DE112020005485T5 - Temperatursensor und Verfahren zur Herstellung eines Temperatursensors - Google Patents

Temperatursensor und Verfahren zur Herstellung eines Temperatursensors Download PDF

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Publication number
DE112020005485T5
DE112020005485T5 DE112020005485.3T DE112020005485T DE112020005485T5 DE 112020005485 T5 DE112020005485 T5 DE 112020005485T5 DE 112020005485 T DE112020005485 T DE 112020005485T DE 112020005485 T5 DE112020005485 T5 DE 112020005485T5
Authority
DE
Germany
Prior art keywords
substrate
conductive pad
temperature sensor
electrically connected
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020005485.3T
Other languages
German (de)
English (en)
Inventor
Daisuke Arano
Morihasa Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHIBAURA ELECTRONICS CO., LTD., JP
Original Assignee
Shibaura Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Electronics Co Ltd filed Critical Shibaura Electronics Co Ltd
Publication of DE112020005485T5 publication Critical patent/DE112020005485T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Ceramic Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Seats For Vehicles (AREA)
  • Chairs For Special Purposes, Such As Reclining Chairs (AREA)
DE112020005485.3T 2020-01-14 2020-12-03 Temperatursensor und Verfahren zur Herstellung eines Temperatursensors Pending DE112020005485T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020003591 2020-01-14
JP2020-003591 2020-01-14
PCT/JP2020/045048 WO2021145088A1 (ja) 2020-01-14 2020-12-03 温度センサおよび温度センサの製造方法

Publications (1)

Publication Number Publication Date
DE112020005485T5 true DE112020005485T5 (de) 2022-09-08

Family

ID=76864192

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112020005485.3T Pending DE112020005485T5 (de) 2020-01-14 2020-12-03 Temperatursensor und Verfahren zur Herstellung eines Temperatursensors

Country Status (5)

Country Link
US (1) US12148552B2 (https=)
JP (1) JP7016453B2 (https=)
CN (1) CN114846311B (https=)
DE (1) DE112020005485T5 (https=)
WO (1) WO2021145088A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023112385A1 (de) 2023-05-11 2024-11-14 accensors GmbH Oberflächen aufklebbarer Temperatur-Foliensensor

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7201767B1 (ja) * 2021-10-08 2023-01-10 株式会社芝浦電子 温度センサおよび温度センサの製造方法
JP1729419S (ja) * 2022-03-18 2022-11-09 温度センサ
DE102024120767B4 (de) * 2024-07-22 2026-02-12 Tdk Electronics Ag Sensorelement zur Temperaturmessung
WO2025217093A1 (en) * 2024-04-10 2025-10-16 Tekscan, Inc. Foldable sensor with anisotropic adhesive
DE102024004520A1 (de) * 2024-07-22 2026-01-22 Tdk Electronics Ag Sensorelement

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08128901A (ja) 1994-10-31 1996-05-21 Sanyo Electric Co Ltd 温度センサーとパック電池
JP6606308B2 (ja) 2017-10-30 2019-11-13 Ｓｅｍｉｔｅｃ株式会社 温度センサ及び温度センサを備えた装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537053A (en) * 1966-01-19 1970-10-27 Robertshaw Controls Co Flexible temperature sensor for motor protection
JPS54156584U (https=) 1978-04-24 1979-10-31
US4789850A (en) 1987-12-07 1988-12-06 Robertshaw Controls Company Temperature sensor construction and method of making the same
JP2000266608A (ja) 1999-03-15 2000-09-29 Murata Mfg Co Ltd 温度センサ
WO2013170685A1 (zh) * 2012-05-14 2013-11-21 深圳市敏杰电子科技有限公司 表面测温温度传感器
JP5896160B2 (ja) * 2012-09-28 2016-03-30 三菱マテリアル株式会社 温度センサ
JP5939396B2 (ja) 2012-09-28 2016-06-22 三菱マテリアル株式会社 温度センサ
JP6108156B2 (ja) * 2013-01-29 2017-04-05 三菱マテリアル株式会社 温度センサ
JP6256690B2 (ja) * 2014-02-26 2018-01-10 三菱マテリアル株式会社 非接触温度センサ
JP6536059B2 (ja) * 2015-02-09 2019-07-03 三菱マテリアル株式会社 湿度センサ
JP6497133B6 (ja) * 2015-03-03 2019-05-08 三菱マテリアル株式会社 温度センサ
US10782190B1 (en) * 2017-12-14 2020-09-22 University Of Rhode Island Board Of Trustees Resistance temperature detector (RTD) for ceramic matrix composites
CN108106750B (zh) 2017-12-20 2020-05-19 肇庆爱晟传感器技术有限公司 一种薄片型温度传感器及其制备方法
US12146800B2 (en) * 2018-08-10 2024-11-19 Semitec Corporation Temperature sensor and device equipped with temperature sensor
US11408778B2 (en) * 2020-07-21 2022-08-09 Apple Inc. Temperature gradient sensing in portable electronic devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08128901A (ja) 1994-10-31 1996-05-21 Sanyo Electric Co Ltd 温度センサーとパック電池
JP6606308B2 (ja) 2017-10-30 2019-11-13 Ｓｅｍｉｔｅｃ株式会社 温度センサ及び温度センサを備えた装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023112385A1 (de) 2023-05-11 2024-11-14 accensors GmbH Oberflächen aufklebbarer Temperatur-Foliensensor

Also Published As

Publication number Publication date
CN114846311A (zh) 2022-08-02
US12148552B2 (en) 2024-11-19
US20230040761A1 (en) 2023-02-09
JPWO2021145088A1 (https=) 2021-07-22
JP7016453B2 (ja) 2022-02-04
CN114846311B (zh) 2025-03-04
WO2021145088A1 (ja) 2021-07-22

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R081 Change of applicant/patentee

Owner name: SHIBAURA ELECTRONICS CO., LTD., JP

Free format text: FORMER OWNER: SHIBAURA ELECTRONICS CO., LTD., SAITAMA-SHI, JP

R002 Refusal decision in examination/registration proceedings