CN114846311B - 温度传感器及温度传感器的制造方法 - Google Patents

温度传感器及温度传感器的制造方法 Download PDF

Info

Publication number
CN114846311B
CN114846311B CN202080089137.2A CN202080089137A CN114846311B CN 114846311 B CN114846311 B CN 114846311B CN 202080089137 A CN202080089137 A CN 202080089137A CN 114846311 B CN114846311 B CN 114846311B
Authority
CN
China
Prior art keywords
conductive pad
temperature sensor
support film
supporting film
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080089137.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN114846311A (zh
Inventor
荒野大辅
滨田守富
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Electronics Co Ltd
Original Assignee
Shibaura Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Electronics Co Ltd filed Critical Shibaura Electronics Co Ltd
Publication of CN114846311A publication Critical patent/CN114846311A/zh
Application granted granted Critical
Publication of CN114846311B publication Critical patent/CN114846311B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Ceramic Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Seats For Vehicles (AREA)
  • Chairs For Special Purposes, Such As Reclining Chairs (AREA)
CN202080089137.2A 2020-01-14 2020-12-03 温度传感器及温度传感器的制造方法 Active CN114846311B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020003591 2020-01-14
JP2020-003591 2020-01-14
PCT/JP2020/045048 WO2021145088A1 (ja) 2020-01-14 2020-12-03 温度センサおよび温度センサの製造方法

Publications (2)

Publication Number Publication Date
CN114846311A CN114846311A (zh) 2022-08-02
CN114846311B true CN114846311B (zh) 2025-03-04

Family

ID=76864192

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080089137.2A Active CN114846311B (zh) 2020-01-14 2020-12-03 温度传感器及温度传感器的制造方法

Country Status (5)

Country Link
US (1) US12148552B2 (https=)
JP (1) JP7016453B2 (https=)
CN (1) CN114846311B (https=)
DE (1) DE112020005485T5 (https=)
WO (1) WO2021145088A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7201767B1 (ja) * 2021-10-08 2023-01-10 株式会社芝浦電子 温度センサおよび温度センサの製造方法
JP1729419S (ja) * 2022-03-18 2022-11-09 温度センサ
DE102023112385A1 (de) 2023-05-11 2024-11-14 accensors GmbH Oberflächen aufklebbarer Temperatur-Foliensensor
DE102024120767B4 (de) * 2024-07-22 2026-02-12 Tdk Electronics Ag Sensorelement zur Temperaturmessung
WO2025217093A1 (en) * 2024-04-10 2025-10-16 Tekscan, Inc. Foldable sensor with anisotropic adhesive
DE102024004520A1 (de) * 2024-07-22 2026-01-22 Tdk Electronics Ag Sensorelement

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4789850A (en) * 1987-12-07 1988-12-06 Robertshaw Controls Company Temperature sensor construction and method of making the same
JP2014070953A (ja) * 2012-09-28 2014-04-21 Mitsubishi Materials Corp 温度センサ

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537053A (en) * 1966-01-19 1970-10-27 Robertshaw Controls Co Flexible temperature sensor for motor protection
JPS54156584U (https=) 1978-04-24 1979-10-31
JPH08128901A (ja) 1994-10-31 1996-05-21 Sanyo Electric Co Ltd 温度センサーとパック電池
JP2000266608A (ja) 1999-03-15 2000-09-29 Murata Mfg Co Ltd 温度センサ
WO2013170685A1 (zh) * 2012-05-14 2013-11-21 深圳市敏杰电子科技有限公司 表面测温温度传感器
JP5896160B2 (ja) * 2012-09-28 2016-03-30 三菱マテリアル株式会社 温度センサ
JP6108156B2 (ja) * 2013-01-29 2017-04-05 三菱マテリアル株式会社 温度センサ
JP6256690B2 (ja) * 2014-02-26 2018-01-10 三菱マテリアル株式会社 非接触温度センサ
JP6536059B2 (ja) * 2015-02-09 2019-07-03 三菱マテリアル株式会社 湿度センサ
JP6497133B6 (ja) * 2015-03-03 2019-05-08 三菱マテリアル株式会社 温度センサ
WO2019087755A1 (ja) 2017-10-30 2019-05-09 Ｓｅｍｉｔｅｃ株式会社 温度センサ及び温度センサを備えた装置
US10782190B1 (en) * 2017-12-14 2020-09-22 University Of Rhode Island Board Of Trustees Resistance temperature detector (RTD) for ceramic matrix composites
CN108106750B (zh) 2017-12-20 2020-05-19 肇庆爱晟传感器技术有限公司 一种薄片型温度传感器及其制备方法
US12146800B2 (en) * 2018-08-10 2024-11-19 Semitec Corporation Temperature sensor and device equipped with temperature sensor
US11408778B2 (en) * 2020-07-21 2022-08-09 Apple Inc. Temperature gradient sensing in portable electronic devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4789850A (en) * 1987-12-07 1988-12-06 Robertshaw Controls Company Temperature sensor construction and method of making the same
JP2014070953A (ja) * 2012-09-28 2014-04-21 Mitsubishi Materials Corp 温度センサ

Also Published As

Publication number Publication date
CN114846311A (zh) 2022-08-02
US12148552B2 (en) 2024-11-19
US20230040761A1 (en) 2023-02-09
JPWO2021145088A1 (https=) 2021-07-22
DE112020005485T5 (de) 2022-09-08
JP7016453B2 (ja) 2022-02-04
WO2021145088A1 (ja) 2021-07-22

Similar Documents

Publication Publication Date Title
CN114846311B (zh) 温度传感器及温度传感器的制造方法
CN103282754B (zh) 温度传感器及温度传感器安装结构
US20160370210A1 (en) Modular flexible sensor array
JP6842600B2 (ja) 温度センサ及び温度センサを備えた装置
JP2009289770A (ja) 抵抗器
KR20200020951A (ko) 공간 온도 프로파일을 검출하기 위한 센서 및 센서 유닛을 제조하기 위한 방법
CN101978249A (zh) 膜传感器和用于制造膜传感器的方法
KR101632679B1 (ko) 개별 전자 컴포넌트를 어셈블링하고 패키징하는 방법
JP4586413B2 (ja) 燃料電池
JPWO2017010216A1 (ja) 電子部品
WO2023276518A1 (ja) 温度センサー
JP2004031147A (ja) 温度検知器付き面状発熱体
JPS5849812B2 (ja) 温度センサ−の製造方法
WO2021220540A1 (ja) 温度センサアレイおよびその取付構造体
US11895776B2 (en) Flexible printed wiring board, joined body, pressure sensor and mass flow controller
JP2004319703A (ja) リジット基板とフレキシブル基板との電極接続構造
JP2004219123A (ja) 測温用プローブ
CN117940748B (zh) 温度传感器及温度传感器的制造方法
CN116608898A (zh) 一种温度压力感测片的制作方法以及温度压力感测片
WO2023032991A1 (ja) ヒータおよびヘアアイロン
US20070159341A1 (en) Packaging structure for radio frequency identification devices
CN112514064B (zh) 电路结构体
WO2016017283A1 (ja) 温度検知装置および電子機器
JP2014060463A (ja) チップ抵抗器およびその製造方法
JP2719315B2 (ja) カード装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant