JP7015638B2 - 加工液供給装置 - Google Patents
加工液供給装置 Download PDFInfo
- Publication number
- JP7015638B2 JP7015638B2 JP2017031800A JP2017031800A JP7015638B2 JP 7015638 B2 JP7015638 B2 JP 7015638B2 JP 2017031800 A JP2017031800 A JP 2017031800A JP 2017031800 A JP2017031800 A JP 2017031800A JP 7015638 B2 JP7015638 B2 JP 7015638B2
- Authority
- JP
- Japan
- Prior art keywords
- additive
- weight
- storage container
- flow path
- injected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
- B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F1/00—Preventing the formation of electrostatic charges
Description
2 加工液供給装置
20 液体供給源
26 貯留容器
27 注入ポンプ
31、35 流路
40 重量測定手段
41 判断手段
42 警告手段
A 添加剤
Claims (2)
- 一端が液体供給源に接続され他端がウエーハを切削する切削装置に接続された流路に流れる純水となる液体に添加される帯電防止用の添加剤を収容する貯留容器と、該流路に該貯留容器の該添加剤を注入する注入ポンプと、を備える加工液供給装置であって、
該流路内に該液体が流れ該添加剤が注入される間、所定間隔で該貯留容器の重量を測定して電気信号に変換する重量測定手段と、
該重量測定手段からの該電気信号を受信して、該貯留容器の該重量の測定値が所定比率で減少しているか否かを判断する判断手段と、
該判断手段が該重量の測定値が該所定比率で減少していないと判断した場合には注入不良であると警告を発する警告手段と、
を備える加工液供給装置。 - 該判断手段は、所定時間毎に複数の該重量の測定値に基づいて最小二乗法を用いて一次関数直線の傾斜角度を算出し、減少する比率である該傾斜角度が所定範囲外となった場合に該所定比率で減少していないと判断する、請求項1記載の加工液供給装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017031800A JP7015638B2 (ja) | 2017-02-23 | 2017-02-23 | 加工液供給装置 |
SG10201801169SA SG10201801169SA (en) | 2017-02-23 | 2018-02-12 | Processing liquid supplying apparatus |
CN201810144376.8A CN108511367B (zh) | 2017-02-23 | 2018-02-12 | 加工液提供装置 |
KR1020180018726A KR102342128B1 (ko) | 2017-02-23 | 2018-02-14 | 가공액 공급 장치 |
MYPI2018700624A MY189804A (en) | 2017-02-23 | 2018-02-15 | Processing liquid supplying apparatus |
US15/901,090 US10751903B2 (en) | 2017-02-23 | 2018-02-21 | Processing liquid supplying apparatus |
DE102018202621.1A DE102018202621A1 (de) | 2017-02-23 | 2018-02-21 | Zufuhrvorrichtung für eine Bearbeitungsflüssigkeit |
TW107105798A TWI735745B (zh) | 2017-02-23 | 2018-02-21 | 加工液供給裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017031800A JP7015638B2 (ja) | 2017-02-23 | 2017-02-23 | 加工液供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018134714A JP2018134714A (ja) | 2018-08-30 |
JP7015638B2 true JP7015638B2 (ja) | 2022-02-03 |
Family
ID=63046149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017031800A Active JP7015638B2 (ja) | 2017-02-23 | 2017-02-23 | 加工液供給装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10751903B2 (ja) |
JP (1) | JP7015638B2 (ja) |
KR (1) | KR102342128B1 (ja) |
DE (1) | DE102018202621A1 (ja) |
MY (1) | MY189804A (ja) |
SG (1) | SG10201801169SA (ja) |
TW (1) | TWI735745B (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003282499A (ja) | 2001-11-12 | 2003-10-03 | Samsung Electronics Co Ltd | 化学的機械的研磨設備のスラリ供給装置及び方法 |
JP2008030153A (ja) | 2006-07-28 | 2008-02-14 | Disco Abrasive Syst Ltd | 切削装置 |
JP2015023107A (ja) | 2013-07-18 | 2015-02-02 | Towa株式会社 | 電子部品製造用の切削装置及び切削方法 |
JP2016165771A (ja) | 2015-03-10 | 2016-09-15 | 株式会社ディスコ | 加工液循環型加工システム |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4778450A (en) * | 1979-07-12 | 1988-10-18 | Baxter Travenol Laboratories, Inc. | Fluid flow control system |
US4411649A (en) * | 1979-07-12 | 1983-10-25 | Baxter Travenol Laboratories, Inc. | Fluid flow control system |
JP2595985B2 (ja) * | 1987-08-28 | 1997-04-02 | 株式会社島津製作所 | 薬液注入用流量コントロール装置 |
JPH0386251A (ja) * | 1989-08-28 | 1991-04-11 | Todoroki Sangyo Kk | 化学反応制御装置 |
KR960001415A (ko) * | 1994-06-20 | 1996-01-25 | 김태구 | 자동차의 흡기다기관용 가변형 소음장치 |
US7770448B2 (en) * | 2005-09-16 | 2010-08-10 | Air Liquide Electronics U.S. LP. | Chemical storage device with integrated load cell |
CN106975117A (zh) * | 2011-09-21 | 2017-07-25 | 拜耳医药保健有限责任公司 | 连续的多流体泵装置、驱动和致动系统以及方法 |
JP6208498B2 (ja) | 2013-08-29 | 2017-10-04 | 株式会社ディスコ | 研磨パッドおよびウエーハの加工方法 |
-
2017
- 2017-02-23 JP JP2017031800A patent/JP7015638B2/ja active Active
-
2018
- 2018-02-12 SG SG10201801169SA patent/SG10201801169SA/en unknown
- 2018-02-14 KR KR1020180018726A patent/KR102342128B1/ko active IP Right Grant
- 2018-02-15 MY MYPI2018700624A patent/MY189804A/en unknown
- 2018-02-21 DE DE102018202621.1A patent/DE102018202621A1/de active Pending
- 2018-02-21 US US15/901,090 patent/US10751903B2/en active Active
- 2018-02-21 TW TW107105798A patent/TWI735745B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003282499A (ja) | 2001-11-12 | 2003-10-03 | Samsung Electronics Co Ltd | 化学的機械的研磨設備のスラリ供給装置及び方法 |
JP2008030153A (ja) | 2006-07-28 | 2008-02-14 | Disco Abrasive Syst Ltd | 切削装置 |
JP2015023107A (ja) | 2013-07-18 | 2015-02-02 | Towa株式会社 | 電子部品製造用の切削装置及び切削方法 |
JP2016165771A (ja) | 2015-03-10 | 2016-09-15 | 株式会社ディスコ | 加工液循環型加工システム |
Also Published As
Publication number | Publication date |
---|---|
KR20180097452A (ko) | 2018-08-31 |
DE102018202621A1 (de) | 2018-08-23 |
US10751903B2 (en) | 2020-08-25 |
KR102342128B1 (ko) | 2021-12-21 |
JP2018134714A (ja) | 2018-08-30 |
CN108511367A (zh) | 2018-09-07 |
US20180236684A1 (en) | 2018-08-23 |
MY189804A (en) | 2022-03-08 |
TW201832282A (zh) | 2018-09-01 |
SG10201801169SA (en) | 2018-09-27 |
TWI735745B (zh) | 2021-08-11 |
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