JP7037569B2 - 回路基板をテストするためのテスト装置および方法 - Google Patents

回路基板をテストするためのテスト装置および方法 Download PDF

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Publication number
JP7037569B2
JP7037569B2 JP2019541701A JP2019541701A JP7037569B2 JP 7037569 B2 JP7037569 B2 JP 7037569B2 JP 2019541701 A JP2019541701 A JP 2019541701A JP 2019541701 A JP2019541701 A JP 2019541701A JP 7037569 B2 JP7037569 B2 JP 7037569B2
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test
circuit board
sub
shuttle
area
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Japanese (ja)
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JP2020507762A (ja
Inventor
クリスティアン ヴァインデル
ベルント－ウルリッヒ オット
ペーター ブラント
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Xcerra Corp
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Xcerra Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
JP2019541701A 2017-02-10 2018-02-09 回路基板をテストするためのテスト装置および方法 Active JP7037569B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017102700.9A DE102017102700A1 (de) 2017-02-10 2017-02-10 Prüfvorrichtung und Verfahren zum Prüfen von Leiterplatten
DE102017102700.9 2017-02-10
PCT/EP2018/053236 WO2018146234A1 (fr) 2017-02-10 2018-02-09 Dispositif de test et procédé de test de cartes de circuits imprimés

Publications (2)

Publication Number Publication Date
JP2020507762A JP2020507762A (ja) 2020-03-12
JP7037569B2 true JP7037569B2 (ja) 2022-03-16

Family

ID=61569210

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JP2019541701A Active JP7037569B2 (ja) 2017-02-10 2018-02-09 回路基板をテストするためのテスト装置および方法

Country Status (8)

Country Link
US (1) US11061065B2 (fr)
EP (2) EP3580576B1 (fr)
JP (1) JP7037569B2 (fr)
KR (1) KR102272152B1 (fr)
CN (1) CN110383091B (fr)
DE (1) DE102017102700A1 (fr)
TW (1) TWI679437B (fr)
WO (1) WO2018146234A1 (fr)

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* Cited by examiner, † Cited by third party
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CN112014600B (zh) * 2019-05-31 2023-11-24 三赢科技（深圳）有限公司 测试治具及测试机台
CN112305405A (zh) * 2020-10-12 2021-02-02 景旺电子科技(珠海)有限公司 线路板四线测试系统及测试方法
CN113866587B (zh) * 2021-08-20 2024-05-24 苏州国科测试科技有限公司 一种飞针测试设备
CN118091472B (zh) * 2024-04-17 2024-09-17 宁德时代新能源科技股份有限公司 电池测试系统和电池测试方法

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JP2009168601A (ja) 2008-01-16 2009-07-30 Hioki Ee Corp 回路基板検査装置
JP2016511410A (ja) 2013-03-13 2016-04-14 エクセラ・コーポレーションＸｃｅｒｒａ Ｃｏｒｐ． プリント回路基板のテスト装置のクロスメンバユニット及びそのクロスメンバユニットを有するテスト装置

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Publication number Priority date Publication date Assignee Title
US20030020504A1 (en) 2001-07-26 2003-01-30 Abdulky Obaida A. Universal flying probe fixture
JP2008546991A (ja) 2005-06-17 2008-12-25 アーテーゲー ルーテル ウント メルツァー ゲーエムベーハー フィンガーテスターを用いて、コンポーネント化されていない大型印刷回路基板を検査する方法
JP2009168601A (ja) 2008-01-16 2009-07-30 Hioki Ee Corp 回路基板検査装置
JP2016511410A (ja) 2013-03-13 2016-04-14 エクセラ・コーポレーションＸｃｅｒｒａ Ｃｏｒｐ． プリント回路基板のテスト装置のクロスメンバユニット及びそのクロスメンバユニットを有するテスト装置

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Publication number Publication date
JP2020507762A (ja) 2020-03-12
CN110383091A (zh) 2019-10-25
CN110383091B (zh) 2022-01-04
EP4220203A1 (fr) 2023-08-02
DE102017102700A1 (de) 2018-09-13
EP3580576A1 (fr) 2019-12-18
KR20190117010A (ko) 2019-10-15
WO2018146234A1 (fr) 2018-08-16
US20200011924A1 (en) 2020-01-09
TW201835593A (zh) 2018-10-01
KR102272152B1 (ko) 2021-07-02
EP3580576B1 (fr) 2023-04-05
US11061065B2 (en) 2021-07-13
TWI679437B (zh) 2019-12-11

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