CN111538175A - Common defect judgment method and judgment device - Google Patents
Common defect judgment method and judgment device Download PDFInfo
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- CN111538175A CN111538175A CN202010437253.0A CN202010437253A CN111538175A CN 111538175 A CN111538175 A CN 111538175A CN 202010437253 A CN202010437253 A CN 202010437253A CN 111538175 A CN111538175 A CN 111538175A
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Abstract
The application discloses a common defect judgment method and a common defect judgment device, wherein the common defect judgment method comprises the following steps: the method has the advantages of high common defect identification accuracy and quickness, and effectively avoids the phenomenon of false alarm, so that the productivity of the production line is improved, and the labor is saved. The judging device comprises an identification unit, a storage unit and a processing unit, wherein the identification unit, the storage unit and the processing unit are in communication connection. The judging device adopts the common defect judging method to monitor the quality of the production process of the liquid crystal display panel, intercept and judge the common defects in time and improve the yield and the production efficiency of products.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to quality monitoring in a manufacturing process of a liquid crystal display panel, and more particularly, to a method and an apparatus for determining a common defect.
Background
In the manufacturing process of the liquid crystal display panel, in order to monitor the abnormal condition of the production line in real time, an automatic optical detection technology is usually introduced to intercept and judge the defects in the manufacturing process of the display panel in real time, so that the waste of resources caused by abnormal rear flow is avoided, and the yield of products is improved.
The existing automatic optical detection technology for monitoring the production of the liquid crystal display panel has the advantages of rapidness, high efficiency and labor saving, but has certain limitation on the detection of common defects. The common defect refers to: the same type of defects occur at the same position of different substrates in the same liquid crystal display panel product; alternatively, in different liquid crystal display panel products that are continuously produced, the same type of defects occur at the same position of the different products. The existing automatic optical detection technology can generate a false alarm phenomenon when detecting the common defects, and once the common defects occur, the production line needs to be stopped immediately to detect the reasons of the common defects, so that when the common defects are false, the production capacity of the production line can be greatly wasted, and the production efficiency is reduced.
Disclosure of Invention
The embodiment of the application provides a common defect judgment method and a common defect judgment device, which can be used for quality monitoring of a liquid crystal display panel production line, improve the identification accuracy of common defects and effectively avoid the phenomenon of false report.
On one hand, the embodiment of the application provides a method for determining a common defect, which includes the following steps:
providing a plurality of plate bodies to be detected, and identifying defects on each plate body;
matching every two defects on different plate bodies into defect pairs for position difference comparison so as to ensure that any two defects on different plate bodies can be compared and judging whether the position difference of each defect pair meets the preset position difference requirement or not;
if the position difference of none defect pair meets the preset position difference requirement, judging that common defects do not occur among the plate bodies;
if the position difference of the defect pair meets the preset position difference requirement, comparing the gray level and the form of two defects in the corresponding defect pair;
for the defect pairs with the position difference meeting the preset position difference requirement, if the gray level difference value meets the preset gray level difference requirement and the form difference value meets the preset form difference requirement, the common defects among the plate bodies are judged.
In some embodiments, the providing a plurality of boards to be detected and identifying defects on each board, wherein the identifying defects on each board includes the following steps:
scanning and photographing the surface to be detected on each plate body to obtain a detection image of each plate body;
and identifying the detection image to detect the defects on each plate body.
In some embodiments, the identifying the defect on each board further comprises: and acquiring data information of each defect after the defect on each plate body is detected.
In some embodiments, the acquiring data information of each defect includes: the gray value of each defect is acquired.
In some embodiments, the acquiring data information of each defect further includes: acquiring the position and form information of each defect, comprising the following steps:
establishing a rectangular coordinate system by taking two adjacent edges of each plate body as an X axis and a Y axis respectively, wherein the X axis and the Y axis of each plate body correspond to each other;
acquiring coordinates of each defect on the corresponding plate body;
and acquiring the length of each defect in the X-axis direction, the width of each defect in the Y-axis direction and the area size of each defect according to the coordinates of each defect.
In some embodiments, the determining whether the position difference of each defect pair meets a preset position difference requirement includes the following steps:
calculating a position difference value between two corresponding defects according to the coordinate values of the two defects in the defect pair;
comparing the position difference value of the defect pair with a preset distance value Dis;
and judging whether the position difference between the defect pairs meets the preset position difference requirement or not if the position difference value of the defect pairs is in the range of [0, Dis ] according to the comparison result.
In some embodiments, if the position difference of the defect pair meets the preset position difference requirement, the gray scale and shape comparison of the two defects in the corresponding defect pair is performed, including the following steps:
presetting a gray level difference value Dg, a length difference value Dx in the X-axis direction, a width difference value Dy in the Y-axis direction and an area difference value Ds;
calculating gray difference values of two defects in the corresponding defect pair, length difference values in the X-axis direction, width difference values in the Y-axis direction and area difference values;
comparing the gray level difference value, the length difference value in the X-axis direction, the width difference value in the Y-axis direction and the difference value of the area size with Dg, Dx, Dy and Ds respectively.
In some embodiments, for a defect pair whose position difference satisfies a preset position difference requirement, if the gray level difference value satisfies the preset gray level difference requirement and the form difference value satisfies the preset form difference requirement, it is determined that a common defect occurs between the plate bodies, specifically: for the defect pairs with the position difference meeting the preset position difference requirement, the gray level difference value is in the range of [0, Dg ], the length difference value in the X-axis direction is in the range of [0, Dx ], the width difference value in the Y-axis direction is in the range of [0, Dy ], and the area difference value is in the range of [0, Ds ], and the common defects among the plate bodies are judged.
On the other hand, the embodiment of the application provides a common defect judgment device, which can intercept and judge common defects generated in the production process of a display panel in real time by adopting the common defect judgment method disclosed in the previous aspect. The common defect determination device includes:
the identification unit is used for identifying the defects on each plate body and transmitting the data of each defect to the storage unit;
a storage unit for storing data information generated in the entire common defect determination process;
the processing unit is used for collecting data of each defect from the storage unit, comparing the data of each defect and judging whether the plurality of defects are common defects or not;
the identification unit, the storage unit and the processing unit are in communication connection.
In some embodiments, the common defect determining apparatus further includes an alarm unit in communication with the processing unit, and when the processing unit determines that a plurality of defects are common defects, the alarm unit is triggered to send out an alarm signal.
The common defect judgment method provided by the embodiment of the application comprises the following steps: the method has the advantages of high common defect identification accuracy and quickness, and effectively avoids the phenomenon of false alarm, so that the productivity of the production line is improved, and the labor is saved. The common defect judgment device provided by the embodiment of the application adopts the common defect judgment method to monitor the quality of the production process of the liquid crystal display panel, intercepts and judges the common defects in time, and improves the yield and the production efficiency of products.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic flow chart of a common defect determination method in an embodiment of the present application.
Fig. 2 is a schematic view of a surface to be detected of a liquid crystal display panel in example 1 of the present application.
Fig. 3 is a schematic view of a surface to be detected of an lcd panel in example 2 of the present application.
Fig. 4 is a schematic view of a surface to be detected of an lcd panel in example 3 of the present application.
Fig. 5 is a schematic view of surfaces to be detected of different liquid crystal display panel products of example 4 of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Specifically, the embodiment of the application provides a common defect determination method, which can be applied to quality monitoring of a liquid crystal display panel production line and timely eliminating abnormal conditions in the manufacturing process of a liquid crystal display panel, and is particularly suitable for determination and warning of common defects.
It should be noted that, the common defects refer to: the same type of defects occur at the same position of different substrates in the same liquid crystal display panel product; or, in different liquid crystal display panel products which are continuously produced, the same type of defects occur at the same position of different products.
Referring to fig. 1, the method for determining a common defect includes the following steps:
s1, providing a plurality of plate bodies to be detected, and identifying defects on each plate body;
s2, matching every two defects on different plate bodies into defect pairs for position difference comparison so as to ensure that any two defects on different plate bodies can be compared and judge whether the position difference of each defect pair meets the preset position difference requirement;
s3, if the position difference of any defect pair meets the preset position difference requirement, judging that common defects do not occur among the plate bodies;
s4, if the position difference of the defect pair meets the preset position difference requirement, comparing the gray level and the form of the two defects in the corresponding defect pair;
and S5, judging that the common defects occur among the plate bodies if the gray difference value meets the preset gray difference requirement and the form difference value meets the preset form difference requirement for the defect pairs with the position difference meeting the preset position difference requirement.
In some embodiments, the step S1 specifically includes the following steps:
s1.1, scanning and photographing the surface to be detected on each plate body to obtain a detection image of each plate body;
s1.2, identifying the detection image to detect the defects on each plate body;
s1.3, acquiring data information of each defect after the defect on each plate body is detected.
In step S1.1, the surfaces to be detected on each board may be scanned and photographed by using an automatic optical inspection apparatus, so as to obtain an inspection image of the surface to be inspected on each board.
And S1.2, detecting the defects of each plate body by utilizing a pattern recognition technology, wherein the adopted pattern recognition technology can be the prior art. Because the gray scale value of the defective pixel point is obviously different from the set gray scale value range, the defective pixel points in a certain range are connected to form a defect part, therefore, the pixel points on the board body are distinguished by adopting a five-point comparison method, the defective pixel points on each board body are determined, and the defect part formed by the connection of the defective pixel points in the certain range is identified by utilizing a pattern recognition technology.
The operation flow of the five-point comparison method is as follows: taking five pixel points on the board, and calculating the gray scale average value a of the five pixel points; acquiring a gray-scale value b of a measurement pixel point, and acquiring a difference value c through b-a; the sum of the gray scale central value and c is obtained to obtain the gray scale logic value d of the measurement pixel point; and d is compared with a set gray-scale value range, and whether the measured pixel point is a bad pixel point is judged according to the result. The five pixel points may be randomly selected, or have a specific positional relationship, for example: after the first pixel point is randomly selected, one pixel point is respectively selected in the vertical and horizontal directions of the first pixel point, so that the gray scale value of the selected pixel point is more representative, and the detection result is more accurate.
In some embodiments, for step S1.3, the data information of the respective defects includes: position information, gray scale value and morphology information of the defect. Acquiring the position and form information of each defect, comprising the following steps:
s1.31, establishing a rectangular coordinate system by taking two adjacent edges of each plate body as an X axis and a Y axis respectively, wherein the X axis and the Y axis of each plate body correspond to each other so as to ensure the correctness of the comparison of the defect positions on each plate;
s1.32, acquiring coordinates of each defect on a corresponding plate body;
s1.33, acquiring the length of each defect in the X-axis direction, the width of each defect in the Y-axis direction and the area size of each defect according to the coordinate of each defect.
In some embodiments, for step S2, the determining whether the position difference of each defect pair meets the preset position difference requirement specifically includes the following steps:
s2.1, calculating a position difference value according to a formula { (Xm-Xn) × 2+ (Ym-Yn) × 2} according to coordinate values of two defects in the defect pair, wherein Xm and Ym are respectively an abscissa value and an ordinate value of one defect in the defect pair, and Xn and Yn are respectively an abscissa value and an ordinate value of the other defect in the defect pair;
s2.2, comparing the position difference value of the defect pair with a preset distance value Dis;
s2.3, judging whether the position difference between the defect pairs meets the preset position difference requirement or not according to the comparison result that the position difference value of the defect pairs is within the range of [0, Dis ]
It should be noted that, in step S2, the defects on the same board do not need to be matched for position difference comparison, and any two defects on different boards need to be matched for position difference comparison, so as to ensure the completeness of comparison. The positional differences between the respective pairs of defects may be performed simultaneously or sequentially.
In some embodiments, for step S4, the alignment of the morphology includes an alignment of length in the X-axis direction, width in the Y-axis direction, and area size. If the position difference of the defect pair meets the preset position difference requirement, comparing the gray level and the form of two defects in the corresponding defect pair, comprising the following steps of:
s4.1, presetting a gray level difference value Dg, a length difference value Dx in the X-axis direction, a width difference value Dy in the Y-axis direction and a difference value Ds of the area size;
s4.2, calculating gray difference values of two defects in the corresponding defect pair, length difference values in the X-axis direction, width difference values in the Y-axis direction and area difference values;
and S4.3, comparing the gray level difference value, the length difference value in the X-axis direction, the width difference value in the Y-axis direction and the difference value of the area size obtained through calculation with Dg, Dx, Dy and Ds respectively.
Comparing the gray level difference and the form difference according to the steps S3.1-S3.3 for any defect pair with the position difference meeting the preset position difference requirement.
Based on the step S4, the step S5 specifically includes: for the defect pairs with the position difference meeting the preset position difference requirement, the gray level difference value is in the range of [0, Dg ], the length difference value in the X-axis direction is in the range of [0, Dx ], the width difference value in the Y-axis direction is in the range of [0, Dy ], and the area difference value is in the range of [0, Ds ], and the common defects among the plate bodies are judged. Namely: any one of the position difference, the gray level difference and the form difference needs to meet the preset requirement, otherwise, the common defect cannot be judged to occur.
Example 1, referring to fig. 2, fig. 1 is a schematic diagram of a surface to be detected of a liquid crystal display panel, wherein six substrates are disposed on the liquid crystal display panel. The six substrates are arranged in two rows, and each row is provided with three substrates; the first row is sequentially a first substrate, a second substrate and a third substrate from left to right; the first row is sequentially a fourth substrate, a fifth substrate and a sixth substrate from left to right. In the production process of the liquid crystal display panel, whether the six substrates have common defects needs to be monitored in real time. The common defect determination method of this example is specifically described below.
S1, identifying the defects on the six substrates to be detected, comprising the following steps:
s1.1, scanning and photographing the surfaces of six substrates to be detected to obtain detection images of the substrates;
s1.2, identifying the detection images of the substrates to detect the defects on the substrates, wherein the first substrate has the A defect, the second substrate has the B defect, the third substrate, the fourth substrate and the fifth substrate have no defects, and the sixth substrate has the C defect;
s1.3, after the defects on each plate body are detected, acquiring data information of the defects A, B and C, wherein the data information comprises gray information, position information and form information, the gray information of each defect is acquired by utilizing a pattern recognition technology, and the position information and the form information of each defect are specifically acquired as follows:
s1.31, respectively establishing a rectangular coordinate system for the first substrate, the second substrate and the sixth substrate by taking two adjacent sides as an X axis and a Y axis, wherein the X axis and the Y axis of the first substrate, the second substrate and the sixth substrate are corresponding to each other and take the intersection point of the extension lines of the two adjacent sides as an origin (positioned at the lower left corner of the corresponding substrate);
s1.32, obtaining the coordinate of the A defect as (X)A，YA) The coordinates of the B defect are (X)B，YB) And coordinates of C defects (X)C，YC)；
S1.33, and then calculating the length of each defect in the X-axis direction, the width of each defect in the Y-axis direction and the area size according to the coordinates of each defect.
S2, matching the A defect, the B defect and the C defect pairwise to form defect pairs for position difference comparison, wherein the A defect and the B defect are a first defect pair, the A defect and the C defect are a second defect pair, and the B defect and the C defect are a third defect pair, and judging whether the position difference of each defect pair meets the preset position difference requirement.
For step S2, if the coordinates of the a, B, and C defects at least satisfy any one of the following equations (1), (2), and (3), it indicates that a common defect may occur between six substrates, and the comparison of the gray scale and morphological differences needs to be performed in the next step; if the coordinates of the a, B, and C defects do not satisfy equations (1), (2), and (3), it is determined that no common defect has occurred among the six substrates, and the determination is terminated. Wherein Dis is a preset distance value:
{(XA-XB)×2+(YA-YB)×2}×0.5＜Dis (1)
{(XA-XC)×2+(YA-Yc)×2}×0.5＜Dis (2)
{(XC-XB)×2+(YC-YB)×2}×0.5＜Dis (3)
in this example 1, since the coordinates of the a defect, the B defect, and the C defect do not satisfy equations (1), (2), and (3), and the common defect cannot occur, the process proceeds to step S3, and if the position difference of none of the defect pairs satisfies the predetermined position difference requirement, it is determined that the common defect does not occur between the six substrates.
Example 2, referring to fig. 3, the difference between the surface to be inspected of the liquid crystal display panel of this example and example 1 is: the coordinates of the B defect and the C defect on the corresponding substrates are different. The specific processes of steps S1 and S2 are as described in example 1, and are not described herein again.
In step S2, in this example 2, the coordinates of the a defect and the B defect satisfy expression (1), and expressions (2), (3), (4), and (5) do not hold, indicating that there is a possibility that a common defect occurs between the six substrates. Therefore, the process proceeds to step S4, where a defect and B defect in the first defect pair are subjected to a gradation-to-pattern comparison, which includes a comparison of the length in the X-axis direction, the width in the Y-axis direction, and the area size. The method specifically comprises the following steps:
s4.1, presetting a gray level difference value Dg, a length difference value Dx in the X-axis direction, a width difference value Dy in the Y-axis direction and a difference value Ds of the area size;
s4.2, calculating gray difference values between the A defects and the B defects, length difference values in the X-axis direction, width difference values in the Y-axis direction and area difference values;
s4.3, comparing the gray difference value between the A defect and the B defect, the length difference value in the X-axis direction, the width difference value in the Y-axis direction and the area difference value with the Dg, Dx, Dy and Ds respectively.
Then, in step S5, according to the comparison result, the a defect and the B defect of the first defect pair meet the requirement of position difference, the requirement of gray level difference, and the requirement of morphology difference, that is: the position difference value between the A defect and the B defect is in the range of [0, Dis ], the gray level difference value between the A defect and the B defect is in the range of [0, Dg ], the length difference value between the A defect and the B defect in the X-axis direction is in the range of [0, Dx ], the width difference value between the A defect and the B defect in the Y-axis direction is in the range of [0, Dy ], the area difference value between the A defect and the B defect is in the range of [0, Ds ], common defects of the six substrates are judged, common defect alarming can be carried out in a detection process in the production of the liquid crystal display panel, operators can find defect problems in time, resource waste caused by defect rear flow is avoided, and the yield of products is improved.
Example 3, referring to fig. 4, the difference between the surface to be inspected of the liquid crystal display panel of this example and example 2 is: the B defects have different defect morphologies. The specific processes of steps S1, S2 and S4 are as described in examples 1 and 2, and are not described herein again.
In step S5, according to the comparison result, the a defect and the B defect of the first defect pair meet the position difference requirement, but the a defect and the B defect do not meet the shape difference requirement, the a defect is in the form of a multi-thorn shape, the B defect is in the form of a four-pointed star shape, and the length difference value, the width difference value, and the area difference value of the a defect and the B defect in the X-axis direction and the Y-axis direction cannot all meet the preset difference requirement, it is determined that the six substrates do not have a common defect, and in the detection process in the liquid crystal display panel production, a common defect alarm does not occur, thereby avoiding the occurrence of a false alarm phenomenon, and thus improving the productivity of the production line.
Example 4, referring to fig. 5, in this example, it is determined whether the surfaces to be detected of different products have a common defect, there are four products in total, there are two rows, each row is provided with two products, the first row is a first product and a second product from left to right, and the second row is a third product and a fourth product from left to right. The common defect determination method of this example is specifically described below.
S1, identifying defects on four products to be detected, comprising the following steps:
s1.1, scanning and photographing the surfaces of four products to be detected to obtain detection images of the products;
s1.2, identifying the detection images of the products to detect defects on four products, wherein the first product has A1 defects and B1 defects, the second product is free of defects, the third product has A2 defects, and the fourth product has A3 defects;
s1.3, acquiring data information of the A1 defect, the A2 defect, the A3 defect and the B1 defect, wherein the data information comprises gray scale information, position information and form information, the gray scale information of each defect is acquired by utilizing a pattern recognition technology, and the position information and the form information of each defect are specifically:
s1.31, respectively establishing a rectangular coordinate system for the first product, the third product and the fourth product by taking two adjacent edges as an X axis and a Y axis, wherein the X axis and the Y axis in the rectangular coordinate system of the first product, the third product and the fourth product correspond to each other and take the vertex of the lower left corner of the detection surface as an origin;
s1.32, obtaining the coordinate of the A1 defect as (X)A1，YA1) The coordinate of the A2 defect is (X)A2，YA2) The coordinate of the A3 defect is (X)A3，YA3) And the coordinates of the B1 defect are (X)B1，YB1)；
S1.33, and then calculating the length of each defect in the X-axis direction, the width of each defect in the Y-axis direction and the area size according to the coordinates of each defect.
S2, matching A1 defect, A2 defect, A3 defect and B1 defect into defect pairs in pairs for position difference comparison, wherein A1 defect and A2 defect are first defect pairs, A1 defect and A3 defect are second defect pairs, B1 defect and A2 defect are third defect pairs, B1 defect and A3 defect are fourth defect pairs, A2 defect and A3 defect are fifth defect pairs, and judging whether the position difference of each defect pair meets the preset position difference requirement.
With respect to step S2, it is determined whether the coordinates of the a1 defect, the a2 defect, the A3 defect, and the B1 defect satisfy the following equations (1), (2), (3), (4), and (5), where Dis is a preset distance value:
{(XA1-XA2)×2+(YA1-YA2)×2}×0.5＜Dis (1)
{(XA1-XA3)×2+(YA1-YA3)×2}×0.5＜Dis (2)
{(XB1-XA2)×2+(YB1-YA2)×2}×0.5＜Dis (3)
{(XB1-XA2)×2+(YB1-YA2)×2}×0.5＜Dis (4)
{(XA2-XA3)×2+(YA2-YA3)×2}×0.5＜Dis (5)
in example 4, the coordinates of the a1 defect and the a2 defect in the first defect pair satisfy equation (1), the coordinates of the a1 defect and the A3 defect in the second defect pair satisfy equation (2), the coordinates of the a2 defect and the A3 defect in the fifth defect pair satisfy equation (5), and equation (3) and equation (4) do not hold, which indicates that there is a possibility of a common defect occurring between four products.
Therefore, the determination is continued, and the process advances to step S4 to perform morphology and grayscale comparisons for the a1 defect and the a2 defect, respectively, of the first defect pair; comparing the forms and the gray levels of the A1 defect and the A3 defect of the second defect pair; the a2 defect and the A3 defect of the fifth defect pair were subjected to morphological and grayscale comparisons. The form and gray scale comparison of each defect pair specifically comprises the following steps:
s3.1, presetting a gray level difference value Dg, a length difference value Dx in the X-axis direction, a width difference value Dy in the Y-axis direction and a difference value Ds of the area size;
s3.2, calculating gray difference values, length difference values in the X-axis direction, width difference values in the Y-axis direction and area difference values between the A1 defect and the A2 defect, between the A1 defect and the A3 defect and between the A2 defect and the A3 defect;
and S3.3, comparing the three gray level difference values obtained by calculation in the step S3.2 with Dg, comparing the three length difference values in the X-axis direction with Dx, comparing the three width difference values in the Y-axis direction with Dy, and comparing the three area difference values with Ds.
In step S5, according to the comparison result, the a1 defect, the a2 defect, and the A3 defect meet the position difference requirement, but the a1 defect, the a2 defect, and the A3 defect do not meet the shape difference requirement, the a1 defect is in the shape of a thorny shape, the a2 defect is in the shape of a four-pointed star shape, and the A3 defect is in the shape of a rectangle, it is determined that no common defect occurs among the four products, and in the detection process in the production of the liquid crystal display panel, no common defect alarm occurs, and the occurrence of the "false alarm" phenomenon is avoided, thereby improving the productivity of the production line.
The embodiment of the application also provides a common defect judgment device, which can adopt the common defect judgment method to intercept and judge the common defects generated in the production process of the display panel in real time.
The common defect judgment device comprises an identification unit, a storage unit, a processing unit and an alarm unit, wherein the identification unit, the storage unit and the processing unit are in communication connection, and the alarm unit and the processing unit are in communication connection.
The identification unit is used for identifying defects on each plate body and transmitting data of each defect to the storage unit, and comprises a CCD camera, the CCD camera is used for scanning and shooting images of the surface to be detected of each plate, and image information is transmitted to the storage unit to be stored.
And the storage unit is used for storing data information generated in the whole common defect judgment process, including image information of the surface to be detected of each plate, data information of each defect and the like. The memory unit may be a memory device commonly used in the art.
The processing unit is used for collecting data of each defect from the storage unit, comparing the data of each defect and judging whether the plurality of defects are common defects or not. The processing unit comprises a data calculation center, and is used for calculating data information such as position difference values, gray difference values, length difference values in the X-axis direction, width difference values in the Y-axis direction and the like among defects.
And the alarm unit judges whether to send out an alarm signal or not based on the comparison result of the processing unit. And when the common defects are judged to occur, the alarm unit sends out an alarm signal. The alarm unit can be built in the processing unit or can be externally arranged on the processing unit.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the above description of the common defect determining method and determining apparatus provided in the embodiments of the present application, it should be noted that the length in the X-axis direction refers to: the longest distance of the defect in the X-axis direction; the width in the Y-axis direction means: the longest distance of the defect in the Y-axis direction. The principle and the implementation of the present application are explained by applying specific examples, and the above description of the embodiments is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A method for determining a common defect, comprising the steps of:
providing a plurality of plate bodies to be detected, and identifying defects on each plate body;
matching every two defects on different plate bodies into defect pairs for position difference comparison so as to ensure that any two defects on different plate bodies can be compared and judging whether the position difference of each defect pair meets the preset position difference requirement or not;
if the position difference of none defect pair meets the preset position difference requirement, judging that common defects do not occur among the plate bodies;
if the position difference of the defect pair meets the preset position difference requirement, comparing the gray level and the form of two defects in the corresponding defect pair;
for the defect pairs with the position difference meeting the preset position difference requirement, if the gray level difference value meets the preset gray level difference requirement and the form difference value meets the preset form difference requirement, the common defects among the plate bodies are judged.
2. The method for determining a common defect according to claim 1, wherein the step of identifying the defect on each board body comprises the steps of:
scanning and photographing the surface to be detected on each plate body to obtain a detection image of each plate body;
and identifying the detection image to detect the defects on each plate body.
3. The method for determining a common defect according to claim 2, wherein the step of identifying the defect on each board body further comprises the steps of: and acquiring data information of each defect after the defect on each plate body is detected.
4. The method for determining a common defect according to claim 3, wherein the acquiring data information of each defect comprises: the gray value of each defect is acquired.
5. The method for determining a common defect according to claim 3, wherein the acquiring data information of each defect further comprises: acquiring the position and form information of each defect, comprising the following steps:
establishing a rectangular coordinate system by taking two adjacent edges of each plate body as an X axis and a Y axis respectively, wherein the X axis and the Y axis of each plate body correspond to each other;
acquiring coordinates of each defect on the corresponding plate body;
and acquiring the length of each defect in the X-axis direction, the width of each defect in the Y-axis direction and the area size of each defect according to the coordinates of each defect.
6. The method for determining a common defect according to claim 5, wherein the step of determining whether the position difference of each defect pair satisfies a preset position difference requirement comprises the steps of:
calculating a position difference value between two corresponding defects according to the coordinate values of the two defects in the defect pair;
comparing the position difference value of the defect pair with a preset distance value Dis;
and judging whether the position difference between the defect pairs meets the preset position difference requirement or not if the position difference value of the defect pairs is in the range of [0, Dis ] according to the comparison result.
7. The method for determining the common defect according to claim 5 or 6, wherein if the position difference of the defect pair satisfies the predetermined position difference requirement, the gray scale and shape comparison of the two defects in the corresponding defect pair is performed, comprising the following steps:
presetting a gray level difference value Dg, a length difference value Dx in the X-axis direction, a width difference value Dy in the Y-axis direction and an area difference value Ds;
calculating gray difference values of two defects in the corresponding defect pair, length difference values in the X-axis direction, width difference values in the Y-axis direction and area difference values;
comparing the gray level difference value, the length difference value in the X-axis direction, the width difference value in the Y-axis direction and the difference value of the area size with Dg, Dx, Dy and Ds respectively.
8. The method for determining the common defects according to claim 7, wherein for the defect pairs whose position difference satisfies the preset position difference requirement, if the gray level difference value satisfies the preset gray level difference requirement and the shape difference value satisfies the preset shape difference requirement, it is determined that the common defects occur between the plate bodies, specifically: for the defect pairs with the position difference meeting the preset position difference requirement, the gray level difference value is in the range of [0, Dg ], the length difference value in the X-axis direction is in the range of [0, Dx ], the width difference value in the Y-axis direction is in the range of [0, Dy ], and the area difference value is in the range of [0, Ds ], and the common defects among the plate bodies are judged.
9. A common defect determination device, comprising:
the identification unit is used for identifying the defects on each plate body and transmitting the data of each defect to the storage unit;
a storage unit for storing data information generated in the entire common defect determination process;
the processing unit is used for collecting data of each defect from the storage unit, comparing the data of each defect and judging whether the plurality of defects are common defects or not;
the identification unit, the storage unit and the processing unit are in communication connection.
10. The common defect determining apparatus as claimed in claim 9, further comprising an alarm unit communicatively connected to the processing unit, wherein the alarm unit is triggered to send an alarm signal when the processing unit determines that the plurality of defects are common defects.
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