JP7047200B1 - めっき装置および基板洗浄方法 - Google Patents

めっき装置および基板洗浄方法 Download PDF

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Publication number
JP7047200B1
JP7047200B1 JP2022505331A JP2022505331A JP7047200B1 JP 7047200 B1 JP7047200 B1 JP 7047200B1 JP 2022505331 A JP2022505331 A JP 2022505331A JP 2022505331 A JP2022505331 A JP 2022505331A JP 7047200 B1 JP7047200 B1 JP 7047200B1
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Prior art keywords
substrate
opening
cleaning
plating
door
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Japanese (ja)
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JPWO2023079634A1 (https=
Inventor
健太郎 山本
正輝 富田
一仁 辻
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Ebara Corp
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Ebara Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022505331A 2021-11-04 2021-11-04 めっき装置および基板洗浄方法 Active JP7047200B1 (ja)

Applications Claiming Priority (1)

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PCT/JP2021/040602 WO2023079634A1 (ja) 2021-11-04 2021-11-04 めっき装置および基板洗浄方法

Publications (2)

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JP7047200B1 true JP7047200B1 (ja) 2022-04-04
JPWO2023079634A1 JPWO2023079634A1 (https=) 2023-05-11

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JP2022505331A Active JP7047200B1 (ja) 2021-11-04 2021-11-04 めっき装置および基板洗浄方法

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US (2) US12264406B2 (https=)
JP (1) JP7047200B1 (https=)
KR (1) KR102499962B1 (https=)
CN (1) CN115461499B (https=)
WO (1) WO2023079634A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7142812B1 (ja) * 2022-06-17 2022-09-27 株式会社荏原製作所 リーク判定方法およびめっき装置
JP7162787B1 (ja) * 2022-06-17 2022-10-28 株式会社荏原製作所 めっき装置
JP7199618B1 (ja) * 2022-08-02 2023-01-05 株式会社荏原製作所 めっき方法、及び、めっき装置
TWI854243B (zh) * 2022-06-17 2024-09-01 日商荏原製作所股份有限公司 鍍覆裝置
TWI864428B (zh) * 2022-08-10 2024-12-01 日商荏原製作所股份有限公司 鍍覆方法及鍍覆裝置
US12546026B2 (en) 2022-08-09 2026-02-10 Ebara Corporation Plating apparatus and plating method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120311280A (zh) * 2024-01-12 2025-07-15 盛美半导体设备(上海)股份有限公司 电镀装置及清洗方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316878A (ja) * 2000-05-02 2001-11-16 Tokyo Electron Ltd 液処理装置および液処理システムならびに液処理方法
JP2003517201A (ja) * 1999-12-17 2003-05-20 ナトゥール・インコーポレイテッド 処理チャンバ、収納チャンバ、処理装置、並びに、処理方法。
JP6934127B1 (ja) * 2020-12-22 2021-09-08 株式会社荏原製作所 めっき装置、プリウェット処理方法及び洗浄処理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280581B1 (en) * 1998-12-29 2001-08-28 David Cheng Method and apparatus for electroplating films on semiconductor wafers
US7029567B2 (en) * 2001-12-21 2006-04-18 Asm Nutool, Inc. Electrochemical edge and bevel cleaning process and system
JP3871613B2 (ja) * 2002-06-06 2007-01-24 株式会社荏原製作所 無電解めっき装置及び方法
JP4189876B2 (ja) 2003-03-04 2008-12-03 株式会社荏原製作所 基板処理装置
JP2006004955A (ja) * 2003-05-30 2006-01-05 Ebara Corp 基板処理装置及び基板処理方法
EP1652222A1 (en) * 2003-08-07 2006-05-03 Ebara Corporation Substrate processing apparatus, substrate processing method, and substrate holding apparatus
JP2005264245A (ja) 2004-03-18 2005-09-29 Ebara Corp 基板の湿式処理方法及び処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003517201A (ja) * 1999-12-17 2003-05-20 ナトゥール・インコーポレイテッド 処理チャンバ、収納チャンバ、処理装置、並びに、処理方法。
JP2001316878A (ja) * 2000-05-02 2001-11-16 Tokyo Electron Ltd 液処理装置および液処理システムならびに液処理方法
JP6934127B1 (ja) * 2020-12-22 2021-09-08 株式会社荏原製作所 めっき装置、プリウェット処理方法及び洗浄処理方法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116097077B (zh) * 2022-06-17 2024-02-27 株式会社荏原制作所 泄漏判定方法以及镀覆装置
JP7162787B1 (ja) * 2022-06-17 2022-10-28 株式会社荏原製作所 めっき装置
TWI854243B (zh) * 2022-06-17 2024-09-01 日商荏原製作所股份有限公司 鍍覆裝置
CN116097077A (zh) * 2022-06-17 2023-05-09 株式会社荏原制作所 泄漏判定方法以及镀覆装置
KR102612855B1 (ko) 2022-06-17 2023-12-13 가부시키가이샤 에바라 세이사꾸쇼 누설 판정 방법 및 도금 장치
WO2023243078A1 (ja) * 2022-06-17 2023-12-21 株式会社荏原製作所 リーク判定方法およびめっき装置
WO2023243079A1 (ja) * 2022-06-17 2023-12-21 株式会社荏原製作所 めっき装置
KR102617632B1 (ko) 2022-06-17 2023-12-27 가부시키가이샤 에바라 세이사꾸쇼 도금 장치
JP7142812B1 (ja) * 2022-06-17 2022-09-27 株式会社荏原製作所 リーク判定方法およびめっき装置
WO2024028973A1 (ja) * 2022-08-02 2024-02-08 株式会社荏原製作所 めっき方法、及び、めっき装置
JP7199618B1 (ja) * 2022-08-02 2023-01-05 株式会社荏原製作所 めっき方法、及び、めっき装置
CN119013440A (zh) * 2022-08-02 2024-11-22 株式会社荏原制作所 镀覆方法以及镀覆装置
US12351933B2 (en) 2022-08-02 2025-07-08 Ebara Corporation Plating method and plating apparatus
CN119013440B (zh) * 2022-08-02 2025-08-08 株式会社荏原制作所 镀覆方法以及镀覆装置
US12546026B2 (en) 2022-08-09 2026-02-10 Ebara Corporation Plating apparatus and plating method
TWI864428B (zh) * 2022-08-10 2024-12-01 日商荏原製作所股份有限公司 鍍覆方法及鍍覆裝置

Also Published As

Publication number Publication date
CN115461499A (zh) 2022-12-09
JPWO2023079634A1 (https=) 2023-05-11
WO2023079634A1 (ja) 2023-05-11
US20250198040A1 (en) 2025-06-19
KR102499962B1 (ko) 2023-02-16
CN115461499B (zh) 2023-04-18
US12264406B2 (en) 2025-04-01
US20240209538A1 (en) 2024-06-27

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