JP7016453B2 - 温度センサおよび温度センサの製造方法 - Google Patents

温度センサおよび温度センサの製造方法 Download PDF

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Publication number
JP7016453B2
JP7016453B2 JP2021539905A JP2021539905A JP7016453B2 JP 7016453 B2 JP7016453 B2 JP 7016453B2 JP 2021539905 A JP2021539905 A JP 2021539905A JP 2021539905 A JP2021539905 A JP 2021539905A JP 7016453 B2 JP7016453 B2 JP 7016453B2
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Japan
Prior art keywords
support film
temperature sensor
lead pattern
conduction pad
sensitive body
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Active
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JP2021539905A
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English (en)
Japanese (ja)
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JPWO2021145088A1 (https=
Inventor
大輔 荒野
守富 濱田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Electronics Co Ltd
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Shibaura Electronics Co Ltd
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Publication of JPWO2021145088A1 publication Critical patent/JPWO2021145088A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Ceramic Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Seats For Vehicles (AREA)
  • Chairs For Special Purposes, Such As Reclining Chairs (AREA)
JP2021539905A 2020-01-14 2020-12-03 温度センサおよび温度センサの製造方法 Active JP7016453B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020003591 2020-01-14
JP2020003591 2020-01-14
PCT/JP2020/045048 WO2021145088A1 (ja) 2020-01-14 2020-12-03 温度センサおよび温度センサの製造方法

Publications (2)

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JPWO2021145088A1 JPWO2021145088A1 (https=) 2021-07-22
JP7016453B2 true JP7016453B2 (ja) 2022-02-04

Family

ID=76864192

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JP2021539905A Active JP7016453B2 (ja) 2020-01-14 2020-12-03 温度センサおよび温度センサの製造方法

Country Status (5)

Country Link
US (1) US12148552B2 (https=)
JP (1) JP7016453B2 (https=)
CN (1) CN114846311B (https=)
DE (1) DE112020005485T5 (https=)
WO (1) WO2021145088A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7201767B1 (ja) * 2021-10-08 2023-01-10 株式会社芝浦電子 温度センサおよび温度センサの製造方法
JP1729419S (ja) * 2022-03-18 2022-11-09 温度センサ
DE102023112385A1 (de) 2023-05-11 2024-11-14 accensors GmbH Oberflächen aufklebbarer Temperatur-Foliensensor
DE102024120767B4 (de) * 2024-07-22 2026-02-12 Tdk Electronics Ag Sensorelement zur Temperaturmessung
WO2025217093A1 (en) * 2024-04-10 2025-10-16 Tekscan, Inc. Foldable sensor with anisotropic adhesive
DE102024004520A1 (de) * 2024-07-22 2026-01-22 Tdk Electronics Ag Sensorelement

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000266608A (ja) 1999-03-15 2000-09-29 Murata Mfg Co Ltd 温度センサ
JP2014070953A (ja) 2012-09-28 2014-04-21 Mitsubishi Materials Corp 温度センサ
CN108106750A (zh) 2017-12-20 2018-06-01 肇庆爱晟传感器技术有限公司 一种薄片型温度传感器及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537053A (en) * 1966-01-19 1970-10-27 Robertshaw Controls Co Flexible temperature sensor for motor protection
JPS54156584U (https=) 1978-04-24 1979-10-31
US4789850A (en) 1987-12-07 1988-12-06 Robertshaw Controls Company Temperature sensor construction and method of making the same
JPH08128901A (ja) 1994-10-31 1996-05-21 Sanyo Electric Co Ltd 温度センサーとパック電池
WO2013170685A1 (zh) * 2012-05-14 2013-11-21 深圳市敏杰电子科技有限公司 表面测温温度传感器
JP5896160B2 (ja) * 2012-09-28 2016-03-30 三菱マテリアル株式会社 温度センサ
JP6108156B2 (ja) * 2013-01-29 2017-04-05 三菱マテリアル株式会社 温度センサ
JP6256690B2 (ja) * 2014-02-26 2018-01-10 三菱マテリアル株式会社 非接触温度センサ
JP6536059B2 (ja) * 2015-02-09 2019-07-03 三菱マテリアル株式会社 湿度センサ
JP6497133B6 (ja) * 2015-03-03 2019-05-08 三菱マテリアル株式会社 温度センサ
WO2019087755A1 (ja) 2017-10-30 2019-05-09 Ｓｅｍｉｔｅｃ株式会社 温度センサ及び温度センサを備えた装置
US10782190B1 (en) * 2017-12-14 2020-09-22 University Of Rhode Island Board Of Trustees Resistance temperature detector (RTD) for ceramic matrix composites
US12146800B2 (en) * 2018-08-10 2024-11-19 Semitec Corporation Temperature sensor and device equipped with temperature sensor
US11408778B2 (en) * 2020-07-21 2022-08-09 Apple Inc. Temperature gradient sensing in portable electronic devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000266608A (ja) 1999-03-15 2000-09-29 Murata Mfg Co Ltd 温度センサ
JP2014070953A (ja) 2012-09-28 2014-04-21 Mitsubishi Materials Corp 温度センサ
CN108106750A (zh) 2017-12-20 2018-06-01 肇庆爱晟传感器技术有限公司 一种薄片型温度传感器及其制备方法

Also Published As

Publication number Publication date
CN114846311A (zh) 2022-08-02
US12148552B2 (en) 2024-11-19
US20230040761A1 (en) 2023-02-09
JPWO2021145088A1 (https=) 2021-07-22
DE112020005485T5 (de) 2022-09-08
CN114846311B (zh) 2025-03-04
WO2021145088A1 (ja) 2021-07-22

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