CN107784660A - Image processing method, image processing system and defect detecting device - Google Patents
Image processing method, image processing system and defect detecting device Download PDFInfo
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- G06T7/136—Segmentation; Edge detection involving thresholding
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- G06T5/00—Image enhancement or restoration
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Abstract
The present invention relates to image processing method, image processing system and defect detecting device, the original image (raw image) for wafer formed after optical scanner is handled.Described image processing system includes image border recognition unit, image segmentation unit, image enhancing unit, image denoising unit, image tagged unit and data storage cell, to obtain the positions and dimensions information of target defect such as air blister defect from original image.The defect detecting device includes described image processing system.Pass through image processing method provided by the invention, image processing system and defect detecting device, the cost and error of artificial judgment defect can be reduced, improve image processing efficiency, and technique or the abnormal conditions of board can be timely and effectively determined, help to reduce due to the caused loss of the exception of technique or board.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of image processing method, a kind of image processing system and
A kind of defect detecting device.
Background technology
With the continuous ripe development of semiconductor fabrication, imaging sensor increasingly pooled applications in digital camera,
PC cameras, picture telephone, video conference, intelligent security system, reversing radar of vehicle, game machine and industrial medical treatment etc. are numerous
Field.
Imaging sensor can be divided into CCD (Charge Coupled according to photo-sensitive cell and the difference of light sensitivity principles
Device, charge coupled cell) imaging sensor and CMOS (Complementary Metal Oxide Semiconductor,
Complementary metal-oxide-semiconductor) imaging sensor.Wherein, cmos image sensor belongs to photoelectric component and cmos image
Drive circuit and pixel can be integrated in one by sensor because its manufacture method is compatible with existing method for manufacturing integrated circuit
Rise, also reduce the power consumption of system while simplifying hardware design, cmos image sensor while optical signal is gathered just
Electric signal can be obtained, moreover it is possible to which real time processed images information, reaction speed are fast；Cmos image sensor also has price just simultaneously
Preferably, bandwidth is larger, blur prevention, accesses flexibly and has the advantages of larger fill factor, is increasingly becoming the master of imaging sensor
Stream.
The method of one kind manufacture cmos image sensor (also known as CIS, CMOS Image Sensor) is as follows：By one side shape
Into the device die (device wafer) for having photosensitive region and the bottom wafer (carrierwafer) for not making photosensitive region
After the related process such as edging (wafertrim) and cmp (CMP), by adhesive bonds (bond) one
Rise, form metal lead wire, colored filter, lenticule, metal isolated gate etc. in wafer after bonding afterwards, ultimately formed
Whole cmos image sensor.
But inventor has found, using the above method after being bonded to device die and bottom wafer, through defect
Scanning system detects, and air blister defect (bubble defect) be present in the wafer after bonding.And existing image analysis system pair
There is error, it is necessary to manually estimate the size and number of air blister defect in the parsing of air blister defect, and existing image analysis system
The air blister defect at None- identified wafer of uniting edge, it can only rely on and manually determine whether edge air blister defect be present, the increase of this process
Cost of labor and human error be present, it is also difficult to find technique or exception (abnormal) situation of board in time.
The content of the invention
It is an object of the invention to provide a kind of image processing method, a kind of image processing system and a kind of defects detection dress
Put, conventional images resolving can be improved, improve image processing efficiency, and reduce cost of labor.
To achieve these goals, on the one hand, the invention provides a kind of image processing method, for carrying out light to wafer
The original image formed after scanning is learned to be handled, including：
Image segmentation step, remove the information of the first kind interference figure picture in the original image；
Image enhancement step, image enhaucament is carried out to the target defect in the original image；
Image denoising step, remove the information of the second class interference figure picture in the original image；
Defect recognition step, the target defect in the original image is identified；And
Data storing steps, store the information of the target defect.
Optionally, before image segmentation step, in addition to image border identification step, side is carried out to the original image
Edge identifies, obtains the fringe region in the original image and central area.
Optionally, the wafer includes bottom wafer and device die, and the bottom wafer and device die have mutual
The surface for contacting and overlapping.The target defect is air blister defect, and the first kind interference figure picture includes grey side defect and edging
Defect, the second class interference figure picture include the crystal grain lines in above-mentioned wafer.
Optionally, described image segmentation step make use of Threshold Segmentation Algorithm.Described image denoising step make use of form
Learn Denoising Algorithm.
On the other hand, present invention also offers a kind of image processing system, for being formed after carrying out optical scanner to wafer
Original image handled, described image processing system includes image segmentation unit, for removing in the original image
The information of first kind interference figure picture；Image enhancing unit, for carrying out image enhaucament to the target defect in the original image；
Image denoising unit, for removing the information of the second class interference figure picture in the original image, the second class interference figure picture
Information be different from the first kind interference figure picture information；Defect recognition unit, for the target in the original image
Defect is identified；And data storage cell, for storing the information of the target defect.
Optionally, described image processing system also includes image border recognition unit, for being carried out to the original image
Limb recognition, obtain fringe region and the central area of the original image.
Another further aspect, present invention also offers a kind of defect detecting device, including above-mentioned image processing system.
Optionally, the defect detecting device also includes Defect Scanning module and data processing and output module, wherein, institute
Defect Scanning module is stated to be used to scan the wafer to form the original image；The data processing and output module are used for
Call target defect information in above-mentioned data storage cell, and carry out data processing and output.
Compared with prior art, obtained by image processing method provided by the invention can be to wafer progress optical scanner
Original image is handled, and is removed interference information, is emphasized and identify the target defect in wafer, and preserves the letter of target defect
Breath, the target defect information in wafer can be accurately obtained using image processing method provided by the invention, and without relying on
In artificial estimation and judge target defect, reduce cost of labor.
Further, before image segmentation step, limb recognition can be carried out to the original image, obtains the original
Fringe region and central area in beginning image, then image procossing is carried out to fringe region and/or the original image of central area
To obtain the central area in wafer and/or the target defect information of fringe region, so as to improve conventional images resolving, energy
The enough target defect information more accurately and comprehensively obtained in wafer.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of the image processing method of the embodiment of the present invention.
Fig. 2 is the structural representation of the image processing system of the embodiment of the present invention.
The structural representation of the defects of Fig. 3 is embodiment of the present invention detection means.
Description of reference numerals：
1- Defect Scanning modules；2- image processing systems；21- image borders recognition unit；22- image segmentation units；23-
Image enhancing unit；24- image denoising units；25- defect recognition units；26- data storage cells；3- data processings and output
Module；31- data extracting units；32- data outputting units；4- defect detecting devices.
Embodiment
Image processing method, image processing system and defects detection below in conjunction with the drawings and specific embodiments to the present invention
Device is described in further detail.It should be understood that those skilled in the art can change invention described herein, and it is still real
Existing beneficial effects of the present invention.Therefore, description is appreciated that for the widely known of those skilled in the art, and simultaneously below
Not as limitation of the present invention.It should be noted that the order of methods as described below or step is not necessarily that can perform this
The unique order of a little methods or step, and other steps that the step described in some can be omitted and/or some are not described here
This method can be added to.The present invention can borrow various integrated circuit manufacture process technologies to implement, and only refer to the understanding present invention herein
Required process technique.
As described in background of invention part, in the manufacture craft of cmos image sensor, generally to one side formed with photosensitive
The device die in region is bonded again with being formed without the bottom wafer of photosensitive region by techniques such as edging, CMP.After bonding
Wafer it is scanned there may be including air blister defect, grey side (chipping) defect or other defect, conventional images parsing
There is error, and the air blister defect at None- identified wafer edge in parsing of the system to air blister defect, therefore need to spend many people
Work man-hour is parsed, and may introduce human error, and is difficult to find the exception of board and technique in producing line in time,
Waste is likely to result in some impacted product batches.
The image processing method that the present embodiment provides, by carrying out the original image (raw obtained by optical scanner to wafer
Image image procossing) is carried out, interference information is removed, emphasizes and identify the target defect in wafer, so as to obtain target defect
Information simultaneously preserves, and further, the image processing method provided using the present embodiment, edge knowledge is carried out to the original image
Not, can obtain includes the target defect information of central area and fringe region in wafer；At the image that the present embodiment provides
Reason system includes several graphics processing units, is respectively used to carry out figure to the original image that wafer is carried out obtained by optical scanner
As processing, information and the preservation of target defect in the original image are obtained；The defects of the present embodiment provides detection means bag
Described image processing system is included, further, the defect detecting device may also include a Defect Scanning module and one wafer is entered
Row scanning forms original image, and the information of acquisition target defect after image procossing is carried out followed by described image processing system,
And data processing and output are carried out to the information of the target defect using data processing and output module, such as generate towards with
The chart at family.Image processing method, image processing system and the defect detecting device provided using the present embodiment, it can improve existing
There is image analysis process, obtain the target defect information in wafer, reduce cost of labor.
Fig. 1 is the schematic flow sheet of the image processing method of the embodiment of the present invention.As shown in figure 1, described image processing side
Method includes：
S1：Image border identification step, limb recognition is carried out to original image, obtains the marginal zone in the original image
Domain and central area；
S2：Image segmentation step, remove the information of the first kind interference figure picture in the original image；
S3：Image enhancement step, image enhaucament is carried out to the target defect in the original image；
S4：Image denoising step, remove the information of the second class interference figure picture in the original image；
S5：Defect recognition step, the target defect in the original image is identified；And
S6：Data storing steps, store the information of the target defect.
Fig. 2 is the structural representation of the image processing system 2 of the embodiment of the present invention.Described image processing system 2 be used for pair
Original image obtained by after wafer progress optical scanner carries out image procossing, obtains information and the preservation of target defect.Such as Fig. 2
Shown, described image processing system 2 includes：
Image border recognition unit 21, for carrying out limb recognition to the original image, obtain the original image
Fringe region and central area；
Image segmentation unit 22, for removing the information of the first kind interference figure picture in the original image；
Image enhancing unit 23, for carrying out image enhaucament to the target defect in the original image；
Image denoising unit 24, for removing the information of the second class interference figure picture in the original image；
Defect recognition unit 25, for the target defect in the original image to be identified；And
Data storage cell 26, for storing the information of the target defect.
The image processing method in the present embodiment and image processing system are described further with reference to Fig. 1 and Fig. 2.
Specifically, wafer described in the present embodiment includes bottom wafer and device die, is passed for manufacturing cmos image
Sensor (CIS), the bottom wafer and device die have the surface for contacting with each other and overlapping, and the bottom wafer and device are brilliant
Member is using silicon as substrate.Certainly, the wafer can also be the wafer that other need to carry out optical scanner and image procossing.
The wafer of the present embodiment, due to the combination that it is two panels wafer, it is understood that there may be air blister defect, also, to bottom
Wafer side can be included on the original image that optical scanner obtains the information of corresponding air blister defect.Meanwhile original image
It is upper to include various other interference informations toward contact, such as may have grey side defect in the especially fringe region of original image
(chipping defect) and edging defect (trim defect) etc. cause conventional images resolution system can not parse edge
Air blister defect, moreover, on the original image also have crystal grain (die) lines, why lines be present, be because silicon crystal unit on
Multiple crystal grain of distribution are usually transverse and longitudinal arrangement, and dicing lane (scribe line) is provided between crystal grain, and edge is drawn in encapsulation process
Film channel is split, and so as to obtain multiple chips (being, for example, cmos image sensor chip), thus is formed on the original image
Numerous vertical and horizontal lines (as caused by dicing lane), these parsings of crystal grain lines to air blister defect will also result in interference.Above is
It is that air blister defect, first kind interference figure picture include grey side defect and/or edging defect, the second class interference figure picture bag with target defect
Include the introduction carried out exemplified by the lines of crystal grain, it should be appreciated that the invention is not limited in be described herein as.
Above-mentioned original image can utilize the defects of defect detecting device 4 (Fig. 3) scan module 1 to obtain, Defect Scanning
Module 1 is, for example, one scan board, and optical scanner is carried out to wafer by way of photo taking type or line scanning, so as to
To the original image of wafer.Certainly, above-mentioned original image directly utilizes the board with image scanning function of outside to obtain, and obtains
It is supplied to image processing system 2 to carry out subsequent treatment after to original image.
Described image limb recognition unit 21 be used for perform described image limb recognition step, to it is scanned obtain it is original
Image carries out limb recognition, and the fringe region is, for example, to surround central area, and the border of fringe region and central area can be with
Determined according to actual product, for example, can using on original image away from the fringe region within edge 2cm as the wafer.In this hair
In bright other embodiment, directly all areas on original image can also be entered without described image limb recognition step
The processing of row successive image.
Described image cutting unit 22 is used to perform image segmentation step, removes the first kind interference in the original image
For the information of image, it is necessary to illustrate, the Zone Full that original image can be both directed in the present embodiment performs image segmentation step
Rapid or for original image subregion (being, for example, fringe region) performs image segmentation step.
Specifically, the present embodiment make use of Threshold Segmentation Algorithm to carry out image dividing processing to above-mentioned image border region,
The information of first kind interference figure picture is removed, so as to obtain the information of the target defect in image border region.First in the present embodiment
Class interference figure picture includes grey the side defect and edging defect of fringe region in original image, due to grey side defect and edging defect
Connected region is bigger (i.e. area is big compared with air blister defect), and their image information can be removed by threshold segmentation method, is stayed
The image information of bubble defect.Threshold segmentation method in the present embodiment, input picture f to output image g conversion are as follows：
Wherein, T be grey side defect and edging defect area or distance threshold value (in the present embodiment with corresponding area or away from
Represented from interior pixel count), i and the coordinate that j is the certain point on the region of image border, refer specifically on the region of image border
Coordinate of the certain point on wafer chart (wafermap), f (i) represents the area of i-th of connected region on input picture, g
(i) image intensity value after Threshold segmentation is represented, when f (i) is more than T, g (i) is 1, and area is compared with gas in original image
Bubble defect big grey side defect and edging defect are removed in the output image, and when f (i) is less than T, g (i) is 0, original graph
Area retains in the output image less than the other information of air blister defect as in.
Described image enhancement unit 23 is used to perform image enhancement step, and the target defect in the original image is carried out
Image enhaucament, so that the image of target defect is relatively sharp, so as to easily differentiate.To in the original image in the present embodiment
Target defect carries out image enhaucament and refers to carrying out color enhancement to the central area of image and the air blister defect of fringe region.
For example, image enhancing unit 23 can be counted according to the difference of the gray value outside the gray value and air blister defect of air blister defect
Calculate so as to strengthen the gray scale (color) in air blister defect region so that the image of air blister defect is relatively sharp.Image enchancing method
The various image enhancement techniques in current technology can be utilized.
Described image denoising unit 24 is used to perform image denoising step, removes the second class interference in the original image
The information of image, the information of the second class interference figure picture is different from the information of first kind interference figure picture, and, it can both be directed to
The Zone Full of original image performs image denoising step or (is, for example, center for the subregion of original image
Region) perform image denoising step.The second class interference figure picture includes the lines of crystal grain in the present embodiment, specifically using morphology
Denoising Algorithm, remove the influence of crystal grain lines.Specifically include and choose suitable structural element and to original image or by scheming
Computing is opened and closed in original image after image intensifying so that vertical and horizontal scribe line pattern removes.
By above-mentioned image border recognition unit 21, image segmentation unit 22, image enhancing unit 23, image denoising unit
The processing of 24 pairs of original images, the interference information on original image has obtained significant reduction, and the image of target defect obtains
Enhancing is arrived.
On this basis, defect recognition step is performed using defect recognition unit 25, to the mesh in the original image
Mark defect is identified, and the target defect including central area and fringe region can be specifically identified and be marked in the present embodiment
Note.Defect recognition unit 25 can identify target defect in the present embodiment, and mark the chi of the target defect at institute's identification
Very little and positional information, such as specifically may include in air blister defect affiliated area, the center abscissa of air blister defect, air blister defect
Heart ordinate, the area of air blister defect, the maximum gauge of air blister defect, minimum diameter etc., in another embodiment of the invention,
Air blister defect can also be classified, beneficial to according to a certain preassigned, air blister defect is divided into air pocket defect and stingy
Defect is steeped, but the present invention is not limited to this description.
The image processing system 2 of the present embodiment also includes a data storage cell 26, for performing data storing steps, deposits
Store up the information of the target defect.In an alternative embodiment of the invention, data storage cell 26 also can be with Defect Scanning module 1
(Fig. 3) is connected to store the original image.
The structural representation of the defects of Fig. 3 is embodiment of the present invention scanning means 4.As shown in figure 3, the Defect Scanning dress
Putting 4 includes described image processing system 2, further, in addition to Defect Scanning module 1, for carrying out optical scanner to wafer
To obtain original image；And data processing and output module 3, for calling the target in above-mentioned data storage cell 26 to lack
Information is fallen into, and carries out data processing and output.
Specifically, the data processing and output module 3 can be by calling the target defect in data storage cell 26
Information, handled and to user export result, interface content is, for example, air blister defect table (or schematic diagram) or bubble
Defect tendency chart (or Trends Sheet) etc..The air blister defect table for example may include product batches, air blister defect numbering, air blister defect
Area, air blister defect average diameter, air blister defect maximum gauge, air blister defect minimum diameter, air blister defect center abscissa with
And the information such as air blister defect center ordinate, the air blister defect tendency chart are, for example, air blister defect position distribution tendency chart, gas
Steep defects count distribution trend figure, air blister defect Size Distribution tendency chart etc..The invention is not restricted to this.
In a preferred embodiment of the invention, data processing and output module 3 may include data extracting unit 31 and data
Output unit 32, data extracting unit 31 are connected with data storage cell 26, to extract the information of target defect, and data output
Unit 32 is connected with data extracting unit 31, is handled with the information to target defect and exports result to user.
It should be noted that embodiment is described by the way of progressive in this specification, in the structures and methods of rear description
What is stressed is all the difference with the structures and methods in preceding description, and the identical and similarity between various pieces is mutual
Mutually referring to.For system disclosed in embodiment or device, due to corresponding to the method disclosed in Example, so retouching
That states is fairly simple, and related part is referring to method part illustration.
The processing of method and/or system in above-described embodiment, perform, the adapting device usually in a manner of software program
Or equipment is implemented, however, they all (or a portion) can also be implemented using the mode of electronic hardware.Either
With software or hardware mode, its particular is familiar with electronics, software field personnel can be implemented, and therefore, its is thin
Section does not just repeat in this manual.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of interest field of the present invention,
Any those skilled in the art without departing from the spirit and scope of the present invention, may be by the methods and techniques of the disclosure above
Content makes possible variation and modification to technical solution of the present invention, therefore, every content without departing from technical solution of the present invention,
Any simple modifications, equivalents, and modifications that technical spirit according to the present invention is made to above example, belong to this hair
The protection domain of bright technical scheme.
Claims (10)
1. a kind of image processing method, the original image for wafer formed after optical scanner is handled, its feature
It is, including：
Image segmentation step, remove the information of the first kind interference figure picture in the original image；
Image enhancement step, image enhaucament is carried out to the target defect in the original image；
Image denoising step, remove the information of the second class interference figure picture in the original image, the second class interference figure picture
Information be different from the first kind interference figure picture information；
Defect recognition step, the target defect in the original image is identified；And
Data storing steps, store the information of the target defect.
2. image processing method as claimed in claim 1, it is characterised in that before image segmentation step, in addition to：
Image border identification step, limb recognition is carried out to the original image, obtains the fringe region in the original image
And central area.
3. image processing method as claimed in claim 1, it is characterised in that the wafer includes bottom wafer and device is brilliant
Member, the bottom wafer and the device die have the surface for contacting with each other and overlapping.
4. such as image processing method according to any one of claims 1 to 3, it is characterised in that the target defect is bubble
Defect, the first kind interference figure picture include grey side defect and/or edging defect, and the second class interference figure picture includes the crystalline substance
Crystal grain lines in member.
5. such as image processing method according to any one of claims 1 to 3, it is characterised in that described image segmentation step profit
With Threshold Segmentation Algorithm.
6. such as image processing method according to any one of claims 1 to 3, it is characterised in that described image denoising step profit
With morphology Denoising Algorithm.
7. a kind of image processing system, the original image for wafer formed after optical scanner is handled, its feature
It is, described image processing system includes：
Image segmentation unit, for removing the information of the first kind interference figure picture in the original image；
Image enhancing unit, for carrying out image enhaucament to the target defect in the original image；
Image denoising unit, for removing the information of the second class interference figure picture in the original image, the second class interference
The information of image is different from the information of the first kind interference figure picture；
Defect recognition unit, for the target defect in the original image to be identified；And
Data storage cell, for storing the information of the target defect.
8. image processing system as claimed in claim 7, it is characterised in that also include：
Image border recognition unit, for carrying out limb recognition to the original image, obtain the marginal zone of the original image
Domain and central area.
9. a kind of defect detecting device, it is characterised in that including image processing system as claimed in claim 7 or 8.
10. defect detecting device as claimed in claim 9, it is characterised in that the defect detecting device also includes：
Defect Scanning module, for carrying out optical scanner to wafer to form the original image；And
Data processing and output module, for calling the target defect information in the data storage cell, and carry out at data
Reason and output.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511359A (en) * | 2018-03-30 | 2018-09-07 | 武汉新芯集成电路制造有限公司 | The detection method of wafer defect |
| CN108921866A (en) * | 2018-07-24 | 2018-11-30 | 北京深瞐科技有限公司 | A kind of image processing method and system |
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| CN108511359A (en) * | 2018-03-30 | 2018-09-07 | 武汉新芯集成电路制造有限公司 | The detection method of wafer defect |
| CN108921866A (en) * | 2018-07-24 | 2018-11-30 | 北京深瞐科技有限公司 | A kind of image processing method and system |
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| CN111612781A (en) * | 2020-05-27 | 2020-09-01 | 歌尔股份有限公司 | Screen defect detection method and device and head-mounted display equipment |
| CN116929311A (en) * | 2023-09-19 | 2023-10-24 | 中铁第一勘察设计院集团有限公司 | Section deformation monitoring method, device and system for zoom imaging and storage medium |
| CN116929311B (en) * | 2023-09-19 | 2024-02-02 | 中铁第一勘察设计院集团有限公司 | Section deformation monitoring method, device and system for zoom imaging and storage medium |
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