JP2019125700A5 - - Google Patents

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Publication number
JP2019125700A5
JP2019125700A5 JP2018005308A JP2018005308A JP2019125700A5 JP 2019125700 A5 JP2019125700 A5 JP 2019125700A5 JP 2018005308 A JP2018005308 A JP 2018005308A JP 2018005308 A JP2018005308 A JP 2018005308A JP 2019125700 A5 JP2019125700 A5 JP 2019125700A5
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JP
Japan
Prior art keywords
semiconductor device
power semiconductor
wiring
protrusion
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018005308A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019125700A (ja
JP7030535B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018005308A priority Critical patent/JP7030535B2/ja
Priority claimed from JP2018005308A external-priority patent/JP7030535B2/ja
Priority to PCT/JP2018/045404 priority patent/WO2019142543A1/ja
Publication of JP2019125700A publication Critical patent/JP2019125700A/ja
Publication of JP2019125700A5 publication Critical patent/JP2019125700A5/ja
Application granted granted Critical
Publication of JP7030535B2 publication Critical patent/JP7030535B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018005308A 2018-01-17 2018-01-17 パワー半導体装置 Active JP7030535B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018005308A JP7030535B2 (ja) 2018-01-17 2018-01-17 パワー半導体装置
PCT/JP2018/045404 WO2019142543A1 (ja) 2018-01-17 2018-12-11 パワー半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018005308A JP7030535B2 (ja) 2018-01-17 2018-01-17 パワー半導体装置

Publications (3)

Publication Number Publication Date
JP2019125700A JP2019125700A (ja) 2019-07-25
JP2019125700A5 true JP2019125700A5 (enrdf_load_stackoverflow) 2020-08-20
JP7030535B2 JP7030535B2 (ja) 2022-03-07

Family

ID=67301014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018005308A Active JP7030535B2 (ja) 2018-01-17 2018-01-17 パワー半導体装置

Country Status (2)

Country Link
JP (1) JP7030535B2 (enrdf_load_stackoverflow)
WO (1) WO2019142543A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023166635A (ja) * 2020-10-01 2023-11-22 京セラドキュメントソリューションズ株式会社 流体冷却式コールドプレート及び流体冷却式コールドプレートの製造方法
JP7554169B2 (ja) 2021-09-30 2024-09-19 株式会社日立産機システム 電力変換装置
JP2025087361A (ja) * 2023-11-29 2025-06-10 Ａｓｔｅｍｏ株式会社 パワー半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066371A (ja) 2009-08-18 2011-03-31 Denso Corp 半導体装置およびその製造方法

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