CN107462821A - Remote monitoring method and system for wafer test machine - Google Patents
Remote monitoring method and system for wafer test machine Download PDFInfo
- Publication number
- CN107462821A CN107462821A CN201610640916.2A CN201610640916A CN107462821A CN 107462821 A CN107462821 A CN 107462821A CN 201610640916 A CN201610640916 A CN 201610640916A CN 107462821 A CN107462821 A CN 107462821A
- Authority
- CN
- China
- Prior art keywords
- tester table
- wafer
- test
- tester
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 126
- 238000012544 monitoring process Methods 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 51
- 239000013078 crystal Substances 0.000 claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 claims abstract description 32
- 238000003860 storage Methods 0.000 claims description 13
- 230000002159 abnormal effect Effects 0.000 claims description 6
- 235000013399 edible fruits Nutrition 0.000 claims 1
- 238000012806 monitoring device Methods 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 78
- 230000006870 function Effects 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 241000894007 species Species 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2648—Characterising semiconductor materials
Abstract
The invention provides a remote monitoring method and a remote monitoring system for a wafer test machine. The method comprises connecting multiple test machines through network by a monitoring device to control each test machine to move into a wafer, mounting preparation codes on the test machines to control the test machines to read identification parameters of the wafer, and comparing the read identification parameters with product parameters obtained by a manufacturing execution system. If the comparison result is consistent, at least one working code is sequentially mounted on the test machine to control the test machine to test a plurality of crystal grains on the wafer and output test data. And finally, when all the crystal grains of the wafer are tested, controlling each testing machine to move the wafer out. According to the technical scheme, the product information to be operated and the corresponding setting information of the test machine are set on the manufacturing execution system, and the monitoring device is matched to obtain the current condition of the test machine, so that the test efficiency can be effectively improved.
Description
Technical field
The invention relates to a kind of monitoring method and system, and in particular to a kind of distal end of wafer sort board
Monitoring method and system.
Background technology
As IC (Integrated Circuits, IC) element is for processing speed, function, miniaturization, light weight
Many requirements such as change, manufacture of semiconductor is also towards miniaturization, densification development.In semiconductor industry, IC
Production, be broadly divided into three phases:Manufacture, the making of IC and the encapsulation of IC of wafer (wafer).And
While above-mentioned production stage is carried out, it is also necessary to various tests is carried out to wafer, to pick out the bad crystal grain on wafer,
Ensure process quality and production yield.
Wafer sort can mainly divide into two major parts, be the wafer probing (wafer carried out with processing procedure respectively
Probe) and classify, and the final test after the completion of encapsulation.Wherein, wafer probing is after the completion of every one of processing procedure, is utilized
The tester tables such as wafer probing machine (prober), are sequentially tested the crystal grain on wafer, to measure the electricity of each crystal grain
Property, and crystal grain is classified.Follow-up processing procedure will no longer be carried out by being wherein classified as the crystal grain of defective products, is fabricated to saving
This.
Wafer probing all relies on that operating personnel are manually operated on prober platform, and parameters to be checked simultaneously confirm at present
Afterwards, then manually boot board and tested.During the manually operated machine up and down of operating personnel, product information can enter manufacture
Execution system (Manufacturing Execution System, MES), need to now be transferred items to board manually by operating personnel
On.After the completion for the treatment of board test, then need to be transferred items manually to manufacturing execution system by operating personnel again.However, when board operation is complete
Into or when having abnormal produce, if operating personnel do not have found immediately, board can be caused to leave unused.Moreover, operating personnel's carry with
It is poor for a period of time that the time transferred items often exists with the time of board, when product has abnormal produce, it tends to be difficult to which retrospect is made
The industry time
The content of the invention
The present invention provides a kind of remote monitoring method and system of wafer sort board, utilizes supervising device and board line
To be managed concentratedly, testing efficiency can be effectively lifted.
The remote monitoring method of the wafer sort board of the present invention, suitable for monitoring multiple tester tables by supervising device.This
Method is by each tester table of network connectivity, to control tester table to move into (move in) wafer, then in tester table
Upper carry prepares (setup) code, to control tester table to read the identification parameter of wafer, and by the identification parameter read with
The product parameters that manufacturing execution system (Manufacturing Execution System, MES) obtains compare.Wherein, if than
Result is consistent, sequentially at least one operation code of carry on tester table, to control tester table to multiple on wafer
Crystal grain is tested, and is outputed test data.Finally, when all crystal grains of wafer complete test, tester table is controlled by crystalline substance
Circle removes (move out).
In one embodiment of this invention, above by each tester table of network connectivity, to control tester table to move
Before the step of entering wafer, methods described also includes the time for correcting each tester table so that the time of these tester tables
With the time consistency of supervising device.
In one embodiment of this invention, the sequentially at least one operation code of carry is above set forth on tester table, with control
Tester table is tested the crystal grain on wafer, and is included in carry one on tester table the step of output test data and is tested
Code, to control tester table to carry out first time test to the portion crystal on wafer.At the end of first time tests, then control
Tester table is shut down, and carry one checks code on tester table, to check whether the first time result of test is normal.Its
In, if the result of test is normal for the first time, continue carry others operation code, to control tester table to other on wafer
Crystal grain is tested, and is outputed test data, until all crystal grains of wafer are all completed to test;If the result of test is not for the first time
Normally, then the test of wafer is terminated.
In one embodiment of this invention, when all crystal grains of wafer complete test, methods described also includes calculating crystalline substance
Circle moves in and out tester table elapsed time, and the number tested according to tester table, and it is every to calculate tester table
Carry out once testing the spent time.
In one embodiment of this invention, when all crystal grains of wafer complete test, methods described also includes accumulative each
Individual operation code by the time of carry, with assess tester table perform each operation code corresponding to test job spent when
Between.
In one embodiment of this invention, the above-mentioned sequentially at least one operation code of carry on tester table, with control
Tester table is tested the crystal grain on wafer, and also includes the step of output test data judging that tester table is being surveyed
Whether pre-defined multiple events (event) one of are occurred during examination.Wherein, if meeting one of event, export
This pre-defined event test data required when occurring.
In one embodiment of this invention, the above method also includes passing through each tester table of network connectivity, each to obtain
Individual tester table test caused instant messages, and on the monitoring page display obtained by each tester table it is instant
Information.
In one embodiment of this invention, in the step of the upper instant messages for being set forth in and each tester table being shown on the monitoring page
After rapid, methods described also includes receiving the control operation for one of tester table in the monitoring page, to pass through network
Tester table corresponding to this control operation of line, to be controlled operation to this tester table.
In one embodiment of this invention, the control of one of tester table is grasped in above-mentioned reception is for the monitoring page
After the step of making, methods described also includes passing through tester table corresponding to network connectivity control operation, to show tester table
Man-machine interface, and receive the control operation for this man-machine interface, control tester table to perform this control operation according to this corresponding
Function.
In one embodiment of this invention, it is above-mentioned monitor the page on show the instant messages of each tester table the step of
Also include display and all tester tables of supervising device line, and receive at least one of for shown tester table
Selection operation, it is decided by monitor the tester table for showing instant messages in the page according to this.
A kind of far-end monitoring system of wafer sort board of the present invention, including performed to store the manufacture of product parameters
System, multiple tester tables and supervising device.Supervising device includes communicator, storage device and processor.Wherein, communication dress
Put is to by each tester table of network connectivity and manufacturing execution system.Storage device is to store multiple work generations
Code.Processor couples communicator and storage device, to utilize communicator in the above-mentioned work of carry on each tester table
Steady code in code, to control tester table to read the identification parameter of wafer, and by the identification parameter read and system
The product parameters for making execution system acquirement compare.Wherein, when processor is included in comparison result and is consistent, using communicator in survey
The sequentially at least one operation code of carry in commissioning stage, to control tester table to test multiple crystal grain on wafer, and
Output test data.And when all crystal grains of wafer complete test, processor controls tester table using communicator
Wafer is removed.
In one embodiment of this invention, above-mentioned processor also utilizes each tester table of communicator line, with school
The time of just each tester table so that the time of these tester tables and the time consistency of supervising device.
In one embodiment of this invention, above-mentioned processor carry one also on tester table tests code, to utilize
The each tester table of communicator line, control tester table carry out first time test to the portion crystal on wafer, and the
At the end of once testing, control tester table is shut down, and carry one detects code on tester table, is tested for the first time with detection
Result it is whether normal.Wherein, if the result of test is normal for the first time, other operation codes of continuation carry, to control test machine
Platform is tested other crystal grain on wafer, and is outputed test data, until all crystal grains of wafer are all completed to test;And if
The result of test is abnormal for the first time, then terminates the test of wafer.
In one embodiment of this invention, above-mentioned processor also calculates wafer and moves in and out what tester table was passed through
Time, and the number tested according to tester table, calculate tester table and often once tested the spent time.
In one embodiment of this invention, above-mentioned processor also adds up each operation code by the time of carry, to comment
The time that test job corresponding to estimation commissioning stage execution operation code is spent.
In one embodiment of this invention, it is pre- also to judge whether tester table occurs when being tested for above-mentioned processor
One of multiple events first defined, and if meet one of event, pre-defined this of control tester table output
Event test data required when occurring.
In one embodiment of this invention, above-mentioned processor also passes through each test machine of network connectivity using communicator
Platform, carry out testing caused instant messages to obtain each tester table, and bag is shown on the display of supervising device
Include the monitoring page of the instant messages of each tester table.
In one embodiment of this invention, above-mentioned processor is also received for being shown in display using input unit
The control operation of one of tester table in the page is monitored, to pass through this control operation pair of network connectivity using communicator
The tester table answered, operation is controlled to this tester table.
In one embodiment of this invention, above-mentioned processor also passes through network connectivity control operation pair using communicator
The tester table answered, to show the man-machine interface of tester table, and utilize control of the input unit reception for this man-machine interface
System operation, controls tester table to perform function corresponding to this control operation according to this.
In one embodiment of this invention, above-mentioned processor is also shown all with supervising device line over the display
Tester table, and the selection operation for one of tester table shown by display is received using input unit, according to this
It is decided by show the tester table of instant messages in the monitoring page that display is shown.
Based on the remote monitoring and system of above-mentioned, of the invention wafer sort board, by being set on manufacturing execution system
Surely the product information of machine and the set information of corresponding tester table are gone up, coordinates supervising device to obtain tester table present situation,
And it is confirmed whether to perform machine up and down automatically by comparing checking.The information centralized displaying of tester table is existed simultaneously
In supervising device, allow operating personnel to set the tester table to be monitored, and tester table can be directly wired to and do parameter
Setting.Whereby, testing efficiency can effectively be lifted.It is hereafter special for features described above of the invention and advantage can be become apparent
For embodiment, and accompanying drawing is coordinated to be described in detail below.
Brief description of the drawings
Fig. 1 is the schematic diagram according to the far-end monitoring system of the wafer sort board shown by one embodiment of the invention;
Fig. 2 is the block diagram according to the remote monitoring device of the wafer sort board shown by one embodiment of the invention;
Fig. 3 is the flow chart according to the remote monitoring method of the wafer sort board shown by one embodiment of the invention;
Fig. 4 is the flow chart according to the remote monitoring method of the wafer sort board shown by one embodiment of the invention;
Fig. 5 is the setting page according to the tester table to be monitored of the selection shown by one embodiment of the invention;
Fig. 6 is the monitoring page according to the supervising device shown by one embodiment of the invention.
Description of reference numerals:
1:Far-end monitoring system;
10:Supervising device;
12:Manufacturing execution system;
20:Network;
14、16、18:Tester table;
102:Communicator;
104:Storage device;
106:Display;
108:Input unit;
110:Processor;
50:Board inventory;
52:Store button;
60:Monitor the page;
62:Field;
64:Board illustrates;
S302~S314:The step of remote monitoring method of the wafer sort board of one embodiment of the invention;
402~S414:The step of remote monitoring method of the wafer sort board of one embodiment of the invention.
Embodiment
The far-end monitoring system of the present invention is to pass through each test on network connectivity to producing line by independent supervising device
Board and manufacturing execution system (Manufacturing Execution System, MES), it can be received on manufacturing execution system
The product information of machine, and receive test machine by board automated procedures (Equipment Automatic Program, EAP)
The real-time signal of platform.Supervising device distally can issue orders to tester table, and by the instant messages and test result of tester table
Centralized displaying is in the page is monitored, the effect of reaching remote control and manage concentratedly.
Fig. 1 is the schematic diagram according to the far-end monitoring system of the wafer sort board shown by one embodiment of the invention.Please
Reference picture 1, the far-end monitoring system 1 of the present embodiment include supervising device 10, manufacturing execution system 12 and multiple tester tables 14,
16、18.Wherein, the present embodiment is illustrated by taking three tester tables 14,16,18 as an example, but not limited to this, in other implementations
In example, far-end monitoring system 1 may include more tester tables.
The system of manufacturing execution system 12 to management and control wafer sort overall flow and store product parameters, including processing procedure kind
The parameters such as class, processing time, the batch (batch) of wafer, lot number, sequence number.Tester table 14,16,18 be, for example, can be used into
The prober (prober) of row wafer probing, it is, for example, that the crystal grain on the wafer of given batch is surveyed in a stepping manner
Examination.Supervising device 10 be, for example, desktop computer, notebook computer, work station, servomechanism or other possess the intelligence of calculation function
Energy mobile phone, personal digital assistant or tablet personal computer, the present embodiment not limited to this.The system of supervising device 10 is connected by network 20 and manufactured
Execution system 12 and tester table 14,16,18, to control tester table 14,16,18 pairs of wafers to be measured to carry out machine, production up and down
The operations such as product are identified and crystal grain is tested, and test result is received from each tester table 14,16,18, and centralized displaying is monitoring
In the page, so that operating personnel inspect and carry out follow-up management.
In detail, Fig. 2 is the side according to the remote monitoring device of the wafer sort board shown by one embodiment of the invention
Block figure.Refer to Fig. 2, this example demonstrates that in Fig. 1 supervising device 10 composition and function.Wherein, supervising device 10 includes logical
T unit 102, storage device 104, display 106, input unit 108 and processor 110, its function are described below:
Communicator 102 is, for example, to support motor and Electronic Engineering Association (Institute of Electrical and
Electronics Engineers, IEEE) wireless communication standard such as 802.11n/b/g wireless network card or support second too net
The network interface card that the cable networks such as network (Ethernet) link, it can be entered by wired or wireless way and other devices on network 20
Row network connectivity.
Storage device 104 be, for example, any kenel random access memory (random access memory, RAM),
Read-only storage (read-only memory, ROM), fast storage (flash memory), hard disk or similar component or on
State the combination of element.Memory cell 104 can be used to store the operation code of tester table.
Display 106 is, for example, using liquid crystal display (Liquid Crystal Display, LCD), light emitting diode
(Light-Emitting Diode, LED), Field Emission Display (Field Emission Display, FED) or other species
Panel is as display panel, and uses light emitting diode (Light-Emitting Diode, LED) as the screen of backlight module
Curtain.Display 106 can receive the picture of outside input, with display picture on a display panel.
Input unit 108 e.g. keyboard, mouse, Trackpad, trace ball etc. can provide user and supervising device 10 entered
The input tool of row operation.Input unit 108 can also be resistance-type, condenser type or other kinds of touching detecting element, its
Touching screen can be integrated into display 106, and the touching of user while the picture of display monitoring device 10, can be detected
Operation.
Processor 110 is, for example, CPU (the Central Processing with single core or multi-core
Unit, CPU), or the microprocessor of the general service of other programmables or specific use (Microprocessor), numeral
Signal processor (Digital Signal Processor, DSP), programmable controller, Application Specific Integrated Circuit
(Application Specific Integrated Circuits, ASIC), programmable logic device (Programmable
Logic Device, PLD) or other similar devices or these devices combination.Processor 110 couples communicator 102, storage
Device 104, display 106 and input unit 108, to perform the remote monitoring work(of the wafer sort board of the embodiment of the present invention
Energy.Illustrate that supervising device 10 performs the detailed step of remote monitoring to wafer sort board for embodiment below.
Fig. 3 is the flow chart according to the remote monitoring method of the wafer sort board shown by one embodiment of the invention.Please
Referring concurrently to Fig. 1, Fig. 2 and Fig. 3, the method for the present embodiment is suitable for above-mentioned Fig. 1 far-end monitoring system 1 and Fig. 2 monitoring dress
10 are put, each item of far-end monitoring system 1 and Fig. 2 supervising device 10, illustrates the remote of the present embodiment in the Fig. 1 that arranges in pairs or groups below
Hold the detailed step of monitoring method:
First, the connected network 20 of communicator 102 is utilized by processor 110, and line test machine is distinguished by network 20
Platform 14,16,18, to control tester table 14,16,18 to move into wafer (step S302).It will be done below by taking tester table 14 as an example
Illustrate, but not limited to this, following monitoring method are applied to all tester tables with the line of supervising device 10.It should be noted
It is that before processor 110 controls tester table 14 to be operated, such as can first correct the time of tester table 14 so that survey
The time of commissioning stage 14 and the time consistency of supervising device 10, with sharp follow-up tracking.Wherein, wafer is moved into tester table 14
Afterwards, crystal-boat box and probe card can be put on tester table 14 by operating personnel, to be ready for testing.
Then, by the operation code stored in the accessing storage devices 104 of processor 110, and will be upper using communicator 102
Preparation (setup) the code carry in operation code is stated in tester table 14, to control tester table 14 to read the identification of wafer
Parameter, and the product parameters that the identification parameter read and manufacturing execution system 12 are obtained compare (step S304).Wherein, locate
Reason device 110 can for example utilize communicator 102 by the line manufacturing execution system 12 of network 20 to obtain the product of upper machine at present
Parameter, including the lot number of wafer to be measured, sequence number, piece number etc., then the wafer that these ginseng product parameters are read with tester table 14
Identification parameter be compared, to judge whether comparison result is consistent (step S306).Processor 110 can also manufacture execution simultaneously
System 12 obtains the process parameters such as processing procedure species, time, with the foundation tested as subsequent control tester table 14.
If comparison result is not inconsistent, processor 110 can utilize communicator 102 to control tester table 14 to terminate test (step
Rapid S308).Conversely, if comparison result is consistent, processor 110 can continue with according to process parameters such as processing procedure species, times
Sequentially carry operation code is in tester table 14 for communicator 102, to control tester table 14 to enter multiple crystal grain on wafer
Row test, and output test data (step S310).Wherein, processor 110 can for example tested for tester table 14
When the various situations that may occur, define multiple events, can during being tested in tester table 14 wafer
Keep track and judge whether that pre-defined event occurs.And if have judgement outgoing event, can according to the action of predefined,
Tester table 14 is controlled to export test data required when this event occurs.
Finally, processor 110 determines whether that all crystal grains on wafer are completed to test (step S312).If still there is crystalline substance
Grain is not tested, then returns to step S310, continues carry operation code to be tested, when all crystal grains complete test,
Processor 110 can utilize communicator 102 to control tester table 14 to remove wafer (step S314).Wherein, in test end
Afterwards, processor 110 can first notify operating personnel to exit the crystal-boat box on tester table 14, then control tester table 14 to remove crystalline substance
Circle.
It should be noted that before testing wafer, supervising device 10 for example can also additionally be directed to tester table 14
Pin measuring card checked, it is ensured that pin measuring card does not interfere with the test of wafer.
In detail, Fig. 4 is the stream according to the remote monitoring method of the wafer sort board shown by one embodiment of the invention
Cheng Tu.Referring to Fig. 1, Fig. 2 and Fig. 4, the far-end monitoring system 1 and Fig. 2 of the method for the present embodiment suitable for above-mentioned Fig. 1
Supervising device 10, it is each item of far-end monitoring system 1 and Fig. 2 supervising device 10 in collocation Fig. 1 below, illustrates this implementation
The detailed step of the remote monitoring method of example:
The present embodiment is connected at after Fig. 3 step S306, that is, confirms the identification parameter and manufacturing execution system of wafer
After the product parameters of acquirement are consistent, processor 110 can be first with the test code of communicator 102 carry, one pin measuring card in survey
Commissioning stage 14, to control tester table 14 to carry out first time test (step S402) to the portion crystal on wafer.And when first
At the end of secondary test, processor 110 can utilize communicator 102 to control tester table 14 to shut down (step S404), then hang again
Carry one and check code in tester table 14, to check whether the result of test for the first time is normal (step S406).Wherein, test
Board 14 can for example check whether the pin trace on wafer is normal.
If the result of test is abnormal for the first time, representing pin measuring card may damage, and now processor 110 can utilize communication
Device 102 controls tester table 14 to terminate test (step S408), to inspect tester table 14 by operating personnel.If conversely,
The result once tested is normal, that is, represents that pin measuring card is normal, and now processor 110 may proceed to sequentially hang using communicator 102
Operation code is carried in tester table 14, to control tester table 14 to test multiple crystal grain on wafer, and exports test
Data (step S410).
Finally, processor 110 determines whether that all crystal grains on wafer are completed to test (step S412).If still there is crystalline substance
Grain is not tested, then returns to step S410, continues carry operation code to be tested, when all crystal grains complete test,
Processor 110 can utilize communicator 102 to control tester table 14 to remove wafer (step S414), and terminate test.
By above-mentioned method, supervising device 10 can obtain the production needed for test with the line of manufacturing execution system 12 automatically
Product parameter, also it can substitute manually carry by way of the carry operation code of distal end, and it is right to automatically control tester table 14
Crystal grain is tested.The test result that communicator 102 receives each tester table can also be used in supervising device 10, with to these
Data are managed concentratedly.
It should be noted that tester table progress wafer survey is automatically controlled by supervising device because the embodiment of the present invention uses
Examination, this mode can not only save the manpower and time that manually setting board is spent, and can obtain in wafer testing procedure
Tester table performs the time that each step is actually spent, and is often once tested and spent available for calculating tester table
Time, while can also calculate tester table and perform the time that the operation of each operation code is spent.
In detail, supervising device can calculate wafer and move in and out tester table elapsed time, and according to this test
This number for being tested wafer of board, calculates tester table and is often once tested the spent time.The opposing party
Face, supervising device can also add up each operation code by the time of carry, and each operation code pair is performed to assess tester table
The time that the test job answered is spent, it is used so as to provide operating personnel as testing cost is assessed.
On the other hand, in addition to the function of said distal ends control tester table, supervising device can also pass through network connectivity
Each tester table, caused instant messages test to obtain each tester table, and by acquired instant messages
The monitoring page is shown in, so that operating personnel inspect the As-Is of each tester table.
In addition, supervising device may also provide, operating personnel enter edlin to the tester table in the monitoring page and control is grasped
Make, to edit the tester table to be controlled, and to the control of specific tester table progress.Wherein, supervising device can be shown
With all tester tables of its line, and selection operation of the operating personnel for shown tester table is received, determined according to this
It will see the tester table of instant messages in the page is monitored.
On the other hand, supervising device can for example receive what operating personnel performed for monitoring the tester table shown in the page
Control operation, with using by tester table corresponding to network connectivity this control operation, and operation is controlled to tester table.
It should be noted that supervising device can be by tester table corresponding to the direct line control operation of network, to obtain survey
The picture of the man-machine interface of commissioning stage, and show on its display the man-machine interface of this tester table.In addition, supervising device is also
Control operation of the operating personnel for man-machine interface can be further received, controls tester table to perform this control operation according to this corresponding
Function.
For example, Fig. 5 is the setting according to the tester table to be monitored of the selection shown by one embodiment of the invention
The page.Fig. 6 is the monitoring page according to the supervising device shown by one embodiment of the invention.Please also refer to Fig. 5, supervising device example
A tester table inventory 50 to have succeeded with supervising device line at present can be such as shown, and core is provided before each tester table
To square so that operating personnel choose the tester table to be monitored.
After personnel's selection to be operated finishes and presses storage button 52, supervising device can show monitoring as shown in Figure 6
The page 60, this monitoring page 60 is the monitoring data for listing tester table selected by operating personnel, including multiple fields 62
Board state is inspected for operating personnel and carries out subsequent operation according to this.Wherein, operating personnel may be selected in remote control field
Board diagram 64, with as supervising device by the direct line of network corresponding to tester table, to obtain the man-machine of tester table
The picture at interface, and show the man-machine interface of this tester table on the monitoring page 60.This man-machine boundary shown by supervising device
Noodles can allow operating personnel to be operated in this man-machine interface, and directly control tester table like the remote desktop of tester table
Function corresponding to executive control operation, operated without going further to tester table front.
In summary, the remote monitoring method of wafer sort board of the invention and system pass through supervising device and test machine
Platform establishes line and obtains board present situation, confirms product parameters by comparing and checking, and work generation by distal end carry
The mode of code, control tester table are tested, and test result is then by supervising device centralized displaying in the monitoring page.Whereby, grasp
The state of tester table can be monitored at any time in any position of plant area and dispose immediately by making personnel, so as to lift testing efficiency.
Finally it should be noted that:Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations;To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that:Its according to
The technical scheme described in foregoing embodiments can so be modified, either which part or all technical characteristic are entered
Row equivalent substitution;And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (20)
- A kind of 1. remote monitoring method of wafer sort board, suitable for monitoring multiple tester tables, methods described by supervising device Comprise the following steps:By each tester table of network connectivity, to control the tester table to move into a wafer;Carry steady code is in the tester table, to control the tester table to read the identification parameter of the wafer, and The product parameters that the identification parameter read obtains with manufacturing execution system are compared;If comparison result is consistent, sequentially a carry at least operation code is in the tester table, to control the tester table pair Multiple crystal grain on the wafer are tested, and are outputed test data;AndWhen all crystal grains of the wafer complete test, the tester table is controlled to remove the wafer.
- 2. according to the method for claim 1, wherein by each tester table of network connectivity, to control the test Board was moved into before the step of wafer, in addition to:Correct the time of each tester table so that the time of the tester table and the time one of the supervising device Cause.
- 3. according to the method for claim 1, wherein sequentially an at least operation code described in carry in the tester table, with The step of controlling the tester table to test the crystal grain on the wafer, and outputing test data includes:Carry one tests code in the tester table, to control the tester table to the part crystal grain on the wafer Carry out first time test;At the end of the first time tests, the tester table is controlled to shut down, and carry one checks code in the test machine Platform, to check whether the result of the first time test is normal;If the result of first time test is normal, continue carry at least operation code described in other, to control the test Board is tested other described crystal grain on the wafer, and exports the test data, until owning for the wafer Crystal grain is all completed to test;AndIf the result of the first time test is abnormal, terminate the test of the wafer.
- 4. according to the method for claim 1, wherein when all crystal grains of the wafer complete test, methods described is also wrapped Include:Calculate the wafer and move in and out the tester table elapsed time, and tested according to the tester table Number, calculate the tester table and often once tested the spent time.
- 5. according to the method for claim 1, wherein when all crystal grains of the wafer complete test, methods described is also wrapped Include:Add up each operation code by the time of carry, survey corresponding to the operation code is performed to assess the tester table The spent time is made in trial work.
- 6. according to the method for claim 1, wherein sequentially a carry at least operation code is in the tester table, with control The tester table is tested the crystal grain on the wafer, and is also included the step of output test data:Judge whether the tester table one of pre-defined multiple events occur when being tested;AndIf meeting one of described event, the test data required when the pre-defined event occurs is exported.
- 7. the method according to claim 11, in addition to:By each tester table of network connectivity, carry out testing caused instant messages to obtain each tester table; AndThe instant messages that display is obtained by each tester table monitor the page in one.
- 8. according to the method for claim 7, wherein showing the instant messages of each tester table in the prison After the step of controlling the page, in addition to:Receive the control operation for one of tester table described in the monitoring page;AndBy the tester table corresponding to control operation described in the network connectivity, to carry out the control to the tester table System operation.
- 9. according to the method for claim 8, wherein receive for it is described monitoring the page described in tester table wherein it After the step of one control operation, in addition to:By the tester table corresponding to control operation described in the network connectivity, to show the man-machine boundary of the tester table Face;AndThe control operation for the man-machine interface is received, controls the tester table to perform the control operation pair according to this The function of answering.
- 10. according to the method for claim 7, wherein showing the instant messages of each tester table in the monitoring The step of page, also includes:Display and all tester tables of the supervising device line;AndReceive for the shown at least one of selection operation of the tester table, determine according to this in the monitoring page The tester table of the middle display instant messages.
- 11. a kind of far-end monitoring system of wafer sort board, including:Manufacturing execution system, store product parameters;Multiple tester tables;AndSupervising device, including:Communicator, pass through each tester table of network connectivity and the manufacturing execution system;Storage device, store multiple operation codes;AndProcessor, the communicator and the storage device are coupled, whereinThe processor is using the steady code in operation code described in the communicator carry in each test Board, to control the tester table to read the identification parameter of the wafer, and by the identification parameter read with from institute The product parameters for stating manufacturing execution system acquirement compare;When the processor is included in comparison result and is consistent, the communicator sequentially at least one operation code of carry is utilized In the tester table, to control the tester table to test multiple crystal grain on the wafer, and test number is exported According to;AndWhen all crystal grains that the processor is included in the wafer complete test, the test is controlled using the communicator Board removes the wafer.
- 12. system according to claim 11, wherein the processor also utilizes each survey of the communicator line Commissioning stage, to correct the time of each tester table so that the time of the tester table and the supervising device Time consistency.
- 13. system according to claim 11, wherein the processor also carry one tests code in the tester table, To utilize each tester table of the communicator line, to control the tester table to described in the part on the wafer Crystal grain carries out first time test, and at the end of the first time tests, controls the tester table to shut down, and carry one detects generation Whether code is normal to detect the result of the first time test in the tester table, if wherein the knot of first time test Fruit is normal, other described operation codes of continuation carry, to control the tester table to other described crystal grain on the wafer Tested, and export the test data, until all crystal grains of the wafer are all completed to test, and if the first time surveys The result of examination is abnormal, terminates the test of the wafer.
- 14. system according to claim 11, wherein the processor, which also calculates the wafer, moves in and out the survey Commissioning stage elapsed time, and the number tested according to the tester table, calculate the tester table and often carry out one Secondary test the spent time.
- 15. system according to claim 11, wherein the processor also add up each operation code by carry when Between, with assess the tester table perform the operation code corresponding to time for being spent of test job.
- 16. system according to claim 11, wherein the processor also judges the tester table when being tested Whether one of pre-defined multiple events of generation, and if meet one of described event, control the tester table The output pre-defined event test data required when occurring.
- 17. system according to claim 11, wherein the processor also passes through network connectivity using the communicator Each tester table, carry out testing caused instant messages to obtain each tester table, and in the monitoring dress Display includes the monitoring page of the instant messages of each tester table on the display put.
- 18. system according to claim 17, wherein the processor is also received for being shown in using input unit The control operation of one of tester table described in the monitoring page of display is stated, to pass through using the communicator The tester table corresponding to control operation described in the network connectivity, to carry out the control operation to the tester table.
- 19. system according to claim 18, wherein the processor also passes through the network using the communicator The tester table corresponding to control operation described in line, to show the man-machine interface of the tester table, and described in utilization Input unit receives the control operation for the man-machine interface, controls the tester table to perform the control behaviour according to this Function corresponding to work.
- 20. system according to claim 17, wherein the processor also show it is all with the supervising device line Tester table is received for the tester table shown by the display at least in the display, and using input unit The selection operation of one of them, determines to show the instant messages in the monitoring page that the display is shown according to this The tester table.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105117326 | 2016-06-02 | ||
TW105117326A TWI621191B (en) | 2016-06-02 | 2016-06-02 | Method and system for remotely monitoring wafer testing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107462821A true CN107462821A (en) | 2017-12-12 |
CN107462821B CN107462821B (en) | 2019-11-26 |
Family
ID=60545392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610640916.2A Active CN107462821B (en) | 2016-06-02 | 2016-08-08 | Remote monitoring method and system for wafer test machine |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN107462821B (en) |
TW (1) | TWI621191B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108172154A (en) * | 2018-01-03 | 2018-06-15 | 惠科股份有限公司 | A kind of test method and test equipment |
CN108227250A (en) * | 2017-12-25 | 2018-06-29 | 武汉华显光电技术有限公司 | LCD quality detecting methods, device, CIM systems and computer storage media |
CN109324572A (en) * | 2018-01-05 | 2019-02-12 | 竹阩智能数据(合肥)有限公司 | Machine automation management system and method thereof |
CN110675084A (en) * | 2019-10-08 | 2020-01-10 | 东莞长城开发科技有限公司 | LED wafer test management system based on MES system |
CN112435937A (en) * | 2020-11-27 | 2021-03-02 | 华虹半导体(无锡)有限公司 | Automatic control system and method for wafer test |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1206114A (en) * | 1997-07-07 | 1999-01-27 | 日本电气株式会社 | Wafer test method capable of completing wafer test for short time |
CN101556303A (en) * | 2008-04-08 | 2009-10-14 | 南茂科技股份有限公司 | Wafer test system for integrating radio frequency identification and test method thereof |
US20100052725A1 (en) * | 2007-09-05 | 2010-03-04 | National Semiconductor Corporation | Adaptive test time reduction for wafer-level testing |
US20120016509A1 (en) * | 2010-07-19 | 2012-01-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor Processing Dispatch Control |
CN102565653A (en) * | 2010-12-29 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | Wafer testing method |
CN202494755U (en) * | 2012-02-08 | 2012-10-17 | 华润赛美科微电子(深圳)有限公司 | Prober card and multi-die wafer test system |
CN104422864A (en) * | 2013-08-21 | 2015-03-18 | 上海华虹宏力半导体制造有限公司 | Method for confirming position alignment in wafer test |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW583739B (en) * | 2001-04-30 | 2004-04-11 | Taiwan Semiconductor Mfg | Monitoring and verifying system for semiconductor testing equipment |
TWI412906B (en) * | 2010-04-13 | 2013-10-21 | Univ Nat Cheng Kung | Manufacturing execution system with virtual-metrology capabilities and manufacturing system including the same |
-
2016
- 2016-06-02 TW TW105117326A patent/TWI621191B/en active
- 2016-08-08 CN CN201610640916.2A patent/CN107462821B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1206114A (en) * | 1997-07-07 | 1999-01-27 | 日本电气株式会社 | Wafer test method capable of completing wafer test for short time |
US20100052725A1 (en) * | 2007-09-05 | 2010-03-04 | National Semiconductor Corporation | Adaptive test time reduction for wafer-level testing |
CN101556303A (en) * | 2008-04-08 | 2009-10-14 | 南茂科技股份有限公司 | Wafer test system for integrating radio frequency identification and test method thereof |
US20120016509A1 (en) * | 2010-07-19 | 2012-01-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor Processing Dispatch Control |
CN102565653A (en) * | 2010-12-29 | 2012-07-11 | 中芯国际集成电路制造(上海)有限公司 | Wafer testing method |
CN202494755U (en) * | 2012-02-08 | 2012-10-17 | 华润赛美科微电子(深圳)有限公司 | Prober card and multi-die wafer test system |
CN104422864A (en) * | 2013-08-21 | 2015-03-18 | 上海华虹宏力半导体制造有限公司 | Method for confirming position alignment in wafer test |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108227250A (en) * | 2017-12-25 | 2018-06-29 | 武汉华显光电技术有限公司 | LCD quality detecting methods, device, CIM systems and computer storage media |
CN108227250B (en) * | 2017-12-25 | 2021-03-16 | 武汉华显光电技术有限公司 | LCD quality inspection method, device, CIM system and computer storage medium |
CN108172154A (en) * | 2018-01-03 | 2018-06-15 | 惠科股份有限公司 | A kind of test method and test equipment |
CN109324572A (en) * | 2018-01-05 | 2019-02-12 | 竹阩智能数据(合肥)有限公司 | Machine automation management system and method thereof |
CN110675084A (en) * | 2019-10-08 | 2020-01-10 | 东莞长城开发科技有限公司 | LED wafer test management system based on MES system |
CN112435937A (en) * | 2020-11-27 | 2021-03-02 | 华虹半导体(无锡)有限公司 | Automatic control system and method for wafer test |
CN112435937B (en) * | 2020-11-27 | 2022-06-07 | 华虹半导体(无锡)有限公司 | Automatic control system and method for wafer test |
Also Published As
Publication number | Publication date |
---|---|
CN107462821B (en) | 2019-11-26 |
TWI621191B (en) | 2018-04-11 |
TW201743388A (en) | 2017-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107462821B (en) | Remote monitoring method and system for wafer test machine | |
JP3198272B2 (en) | Control system and control method for semiconductor integrated circuit device inspection process | |
CN100587507C (en) | Method and system for measuring manufactured integrate circuit component | |
CN109633413A (en) | 32 MCU core chip test systems of one kind and its test method | |
JP5992092B2 (en) | Interposer between inspection machine and material handling device to separate and manage various requests from multiple entities in inspection cell operation | |
CN109767996A (en) | Wafer defect analysis system and analysis method | |
EP1149385A1 (en) | Ic test software system for mapping logical functional test data of logic integrated circuits to physical representation | |
JPH08235265A (en) | Information system for production management | |
CN208507632U (en) | A kind of wafer test yield rate real-time monitoring system | |
CN101325517A (en) | Communication system equipment and detection method thereof | |
CN103367103A (en) | Semiconductor product production method and system thereof | |
CN101996856A (en) | Real-time monitoring method of acceptance test of wafer | |
US10101386B2 (en) | Real time semiconductor process excursion monitor | |
JP2008002900A (en) | Screening method, system, and program for semiconductor devices | |
CN112435937B (en) | Automatic control system and method for wafer test | |
CN111190092A (en) | FPGA test quality control optimization system | |
CN112420535A (en) | Chip manufacturing method and system | |
CN109390246A (en) | A kind of WAT test method and system | |
CN113485157A (en) | Wafer simulation test method and device and wafer test method | |
CN107340487A (en) | A kind of method checked test system and be in actual processing ability under stable state | |
CN112213627A (en) | Chip test system applied to integrated circuit | |
CN112445694A (en) | Tool for formulating test configuration file and application thereof | |
CN111106028A (en) | Real-time monitoring method for semiconductor chip testing process | |
CN114002576A (en) | Needle measuring card abnormity judgment method and device | |
CN112445695A (en) | Tool for quickly generating test description file and application thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |