JP7039259B2 - プローブヘッド - Google Patents

プローブヘッド Download PDF

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Publication number
JP7039259B2
JP7039259B2 JP2017221180A JP2017221180A JP7039259B2 JP 7039259 B2 JP7039259 B2 JP 7039259B2 JP 2017221180 A JP2017221180 A JP 2017221180A JP 2017221180 A JP2017221180 A JP 2017221180A JP 7039259 B2 JP7039259 B2 JP 7039259B2
Authority
JP
Japan
Prior art keywords
probe
ground
pin block
measuring instrument
probe head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017221180A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019090760A (ja
JP2019090760A5 (enExample
Inventor
喜彦 櫻井
宏 石槫
大輔 細川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokowo Co Ltd
Original Assignee
Yokowo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokowo Co Ltd filed Critical Yokowo Co Ltd
Priority to JP2017221180A priority Critical patent/JP7039259B2/ja
Priority to PCT/JP2018/041083 priority patent/WO2019098079A1/ja
Priority to US16/764,599 priority patent/US11519938B2/en
Priority to EP18878712.1A priority patent/EP3712622A4/en
Priority to TW107140577A priority patent/TWI788461B/zh
Publication of JP2019090760A publication Critical patent/JP2019090760A/ja
Publication of JP2019090760A5 publication Critical patent/JP2019090760A5/ja
Application granted granted Critical
Publication of JP7039259B2 publication Critical patent/JP7039259B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07321—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Optical Head (AREA)
JP2017221180A 2017-11-16 2017-11-16 プローブヘッド Active JP7039259B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017221180A JP7039259B2 (ja) 2017-11-16 2017-11-16 プローブヘッド
PCT/JP2018/041083 WO2019098079A1 (ja) 2017-11-16 2018-11-06 プローブヘッド
US16/764,599 US11519938B2 (en) 2017-11-16 2018-11-06 Probe head
EP18878712.1A EP3712622A4 (en) 2017-11-16 2018-11-06 PROBE HEAD
TW107140577A TWI788461B (zh) 2017-11-16 2018-11-15 探針頭

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017221180A JP7039259B2 (ja) 2017-11-16 2017-11-16 プローブヘッド

Publications (3)

Publication Number Publication Date
JP2019090760A JP2019090760A (ja) 2019-06-13
JP2019090760A5 JP2019090760A5 (enExample) 2020-11-05
JP7039259B2 true JP7039259B2 (ja) 2022-03-22

Family

ID=66539582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017221180A Active JP7039259B2 (ja) 2017-11-16 2017-11-16 プローブヘッド

Country Status (5)

Country Link
US (1) US11519938B2 (enExample)
EP (1) EP3712622A4 (enExample)
JP (1) JP7039259B2 (enExample)
TW (1) TWI788461B (enExample)
WO (1) WO2019098079A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018204106A1 (de) * 2018-03-16 2019-09-19 Feinmetall Gmbh Prüfkarte zum elektrischen Verbinden eines Prüflings mit einer elektrischen Prüfeinrichtung
US11150269B2 (en) * 2019-08-15 2021-10-19 Mpi Corporation Probe head for high frequency signal test and medium or low frequency signal test at the same time
TWI845707B (zh) * 2019-08-15 2024-06-21 旺矽科技股份有限公司 可同時用於高頻及中低頻訊號測試之探針頭
TWI838543B (zh) * 2019-08-15 2024-04-11 旺矽科技股份有限公司 可同時用於高頻及中低頻訊號測試之探針頭
US11215641B2 (en) * 2019-12-24 2022-01-04 Teradyne, Inc. Probe card assembly in automated test equipment
JP7449582B2 (ja) * 2021-06-28 2024-03-14 株式会社 東京ウエルズ 電子部品の負荷印加システム
JPWO2024053638A1 (enExample) * 2022-09-06 2024-03-14
CN118584161A (zh) * 2023-03-03 2024-09-03 华为技术有限公司 一种探针装置、检测装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005241505A (ja) 2004-02-27 2005-09-08 Matsushita Electric Ind Co Ltd 半導体テスト用ソケットおよび半導体テスト装置
JP2007178165A (ja) 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
WO2007125974A1 (ja) 2006-04-28 2007-11-08 Nhk Spring Co., Ltd. 導電性接触子ホルダ
JP2016070863A (ja) 2014-10-01 2016-05-09 日本発條株式会社 プローブユニット

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6180067A (ja) * 1984-09-21 1986-04-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション テスト・プロ−ブ装置
JP2847309B2 (ja) * 1990-01-08 1999-01-20 東京エレクトロン株式会社 プローブ装置
JP4251855B2 (ja) * 2002-11-19 2009-04-08 株式会社ヨコオ 高周波・高速用デバイスの検査治具の製法
JP2005049163A (ja) * 2003-07-31 2005-02-24 Yokowo Co Ltd 高周波・高速用デバイスの検査治具および検査用プローブ
JP4535828B2 (ja) * 2004-09-30 2010-09-01 株式会社ヨコオ 検査ユニットの製法
JP2009043640A (ja) * 2007-08-10 2009-02-26 Micronics Japan Co Ltd 電気接続器及びこれを用いた電気的接続装置
US7663387B2 (en) * 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket
JP2010237133A (ja) 2009-03-31 2010-10-21 Yokowo Co Ltd 検査ソケットおよびその製法
JP5841425B2 (ja) 2011-12-27 2016-01-13 株式会社エンプラス 電気部品用ソケットのコンタクトユニット
KR101882209B1 (ko) * 2016-03-23 2018-07-27 리노공업주식회사 동축 테스트소켓 조립체

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005241505A (ja) 2004-02-27 2005-09-08 Matsushita Electric Ind Co Ltd 半導体テスト用ソケットおよび半導体テスト装置
JP2007178165A (ja) 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニット
WO2007125974A1 (ja) 2006-04-28 2007-11-08 Nhk Spring Co., Ltd. 導電性接触子ホルダ
JP2016070863A (ja) 2014-10-01 2016-05-09 日本発條株式会社 プローブユニット

Also Published As

Publication number Publication date
EP3712622A4 (en) 2021-08-11
EP3712622A1 (en) 2020-09-23
JP2019090760A (ja) 2019-06-13
TWI788461B (zh) 2023-01-01
US11519938B2 (en) 2022-12-06
US20200393496A1 (en) 2020-12-17
WO2019098079A1 (ja) 2019-05-23
TW201923359A (zh) 2019-06-16

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