JP7012790B2 - ダイシングテープを用いてセラミック蛍光体プレートを発光デバイス(led)ダイ上に取り付ける方法、ダイシングテープを形成する方法、及びダイシングテープ - Google Patents
ダイシングテープを用いてセラミック蛍光体プレートを発光デバイス(led)ダイ上に取り付ける方法、ダイシングテープを形成する方法、及びダイシングテープ Download PDFInfo
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- JP7012790B2 JP7012790B2 JP2020124858A JP2020124858A JP7012790B2 JP 7012790 B2 JP7012790 B2 JP 7012790B2 JP 2020124858 A JP2020124858 A JP 2020124858A JP 2020124858 A JP2020124858 A JP 2020124858A JP 7012790 B2 JP7012790 B2 JP 7012790B2
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- MFSJSVNVUDQHLV-UHFFFAOYSA-N 2-(3-benzoylphenyl)propanoic acid Chemical compound OC(=O)C(C)C1=CC=CC(C(=O)C=2C=CC=CC=2)=C1.OC(=O)C(C)C1=CC=CC(C(=O)C=2C=CC=CC=2)=C1 MFSJSVNVUDQHLV-UHFFFAOYSA-N 0.000 description 1
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- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L33/005—Processes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68331—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
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- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- Computer Hardware Design (AREA)
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- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Led Device Packages (AREA)
- Dicing (AREA)
- Optical Filters (AREA)
Description
Claims (27)
- 蛍光体プレートのダイシング又は転写用のテープであって、
支持フィルムと、
前記支持フィルム上に配置された、アクリルを含まず且つ金属含有触媒を含まないホットメルト接着剤を有する粘着層であり、蛍光体プレートとの接着ボンドを形成するように構成された粘着層と、
を有するテープ。 - 前記粘着層は、白金、錫、又は亜鉛を有する金属含有触媒を含んでいない、請求項1に記載のテープ。
- 前記蛍光体プレートとの前記接着ボンドは弱められることができる、請求項1に記載のテープ。
- 前記蛍光体プレートとの前記接着ボンドは、前記粘着層をUV照射することによって弱められる、請求項3に記載のテープ。
- 前記粘着層は、前記粘着層がUV照射されるときに前記蛍光体プレートへの前記接着ボンドを弱めるように構成された光潜在性又は光開始性のアミン触媒を有する、請求項3に記載のテープ。
- 前記粘着層は、前記支持フィルムの第2の粘着層上に配置され、前記第2の粘着層はアクリルを有する、請求項1に記載のテープ。
- 請求項1乃至6のいずれか一項に記載のテープ上に、蛍光体プレートを、該蛍光体プレートと前記粘着層との間に接着ボンドが形成するように配置する、ことを有する方法。
- 前記テープから前記蛍光体プレートを取り外す、ことを有する請求項7に記載の方法。
- 支持フィルム上に粘着層を配置したテープを用意し、前記粘着層は、アクリルを含まず且つ金属含有触媒を含まないホットメルト接着剤を有し、
前記テープの前記粘着層上に、蛍光体プレートを、前記粘着層が該蛍光体プレートとの接着ボンドを形成するように配置する、
ことを有する方法。 - 前記テープから前記蛍光体プレートを取り外す、ことを有する請求項9に記載の方法。
- 前記粘着層は、白金、錫、又は亜鉛を有する金属含有触媒を含んでいない、請求項9に記載の方法。
- 前記蛍光体プレートを取り外す前に、前記蛍光体プレートとの前記接着ボンドを弱める、ことを有する請求項10に記載の方法。
- 前記蛍光体プレートとの前記接着ボンドを弱めるために、前記粘着層をUV照射する、ことを有する請求項12に記載の方法。
- 蛍光体プレートのダイシング又は転写用のテープを形成する方法であって、
支持フィルムを用意し、
前記支持フィルム上に、アクリルを含まず且つ金属含有触媒を含まないホットメルト接着剤を有する液体材料を付与し、
前記支持フィルムの上に前記液体材料をコーティングして、蛍光体プレートとの接着ボンドを形成するように構成された粘着層を形成する、
ことを有する方法。 - 前記粘着層をコーティングすることは、前記支持フィルムの上に前記液体材料をブレードコーティングすることを有する、請求項14に記載の方法。
- 前記粘着層をコーティングすることは、前記支持フィルムの上に前記液体材料をオーバーモールドすることを有する、請求項14に記載の方法。
- 前記液体材料を付与することは、ロールツーロールプロセスを用いて前記支持フィルムの上に前記液体材料を押し出すことを有する、請求項14に記載の方法。
- 前記液体材料は、前記粘着層がUV照射されるときに前記蛍光体プレートへの前記接着ボンドを弱めるように構成された光潜在性又は光開始性のアミン触媒を有する、請求項14に記載の方法。
- 前記粘着層をコーティングすることは、粘着フィルムを形成し、該粘着フィルムを前記支持フィルムの上にラミネートして前記粘着層を形成することを有する、請求項14に記載の方法。
- 前記粘着層は、白金、錫、又は亜鉛を有する金属含有触媒を含んでいない、請求項14に記載の方法。
- 蛍光体プレートのダイシング又は転写用のテープを形成する方法であって、
アクリルを有する第1の粘着層を有するテープを用意し、
前記テープ上に、アクリルを含まず且つ金属含有触媒を含まないホットメルト接着剤を有する液体材料を付与し、
前記液体材料を用いて前記テープ上に第2の粘着層を形成し、該第2の粘着層は、蛍光体プレートとの接着ボンドを形成するように構成される、
ことを有する方法。 - 前記第2の粘着層を形成することは、前記テープの上に前記液体材料をブレードコーティングすることを有する、請求項21に記載の方法。
- 前記第2の粘着層を形成することは、前記テープの上に前記液体材料をオーバーモールドすることを有する、請求項21に記載の方法。
- 前記第2の粘着層を形成することは、ロールツーロールプロセスを用いて前記テープの上に前記液体材料を押し出すことを有する、請求項21に記載の方法。
- 前記液体材料は、前記第2の粘着層がUV照射されるときに前記蛍光体プレートへの前記接着ボンドを弱めるように構成された光潜在性又は光開始性のアミン触媒を有する、請求項21に記載の方法。
- 前記液体材料は、前記第1の粘着層上に付与され、前記第2の粘着層は、前記テープの前記第1の粘着層の上に形成される、請求項21に記載の方法。
- 前記第2の粘着層は、白金、錫、又は亜鉛を有する金属含有触媒を含んでいない、請求項21に記載の方法。
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US201562129282P | 2015-03-06 | 2015-03-06 | |
US62/129,282 | 2015-03-06 |
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JP2020124858A Active JP7012790B2 (ja) | 2015-03-06 | 2020-07-22 | ダイシングテープを用いてセラミック蛍光体プレートを発光デバイス(led)ダイ上に取り付ける方法、ダイシングテープを形成する方法、及びダイシングテープ |
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Country Status (7)
Country | Link |
---|---|
US (2) | US10734543B2 (ja) |
EP (1) | EP3266048B1 (ja) |
JP (2) | JP6740236B2 (ja) |
KR (1) | KR102470834B1 (ja) |
CN (1) | CN108028292B (ja) |
TW (1) | TWI787147B (ja) |
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