JP7028650B2 - 剥離装置 - Google Patents
剥離装置 Download PDFInfo
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- JP7028650B2 JP7028650B2 JP2018002567A JP2018002567A JP7028650B2 JP 7028650 B2 JP7028650 B2 JP 7028650B2 JP 2018002567 A JP2018002567 A JP 2018002567A JP 2018002567 A JP2018002567 A JP 2018002567A JP 7028650 B2 JP7028650 B2 JP 7028650B2
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- 239000011347 resin Substances 0.000 claims description 162
- 229920005989 resin Polymers 0.000 claims description 162
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- 238000003384 imaging method Methods 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 description 138
- 239000007788 liquid Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
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- 241000872198 Serjania polyphylla Species 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
よって、ウェーハWからフィルムS2と共に樹脂層S1を剥離する場合には、樹脂層S1が剥離されたウェーハWに研削不良の要因になる樹脂残りが有るか否かを判断できるようにするという課題がある。
可動部材63は、例えば、ボールネジ60に螺合する側部630と、側部630の上端から+X方向側に向かって突き出るピン台部631とを備えている。ピン台部631の上面には、上方に突き出る例えば2本の突き出しピン64がX軸方向に所定距離だけ離れて配設されている。モータ62がボールネジ60を回動させると、これに伴い可動部材63がガイドレール61にガイドされてY軸方向に移動し、可動部材63上の突き出しピン64が、載置テーブル5の各直線材50間の隙間を通るようにしてY軸方向に移動する。
なお、剥離手段4は、保持手段2と把持手段3とを相対的にウェーハWの外周縁Wdから中心に向かって径方向に移動させウェーハWから樹脂層S1を剥離するものであればよいため、把持手段3はY軸方向には移動せず、保持手段2のみがY軸方向に移動することにより樹脂層S1を剥離する構成としてもよい。
次いで、例えば、剥離手段4による把持手段3の移動及びY軸方向移動手段12による保持手段2の移動が停止する。図5に示すように、撮像手段移動手段81が撮像手段80を-Y方向側に移動させることで、撮像手段80が保持手段2により保持されたウェーハWの下方を通過していく。この通過の際に、ウェーハWの一方の面Waが、撮像手段80の撮像部800によってウェーハWの+Y方向側の外周縁Wdから-Y方向側の外周縁Wdまで連続的に1ラインずつ撮像される。即ち、照明801がウェーハWの一方の面Waに光を照射し、ウェーハWの一方の面Waからの反射光が図示しない光学系を介して撮像部800のCCDの各画素に入射する。
なお、撮像手段80をY軸方向に移動させず、保持手段2のみがY軸方向に移動することにより、樹脂層S1が剥離されたウェーハWの一方の面Waが撮像手段80により撮像される構成としてもよい。保持手段2の保持パッド21がZ軸方向の軸心周りに回転する場合には、撮像手段80を保持手段2の中心下方に位置させ保持パッド21を所定の速度で回転させつつ、撮像手段80によってウェーハWの一方の面Waの撮像を行ってもよい。
形成された撮像画の1ピクセル毎における輝度値、即ち、撮像部800のCCDの各1画素に入射した光量は、その1画素に対応する樹脂層S1の残りの多寡によって定まる。即ち、樹脂残りの量が多いほど入射光量は減りその1ピクセルは輝度値が0に近づいて黒色に近づき、樹脂残りの量が少ないほど入射光量は増えその1ピクセルは輝度値255に近づいて白色に近づく。
なお、第1の判断部191により1ピクセル毎の樹脂残りの有無が判断された後のウェーハWの一方の面Wa全面が写った撮像画は、さらに、第1の判断部191により閾値130で二値化されてから出力画面Bに表示されてもよい。この場合には、輝度値が130を超えており樹脂残りが無いと判断されたピクセルは輝度値0(白)となり出力画面Bには表示されなくなり、輝度値が130を以下で樹脂残りが有ると判断されたピクセルは輝度値255(黒)となり出力画面Bに表示される。
第2の判断部192は、ウェーハWの一方の面Waの面積に対する樹脂残りのある総面積の割合U%と予め設定されている許容割合V%とを比較して、ウェーハWの一方の面Waに研削に悪影響を及ぼす樹脂残りが有るか無いかを判断する。
第1の判断部191が撮像画の1ピクセル毎に樹脂残りの有る無しを判断した後の、第2の判断部192による撮像画から研削に悪影響を及ぼす樹脂残りが有るか無いか判断は、以下に示すように実施されてもよい。
第1の判断部191による撮像画の1ピクセル毎の樹脂残りの有無の判断までは、実施形態1と同様に実施される。その後、第2の判断部192は、図6に示す第1の判断部191が樹脂残りが有ると判断した各ピクセルが隣接しているか否かを判断していく。第2の判断部192は、図6に示す例においては、樹脂残りがあるピクセル(実線で示す2つのピクセル)がY軸方向において隣接していると判断し、また、樹脂残りがあるピクセル(実線で示す2つのピクセル)が斜め方向において隣接していると判断して、研削で悪影響を及ぼす大きさの樹脂残りが有ると判断し、該判断を発報する。その結果、ウェーハWに対して樹脂残りのこすり落とし等が実施され、研削砥石の研削面に研削に悪影響を及ぼす樹脂残りが付着しないようになり、研削不良の発生を防ぐことが可能となる。
一方で、樹脂残りが有ると判断された各ピクセルで隣接するものが無いと判断した場合には、第2の判断部192は、研削で悪影響を及ぼす大きさの樹脂残りが無いと判断し、ウェーハWは研削装置に搬送される。
例えば、第2の判断部192は、実施形態1のウェーハの一方の面の樹脂残りの有無の判断を行った後に、さらに、実施形態2のウェーハの一方の面の樹脂残りの有無の判断を行ってもよい。
12:Y軸方向移動手段 120:ボールネジ 121:可動板 122:モータ
13:Z軸方向移動手段 130:ボールネジ 131:可動板 132:モータ
140:テーブル保持台 141:受け渡しテーブル
18:回転ローラ
2:保持手段 20:アーム部 21:保持パッド 210:吸着部 210a:保持面211:枠体 212:吸引管 213:吸引源
3:把持手段 30:スピンドル 31:ハウジング 32:把持クランプ
4:剥離手段 40:ボールネジ 41:一対のガイドレール 42:モータ 43:可動ブロック
5:載置テーブル 50:直線材
6:落下手段 60:ボールネジ 61:一対のガイドレール 62:モータ 63:可動部材 631:ピン台部 64:突き出しピン
7:ボックス 79:光センサ 790:発光部 791:受光部
80:撮像手段 800:撮像部 801:照明
81:撮像手段移動手段 810:ボールネジ 812:モータ 813:可動ブロック
19:制御手段 191:第1の判断部 192:第2の判断部
90保持テーブル 90a:保持面 91:樹脂供給装置 92:保持手段 93:紫外線照射機構 94:研削装置 940:チャックテーブル 941:研削ホイール
W:ウェーハ Wa:ウェーハの一方の面 Wb:ウェーハの他方の面 Wd:ウェーハの外周縁 S1:樹脂層 S2:フィルム S2a:はみ出し部
Claims (1)
- ウェーハの一方の面に形成された樹脂層を介してフィルムが固着し該フィルムがウェーハの外周縁からはみ出してはみ出し部が形成されたウェーハから、該はみ出し部を把持して該フィルムと共に該樹脂層を剥離する剥離装置であって、
ウェーハの他方の面を保持する保持面を有する保持手段と、
該保持手段が保持したウェーハの該はみ出し部を把持する把持手段と、
該把持手段と該保持手段とを相対的にウェーハの外周縁から中心に向かって径方向に移動させウェーハの一方の面から該樹脂層を剥離する剥離手段と、
該樹脂層が剥離されたウェーハの一方の面を撮像する撮像手段と、
該撮像手段が撮像した撮像画の1ピクセルの明るさによって該1ピクセルにおいて樹脂残りが有るか無いかを判断する第1の判断部と、
該第1の判断部が該撮像画の1ピクセル毎に樹脂残りの有る無しを判断した後、該撮像画から研削に悪影響を及ぼす樹脂残りが有るか無いかを判断する第2の判断部と、を備え、
該第2の判断部は、該第1の判断部が樹脂残りが有ると判断したピクセルに隣接するピクセルも樹脂残りが有ると判断したら、研削で悪影響を及ぼす樹脂残りが有ると判断する剥離装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018002567A JP7028650B2 (ja) | 2018-01-11 | 2018-01-11 | 剥離装置 |
CN201910006781.8A CN110034060B (zh) | 2018-01-11 | 2019-01-04 | 剥离装置 |
KR1020190001595A KR102654620B1 (ko) | 2018-01-11 | 2019-01-07 | 박리 장치 |
US16/242,640 US10896830B2 (en) | 2018-01-11 | 2019-01-08 | Separating apparatus |
TW108100691A TWI778206B (zh) | 2018-01-11 | 2019-01-08 | 剝離裝置 |
DE102019200226.9A DE102019200226A1 (de) | 2018-01-11 | 2019-01-10 | Trennvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018002567A JP7028650B2 (ja) | 2018-01-11 | 2018-01-11 | 剥離装置 |
Publications (2)
Publication Number | Publication Date |
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JP2019121756A JP2019121756A (ja) | 2019-07-22 |
JP7028650B2 true JP7028650B2 (ja) | 2022-03-02 |
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Application Number | Title | Priority Date | Filing Date |
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JP2018002567A Active JP7028650B2 (ja) | 2018-01-11 | 2018-01-11 | 剥離装置 |
Country Status (6)
Country | Link |
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US (1) | US10896830B2 (ja) |
JP (1) | JP7028650B2 (ja) |
KR (1) | KR102654620B1 (ja) |
CN (1) | CN110034060B (ja) |
DE (1) | DE102019200226A1 (ja) |
TW (1) | TWI778206B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005191179A (ja) | 2003-12-25 | 2005-07-14 | Trecenti Technologies Inc | 半導体装置の製造方法および研磨装置 |
JP2008051670A (ja) | 2006-08-25 | 2008-03-06 | Dainippon Printing Co Ltd | 樹脂膜割れ検出装置及び方法 |
JP2017224671A (ja) | 2016-06-14 | 2017-12-21 | 株式会社ディスコ | 剥離装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6099343B2 (ja) * | 2012-09-21 | 2017-03-22 | 株式会社ディスコ | 樹脂剥がし方法及び樹脂剥がし装置 |
JP2014067873A (ja) * | 2012-09-26 | 2014-04-17 | Nitto Denko Corp | 保護テープ剥離方法および保護テープ剥離装置 |
JP5977710B2 (ja) * | 2013-05-10 | 2016-08-24 | 東京エレクトロン株式会社 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
JP6120748B2 (ja) * | 2013-10-11 | 2017-04-26 | 東京エレクトロン株式会社 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
JP2017005158A (ja) * | 2015-06-12 | 2017-01-05 | 株式会社ディスコ | ウエーハの裏面研削方法 |
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JP2008051670A (ja) | 2006-08-25 | 2008-03-06 | Dainippon Printing Co Ltd | 樹脂膜割れ検出装置及び方法 |
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CN110034060B (zh) | 2024-02-20 |
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US10896830B2 (en) | 2021-01-19 |
TWI778206B (zh) | 2022-09-21 |
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