JPWO2023079634A1 - - Google Patents
Info
- Publication number
- JPWO2023079634A1 JPWO2023079634A1 JP2022505331A JP2022505331A JPWO2023079634A1 JP WO2023079634 A1 JPWO2023079634 A1 JP WO2023079634A1 JP 2022505331 A JP2022505331 A JP 2022505331A JP 2022505331 A JP2022505331 A JP 2022505331A JP WO2023079634 A1 JPWO2023079634 A1 JP WO2023079634A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/040602 WO2023079634A1 (ja) | 2021-11-04 | 2021-11-04 | めっき装置および基板洗浄方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP7047200B1 JP7047200B1 (ja) | 2022-04-04 |
| JPWO2023079634A1 true JPWO2023079634A1 (https=) | 2023-05-11 |
Family
ID=81256622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022505331A Active JP7047200B1 (ja) | 2021-11-04 | 2021-11-04 | めっき装置および基板洗浄方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US12264406B2 (https=) |
| JP (1) | JP7047200B1 (https=) |
| KR (1) | KR102499962B1 (https=) |
| CN (1) | CN115461499B (https=) |
| WO (1) | WO2023079634A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI854243B (zh) * | 2022-06-17 | 2024-09-01 | 日商荏原製作所股份有限公司 | 鍍覆裝置 |
| CN116097077B (zh) * | 2022-06-17 | 2024-02-27 | 株式会社荏原制作所 | 泄漏判定方法以及镀覆装置 |
| US20240271313A1 (en) * | 2022-06-17 | 2024-08-15 | Ebara Corporation | Plating apparatus |
| KR102595617B1 (ko) * | 2022-08-02 | 2023-10-31 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금 방법 및 도금 장치 |
| CN116897226B (zh) | 2022-08-09 | 2024-03-22 | 株式会社荏原制作所 | 镀覆装置以及镀覆方法 |
| TWI864428B (zh) * | 2022-08-10 | 2024-12-01 | 日商荏原製作所股份有限公司 | 鍍覆方法及鍍覆裝置 |
| CN120311280A (zh) * | 2024-01-12 | 2025-07-15 | 盛美半导体设备(上海)股份有限公司 | 电镀装置及清洗方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6280581B1 (en) * | 1998-12-29 | 2001-08-28 | David Cheng | Method and apparatus for electroplating films on semiconductor wafers |
| US6352623B1 (en) * | 1999-12-17 | 2002-03-05 | Nutool, Inc. | Vertically configured chamber used for multiple processes |
| JP2001316878A (ja) * | 2000-05-02 | 2001-11-16 | Tokyo Electron Ltd | 液処理装置および液処理システムならびに液処理方法 |
| US7029567B2 (en) * | 2001-12-21 | 2006-04-18 | Asm Nutool, Inc. | Electrochemical edge and bevel cleaning process and system |
| JP3871613B2 (ja) * | 2002-06-06 | 2007-01-24 | 株式会社荏原製作所 | 無電解めっき装置及び方法 |
| JP4189876B2 (ja) | 2003-03-04 | 2008-12-03 | 株式会社荏原製作所 | 基板処理装置 |
| JP2006004955A (ja) * | 2003-05-30 | 2006-01-05 | Ebara Corp | 基板処理装置及び基板処理方法 |
| EP1652222A1 (en) * | 2003-08-07 | 2006-05-03 | Ebara Corporation | Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
| JP2005264245A (ja) | 2004-03-18 | 2005-09-29 | Ebara Corp | 基板の湿式処理方法及び処理装置 |
| CN114981486B (zh) * | 2020-12-22 | 2023-03-24 | 株式会社荏原制作所 | 镀覆装置、预湿处理方法以及清洗处理方法 |
-
2021
- 2021-11-04 WO PCT/JP2021/040602 patent/WO2023079634A1/ja not_active Ceased
- 2021-11-04 CN CN202180030228.3A patent/CN115461499B/zh active Active
- 2021-11-04 US US17/802,400 patent/US12264406B2/en active Active
- 2021-11-04 JP JP2022505331A patent/JP7047200B1/ja active Active
- 2021-11-04 KR KR1020227030958A patent/KR102499962B1/ko active Active
-
2025
- 2025-02-25 US US19/063,112 patent/US20250198040A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN115461499A (zh) | 2022-12-09 |
| WO2023079634A1 (ja) | 2023-05-11 |
| US20250198040A1 (en) | 2025-06-19 |
| KR102499962B1 (ko) | 2023-02-16 |
| CN115461499B (zh) | 2023-04-18 |
| US12264406B2 (en) | 2025-04-01 |
| JP7047200B1 (ja) | 2022-04-04 |
| US20240209538A1 (en) | 2024-06-27 |
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