KR102499962B1 - 도금 장치 및 기판 세정 방법 - Google Patents

도금 장치 및 기판 세정 방법 Download PDF

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Publication number
KR102499962B1
KR102499962B1 KR1020227030958A KR20227030958A KR102499962B1 KR 102499962 B1 KR102499962 B1 KR 102499962B1 KR 1020227030958 A KR1020227030958 A KR 1020227030958A KR 20227030958 A KR20227030958 A KR 20227030958A KR 102499962 B1 KR102499962 B1 KR 102499962B1
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KR
South Korea
Prior art keywords
substrate
opening
cleaning
plating
door
Prior art date
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KR1020227030958A
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English (en)
Korean (ko)
Inventor
겐타로 야마모토
마사키 도미타
가즈히토 즈지
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020227030958A 2021-11-04 2021-11-04 도금 장치 및 기판 세정 방법 Active KR102499962B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/040602 WO2023079634A1 (ja) 2021-11-04 2021-11-04 めっき装置および基板洗浄方法

Publications (1)

Publication Number Publication Date
KR102499962B1 true KR102499962B1 (ko) 2023-02-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227030958A Active KR102499962B1 (ko) 2021-11-04 2021-11-04 도금 장치 및 기판 세정 방법

Country Status (5)

Country Link
US (2) US12264406B2 (https=)
JP (1) JP7047200B1 (https=)
KR (1) KR102499962B1 (https=)
CN (1) CN115461499B (https=)
WO (1) WO2023079634A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI854243B (zh) * 2022-06-17 2024-09-01 日商荏原製作所股份有限公司 鍍覆裝置
CN116097077B (zh) * 2022-06-17 2024-02-27 株式会社荏原制作所 泄漏判定方法以及镀覆装置
US20240271313A1 (en) * 2022-06-17 2024-08-15 Ebara Corporation Plating apparatus
KR102595617B1 (ko) * 2022-08-02 2023-10-31 가부시키가이샤 에바라 세이사꾸쇼 도금 방법 및 도금 장치
CN116897226B (zh) 2022-08-09 2024-03-22 株式会社荏原制作所 镀覆装置以及镀覆方法
TWI864428B (zh) * 2022-08-10 2024-12-01 日商荏原製作所股份有限公司 鍍覆方法及鍍覆裝置
CN120311280A (zh) * 2024-01-12 2025-07-15 盛美半导体设备(上海)股份有限公司 电镀装置及清洗方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004010961A (ja) * 2002-06-06 2004-01-15 Ebara Corp 基板処理装置
JP2004263287A (ja) * 2003-03-04 2004-09-24 Ebara Corp 基板処理装置及び基板処理方法
JP2005264245A (ja) * 2004-03-18 2005-09-29 Ebara Corp 基板の湿式処理方法及び処理装置
JP2006004955A (ja) * 2003-05-30 2006-01-05 Ebara Corp 基板処理装置及び基板処理方法
JP6934127B1 (ja) 2020-12-22 2021-09-08 株式会社荏原製作所 めっき装置、プリウェット処理方法及び洗浄処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280581B1 (en) * 1998-12-29 2001-08-28 David Cheng Method and apparatus for electroplating films on semiconductor wafers
US6352623B1 (en) * 1999-12-17 2002-03-05 Nutool, Inc. Vertically configured chamber used for multiple processes
JP2001316878A (ja) * 2000-05-02 2001-11-16 Tokyo Electron Ltd 液処理装置および液処理システムならびに液処理方法
US7029567B2 (en) * 2001-12-21 2006-04-18 Asm Nutool, Inc. Electrochemical edge and bevel cleaning process and system
EP1652222A1 (en) * 2003-08-07 2006-05-03 Ebara Corporation Substrate processing apparatus, substrate processing method, and substrate holding apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004010961A (ja) * 2002-06-06 2004-01-15 Ebara Corp 基板処理装置
JP2004263287A (ja) * 2003-03-04 2004-09-24 Ebara Corp 基板処理装置及び基板処理方法
JP2006004955A (ja) * 2003-05-30 2006-01-05 Ebara Corp 基板処理装置及び基板処理方法
JP2005264245A (ja) * 2004-03-18 2005-09-29 Ebara Corp 基板の湿式処理方法及び処理装置
JP6934127B1 (ja) 2020-12-22 2021-09-08 株式会社荏原製作所 めっき装置、プリウェット処理方法及び洗浄処理方法

Also Published As

Publication number Publication date
CN115461499A (zh) 2022-12-09
JPWO2023079634A1 (https=) 2023-05-11
WO2023079634A1 (ja) 2023-05-11
US20250198040A1 (en) 2025-06-19
CN115461499B (zh) 2023-04-18
US12264406B2 (en) 2025-04-01
JP7047200B1 (ja) 2022-04-04
US20240209538A1 (en) 2024-06-27

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