein the information of the second interference image is different from the information of the first interference image, and the second interference image comprises grain lines on the wafer;
the defect identification unit is used for identifying target defects distributed in all areas of the original image; and
and the data storage unit is used for storing the information of the target defect.
5. A defect detection apparatus comprising the image processing system of claim 4.
6. The defect detection apparatus of claim 5, wherein the defect detection apparatus further comprises:
a defect scanning module for optically scanning a wafer to form the original image; and
and the data processing and output module is used for calling the target defect information in the data storage unit and carrying out data processing and output.
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| CN108511359A (en) * | 2018-03-30 | 2018-09-07 | 武汉新芯集成电路制造有限公司 | The detection method of wafer defect |
| CN108921866A (en) * | 2018-07-24 | 2018-11-30 | 北京深瞐科技有限公司 | A kind of image processing method and system |
| CN109378279B (en) * | 2018-11-12 | 2020-12-18 | 武汉新芯集成电路制造有限公司 | Wafer detection method and wafer detection system |
| CN111538175B (en) * | 2020-05-21 | 2022-09-27 | 深圳市华星光电半导体显示技术有限公司 | Common defect judgment method and judgment device |
| CN111612781B (en) * | 2020-05-27 | 2023-07-14 | 歌尔光学科技有限公司 | Screen defect detection method and device and head-mounted display equipment |
| CN116929311B (en) * | 2023-09-19 | 2024-02-02 | 中铁第一勘察设计院集团有限公司 | Section deformation monitoring method, device and system for zoom imaging and storage medium |
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