JP7030535B2 - パワー半導体装置 - Google Patents

パワー半導体装置 Download PDF

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Publication number
JP7030535B2
JP7030535B2 JP2018005308A JP2018005308A JP7030535B2 JP 7030535 B2 JP7030535 B2 JP 7030535B2 JP 2018005308 A JP2018005308 A JP 2018005308A JP 2018005308 A JP2018005308 A JP 2018005308A JP 7030535 B2 JP7030535 B2 JP 7030535B2
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JP
Japan
Prior art keywords
power semiconductor
conductor
protective film
power
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018005308A
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English (en)
Japanese (ja)
Other versions
JP2019125700A (ja
JP2019125700A5 (enrdf_load_stackoverflow
Inventor
ひろみ 島津
尚史 谷江
晃 松下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Priority to JP2018005308A priority Critical patent/JP7030535B2/ja
Priority to PCT/JP2018/045404 priority patent/WO2019142543A1/ja
Publication of JP2019125700A publication Critical patent/JP2019125700A/ja
Publication of JP2019125700A5 publication Critical patent/JP2019125700A5/ja
Application granted granted Critical
Publication of JP7030535B2 publication Critical patent/JP7030535B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
JP2018005308A 2018-01-17 2018-01-17 パワー半導体装置 Active JP7030535B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018005308A JP7030535B2 (ja) 2018-01-17 2018-01-17 パワー半導体装置
PCT/JP2018/045404 WO2019142543A1 (ja) 2018-01-17 2018-12-11 パワー半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018005308A JP7030535B2 (ja) 2018-01-17 2018-01-17 パワー半導体装置

Publications (3)

Publication Number Publication Date
JP2019125700A JP2019125700A (ja) 2019-07-25
JP2019125700A5 JP2019125700A5 (enrdf_load_stackoverflow) 2020-08-20
JP7030535B2 true JP7030535B2 (ja) 2022-03-07

Family

ID=67301014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018005308A Active JP7030535B2 (ja) 2018-01-17 2018-01-17 パワー半導体装置

Country Status (2)

Country Link
JP (1) JP7030535B2 (enrdf_load_stackoverflow)
WO (1) WO2019142543A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023166635A (ja) * 2020-10-01 2023-11-22 京セラドキュメントソリューションズ株式会社 流体冷却式コールドプレート及び流体冷却式コールドプレートの製造方法
JP7554169B2 (ja) 2021-09-30 2024-09-19 株式会社日立産機システム 電力変換装置
JP2025087361A (ja) * 2023-11-29 2025-06-10 Ａｓｔｅｍｏ株式会社 パワー半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066377A (ja) 2009-08-18 2011-03-31 Denso Corp 半導体装置およびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066377A (ja) 2009-08-18 2011-03-31 Denso Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
WO2019142543A1 (ja) 2019-07-25
JP2019125700A (ja) 2019-07-25

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