CN110134077B - 数据处理方法、数据处理装置及记录介质 - Google Patents
数据处理方法、数据处理装置及记录介质 Download PDFInfo
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- CN110134077B CN110134077B CN201910096735.1A CN201910096735A CN110134077B CN 110134077 B CN110134077 B CN 110134077B CN 201910096735 A CN201910096735 A CN 201910096735A CN 110134077 B CN110134077 B CN 110134077B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M99/00—Subject matter not provided for in other groups of this subclass
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0208—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the configuration of the monitoring system
- G05B23/021—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the configuration of the monitoring system adopting a different treatment of each operating region or a different mode of the monitored system, e.g. transient modes; different operating configurations of monitored system
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0221—Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
- G05B23/0227—Qualitative history assessment, whereby the type of data acted upon, e.g. waveforms, images or patterns, is not relevant, e.g. rule based assessment; if-then decisions
- G05B23/0235—Qualitative history assessment, whereby the type of data acted upon, e.g. waveforms, images or patterns, is not relevant, e.g. rule based assessment; if-then decisions based on a comparison with predetermined threshold or range, e.g. "classical methods", carried out during normal operation; threshold adaptation or choice; when or how to compare with the threshold
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
- G05B23/0262—Confirmation of fault detection, e.g. extra checks to confirm that a failure has indeed occurred
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
- G07C3/00—Registering or indicating the condition or the working of machines or other apparatus, other than vehicles
- G07C3/005—Registering or indicating the condition or the working of machines or other apparatus, other than vehicles during manufacturing process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31282—Data acquisition, BDE MDE
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Testing And Monitoring For Control Systems (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018020797A JP7074489B2 (ja) | 2018-02-08 | 2018-02-08 | データ処理方法、データ処理装置、および、データ処理プログラム |
| JP2018-020797 | 2018-02-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110134077A CN110134077A (zh) | 2019-08-16 |
| CN110134077B true CN110134077B (zh) | 2022-07-19 |
Family
ID=67475524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910096735.1A Active CN110134077B (zh) | 2018-02-08 | 2019-01-31 | 数据处理方法、数据处理装置及记录介质 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11274995B2 (enExample) |
| JP (1) | JP7074489B2 (enExample) |
| KR (1) | KR102247116B1 (enExample) |
| CN (1) | CN110134077B (enExample) |
| TW (1) | TWI691047B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6933630B2 (ja) * | 2018-12-06 | 2021-09-08 | ファナック株式会社 | 処理時間監視装置 |
| JP7249902B2 (ja) * | 2019-07-17 | 2023-03-31 | 東京エレクトロン株式会社 | 状態管理システム及び状態管理方法 |
| KR102455758B1 (ko) | 2020-01-30 | 2022-10-17 | 가부시키가이샤 스크린 홀딩스 | 데이터 처리 방법, 데이터 처리 장치 및 기억 매체 |
| CN113342610B (zh) * | 2021-06-11 | 2023-10-13 | 北京奇艺世纪科技有限公司 | 一种时序数据异常检测方法、装置、电子设备及存储介质 |
| CN116561545B (zh) * | 2023-05-17 | 2025-11-04 | 广东恒翼能科技股份有限公司 | 锂电池化成和分容工艺的多元时间序列实时异常检测方法、电子设备、存储介质 |
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| JP2001273336A (ja) * | 2000-03-27 | 2001-10-05 | Matsushita Electric Ind Co Ltd | データ収集方法 |
| JP4128339B2 (ja) * | 2001-03-05 | 2008-07-30 | 株式会社日立製作所 | 試料処理装置用プロセスモニタ及び試料の製造方法 |
| JP4355193B2 (ja) * | 2003-11-10 | 2009-10-28 | 株式会社ルネサステクノロジ | 半導体デバイスの製造方法及び半導体デバイス製造システム |
| US7745803B2 (en) * | 2004-02-03 | 2010-06-29 | Sharp Kabushiki Kaisha | Ion doping apparatus, ion doping method, semiconductor device and method of fabricating semiconductor device |
| US7200523B1 (en) * | 2005-11-30 | 2007-04-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for filtering statistical process data to enhance process performance |
| US7877233B2 (en) * | 2006-07-26 | 2011-01-25 | Invensys Systems, Inc. | Selectively presenting timestamped time-series data values for retrieved supervisory control and manufacturing/production parameters |
| US7490010B2 (en) | 2006-08-08 | 2009-02-10 | Tokyo Electron Limited | Data collection method, substrate processing apparatus, and substrate processing system |
| JP5105399B2 (ja) * | 2006-08-08 | 2012-12-26 | 東京エレクトロン株式会社 | データ収集方法,基板処理装置,基板処理システム |
| KR101381341B1 (ko) | 2006-10-06 | 2014-04-04 | 가부시끼가이샤 도시바 | 가공 종점 검지방법, 연마방법 및 연마장치 |
| US20080120346A1 (en) * | 2006-11-22 | 2008-05-22 | Anindya Neogi | Purging of stored timeseries data |
| US8078552B2 (en) * | 2008-03-08 | 2011-12-13 | Tokyo Electron Limited | Autonomous adaptive system and method for improving semiconductor manufacturing quality |
| JP5363213B2 (ja) * | 2009-06-30 | 2013-12-11 | 東京エレクトロン株式会社 | 異常検出システム、異常検出方法、記憶媒体及び基板処理装置 |
| JP2011243088A (ja) | 2010-05-20 | 2011-12-01 | Sony Corp | データ処理装置、データ処理方法、及び、プログラム |
| JP5616174B2 (ja) * | 2010-09-14 | 2014-10-29 | 株式会社トプコン | レーザ測量装置 |
| JP5455866B2 (ja) | 2010-10-28 | 2014-03-26 | 株式会社日立製作所 | 異常診断装置および産業機械 |
| JP2012123521A (ja) * | 2010-12-07 | 2012-06-28 | Toppan Printing Co Ltd | 製造装置のプロセス条件と判定条件の自動変更システム |
| JP5764473B2 (ja) | 2011-11-17 | 2015-08-19 | 株式会社日立製作所 | イベントデータ処理装置 |
| JP2013257712A (ja) * | 2012-06-12 | 2013-12-26 | Nippon Telegr & Teleph Corp <Ntt> | 類似部分シーケンス検出装置、方法、及びプログラム |
| JP2014130077A (ja) * | 2012-12-28 | 2014-07-10 | Hitachi High-Technologies Corp | パターン形状評価方法、半導体装置の製造方法及びパターン形状評価装置 |
| EP3101497B1 (en) * | 2014-03-14 | 2020-02-26 | Omron Corporation | Control system |
| US10210606B2 (en) * | 2014-10-14 | 2019-02-19 | Kla-Tencor Corporation | Signal response metrology for image based and scatterometry overlay measurements |
| WO2016162231A1 (en) | 2015-04-10 | 2016-10-13 | Asml Netherlands B.V. | Method and apparatus for inspection and metrology |
| CN112485971B (zh) | 2015-04-21 | 2024-12-03 | 科磊股份有限公司 | 用于倾斜装置设计的计量目标设计 |
| TWI539298B (zh) * | 2015-05-27 | 2016-06-21 | 國立成功大學 | 具取樣率決定機制的量測抽樣方法 與其電腦程式產品 |
| US9983148B2 (en) | 2015-05-28 | 2018-05-29 | Kla-Tencor Corporation | System and method for production line monitoring |
| SG11201710646TA (en) | 2015-08-06 | 2018-01-30 | Ns Solutions Corp | Information processing apparatus, information processing system, information processing method and program |
| JP6599727B2 (ja) | 2015-10-26 | 2019-10-30 | 株式会社Screenホールディングス | 時系列データ処理方法、時系列データ処理プログラム、および、時系列データ処理装置 |
| US20180047646A1 (en) * | 2016-02-24 | 2018-02-15 | Kla-Tencor Corporation | Accuracy improvements in optical metrology |
| CN106548035B (zh) | 2016-11-24 | 2019-08-06 | 腾讯科技(深圳)有限公司 | 一种数据异常的诊断方法及装置 |
-
2018
- 2018-02-08 JP JP2018020797A patent/JP7074489B2/ja active Active
-
2019
- 2019-01-18 KR KR1020190006849A patent/KR102247116B1/ko active Active
- 2019-01-28 TW TW108103095A patent/TWI691047B/zh active
- 2019-01-30 US US16/261,654 patent/US11274995B2/en active Active
- 2019-01-31 CN CN201910096735.1A patent/CN110134077B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7074489B2 (ja) | 2022-05-24 |
| TWI691047B (zh) | 2020-04-11 |
| CN110134077A (zh) | 2019-08-16 |
| US11274995B2 (en) | 2022-03-15 |
| JP2019140194A (ja) | 2019-08-22 |
| US20190242788A1 (en) | 2019-08-08 |
| TW201937690A (zh) | 2019-09-16 |
| KR102247116B1 (ko) | 2021-04-30 |
| KR20190096276A (ko) | 2019-08-19 |
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