JP7005553B2 - ビアホール構造を測定するための自動光学検査システム及びその方法 - Google Patents

ビアホール構造を測定するための自動光学検査システム及びその方法 Download PDF

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JP7005553B2
JP7005553B2 JP2019085771A JP2019085771A JP7005553B2 JP 7005553 B2 JP7005553 B2 JP 7005553B2 JP 2019085771 A JP2019085771 A JP 2019085771A JP 2019085771 A JP2019085771 A JP 2019085771A JP 7005553 B2 JP7005553 B2 JP 7005553B2
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light source
image
via hole
area
hole structure
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JP2020126035A (ja
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鄒嘉駿
林柏聰
黄冠勳
張▲すん▼豪
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由田新技股▲ふん▼有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0638—Refractive parts
    • G01N2201/0639—Sphere lens
JP2019085771A 2019-02-01 2019-04-26 ビアホール構造を測定するための自動光学検査システム及びその方法 Active JP7005553B2 (ja)

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TW108104333 2019-02-01
TW108104333A TWI724370B (zh) 2019-02-01 2019-02-01 用於量測孔狀結構的自動光學檢測系統以及方法

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JP2020126035A JP2020126035A (ja) 2020-08-20
JP7005553B2 true JP7005553B2 (ja) 2022-02-10

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JP (1) JP7005553B2 (zh)
KR (1) KR102230858B1 (zh)
CN (1) CN111521613B (zh)
TW (1) TWI724370B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI775274B (zh) * 2021-01-14 2022-08-21 欣興電子股份有限公司 電路板內介電層厚度之量測裝置及量測方法
KR102591614B1 (ko) * 2022-08-10 2023-10-19 배찬호 차량 부품용 홀 검사측정장치

Citations (7)

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JP2003294640A (ja) 2002-04-04 2003-10-15 Seiko Epson Corp 外観検査方法およびその装置
JP2006214859A (ja) 2005-02-03 2006-08-17 Matsushita Electric Ind Co Ltd 撮像装置
JP3139398U (ja) 2007-11-30 2008-02-14 株式会社金子電器製作所 表面撮影装置
JP2008249386A (ja) 2007-03-29 2008-10-16 Dainippon Screen Mfg Co Ltd 欠陥検査装置および欠陥検査方法
JP2014142339A (ja) 2012-12-31 2014-08-07 Djtech Co Ltd 検査装置
JP2015025656A (ja) 2011-09-29 2015-02-05 株式会社日立ハイテクノロジーズ 基板に形成された形状を計測するための装置
US20150103357A1 (en) 2012-12-18 2015-04-16 Joanna Schmit Signal sectioning for profiling printed-circuit-bord vias with vertical scanning interferometry

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JPH0572142A (ja) * 1991-09-13 1993-03-23 Fujitsu Ltd 導体粉末未充填の検出方法
JPH08178858A (ja) * 1994-12-26 1996-07-12 Nec Corp スルーホール検査装置
JPH1194762A (ja) * 1997-09-25 1999-04-09 Fujitsu Ltd ビア孔形状検査装置
JPH11271233A (ja) * 1998-03-25 1999-10-05 Fujitsu Ltd バイアホール検査装置
US7339661B2 (en) * 2002-09-30 2008-03-04 Doron Korngut Dark field inspection system
JP2004101533A (ja) * 2003-09-19 2004-04-02 Mitsubishi Electric Corp 積層材料の凹設部検査装置及びレーザ加工装置
CN101290090B (zh) * 2007-04-17 2011-09-21 财团法人工业技术研究院 检测系统的光源散射照明装置
IL188029A0 (en) * 2007-12-10 2008-11-03 Nova Measuring Instr Ltd Optical method and system
KR20120134806A (ko) * 2011-06-03 2012-12-12 삼성테크윈 주식회사 하이브리드 조명 모듈 및 이를 이용한 외관 검사 시스템
JP2014102208A (ja) * 2012-11-21 2014-06-05 Topcon Corp 外観検査装置、および外観検査方法
KR101590831B1 (ko) * 2013-04-02 2016-02-03 주식회사 고영테크놀러지 기판의 이물질 검사방법
TWM467872U (zh) * 2013-07-30 2013-12-11 Utechzone Co Ltd 光學檢查設備的取像系統
TWI487898B (zh) * 2014-01-13 2015-06-11 Machvision Inc 電路板之盲孔內缺陷的檢測設備、檢測系統及其檢測方法
TW201700966A (zh) * 2015-06-18 2017-01-01 Machvision Inc 印刷電路板之孔位資訊的檢測方法及檢測設備
TWI558976B (zh) * 2015-09-02 2016-11-21 久元電子股份有限公司 導電結構製造方法及盲孔關鍵尺寸資訊檢測方法
KR102592917B1 (ko) * 2016-08-26 2023-10-23 삼성전자주식회사 표면 검사 방법 및 반도체 소자의 제조 방법
JP6640057B2 (ja) * 2016-09-14 2020-02-05 株式会社日立ハイテクノロジーズ 電子顕微鏡装置及びそれを用いた傾斜ホールの測定方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003294640A (ja) 2002-04-04 2003-10-15 Seiko Epson Corp 外観検査方法およびその装置
JP2006214859A (ja) 2005-02-03 2006-08-17 Matsushita Electric Ind Co Ltd 撮像装置
JP2008249386A (ja) 2007-03-29 2008-10-16 Dainippon Screen Mfg Co Ltd 欠陥検査装置および欠陥検査方法
JP3139398U (ja) 2007-11-30 2008-02-14 株式会社金子電器製作所 表面撮影装置
JP2015025656A (ja) 2011-09-29 2015-02-05 株式会社日立ハイテクノロジーズ 基板に形成された形状を計測するための装置
US20150103357A1 (en) 2012-12-18 2015-04-16 Joanna Schmit Signal sectioning for profiling printed-circuit-bord vias with vertical scanning interferometry
JP2014142339A (ja) 2012-12-31 2014-08-07 Djtech Co Ltd 検査装置

Also Published As

Publication number Publication date
JP2020126035A (ja) 2020-08-20
TWI724370B (zh) 2021-04-11
TW202030454A (zh) 2020-08-16
CN111521613A (zh) 2020-08-11
CN111521613B (zh) 2023-09-29
KR102230858B1 (ko) 2021-03-22
KR20200096035A (ko) 2020-08-11

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